每年研究成果
每年研究成果
個人檔案
教育/學術資格
PhD, University of Illinois at Urbana-Champaign
指紋
查看啟用 Jack Yuan-Chen Sun 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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過去五年中的合作和熱門研究領域
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
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Breaking the Trade-Off Between Mobility and On–Off Ratio in Oxide Transistors
Chang, Y. C., Wang, S. T., Lee, Y. T., Huang, C. S., Hsu, C. H., Weng, T. T., Huang, C. C., Chen, C. W., Chou, T. T., Chang, C. Y., Woon, W. Y., Lin, C. L., Sun, J. Y. C. & Lien, D. H., 5 2月 2025, 於: Advanced Materials. 37, 5, 2413212.研究成果: Article › 同行評審
32 引文 斯高帕斯（Scopus） -
Roadmap on low-power electronics
Ramesh, R., Salahuddin, S., Datta, S., Diaz, C. H., Nikonov, D. E., Young, I. A., Ham, D., Chang, M. F., Khwa, W. S., Lele, A. S., Binek, C., Huang, Y. L., Sun, Y. C., Chu, Y. H., Prasad, B., Hoffmann, M., Hu, J. M., Yao, Z., Bellaiche, L. & Wu, P. 及其他15, , 1 9月 2024, 於: APL Materials. 12, 9, 099201.研究成果: Review article › 同行評審
開啟存取37 引文 斯高帕斯（Scopus） -
Demonstration of PtMn-based Field-free Switching SOT MRAM
Lin, C. P., Tseng, C. H., Yen, Y. S., Lai, C. H., Li, K. S., Shieh, J. M., Sun, J. Y. C., Wei, J. H. & Tang, D. D., 2023, 2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings).研究成果: Conference contribution › 同行評審
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Scalable Spin-to-Charge Conversion Effect in the Inverse Spin Hall Nanodevice
Lin, Y. L., Hsin, T. C., Wu, Y. H., Sun, J. Y. C. & Tseng, Y. C., 2023, 2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings).研究成果: Conference contribution › 同行評審
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Demonstration of High Endurance and Retention Spin-Transfer-Torque-Assisted Field-Free Perpendicular Spin-Orbit Torque Cells by an Etch-Stop-on-MgO Process
Tsou, Y. J., Chen, W. J., Liu, C. Y., Chen, Y. J., Li, K. S., Shieh, J. M., Liu, P. C., Chung, W. Y., Liu, C. W., Huang, S. Y., Wei, J. H., Tang, D. D. & Sun, J. Y. C., 1 10月 2022, 於: IEEE Electron Device Letters. 43, 10, p. 1661-1664 4 p.研究成果: Article › 同行評審
7 引文 斯高帕斯（Scopus）