每年專案
個人檔案
研究專長
理論物理、奈米元件、元件模擬
經歷
1994/1~2010/1 日本東芝公司研發中心ULSI Lab. 總公司研究員
2010/1~ 國立交通大學電機系 教授
教育/學術資格
PhD, 物理, University of Tsukuba
外部位置
指紋
查看啟用 Hiroshi Watanabe 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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過去五年中的合作和熱門研究領域
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料,或
專案
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Analysis of Dielectric Prebreakdown of High-κ Stacking Polycrystalline MIM by Stochastic Trap-Clusters Growing and Percolation-Based Transportation
Lin, H. J., Tamura, C., Akiyama, K., Nakamura, G., Nagai, H. & Watanabe, H., 1 9月 2023, 於: IEEE Transactions on Electron Devices. 70, 9, p. 4793-4799 7 p.研究成果: Article › 同行評審
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On coexistence of decentralized system (blockchain) and central management in Internet-of-Things
Watanabe, H., 2022, 2022 IEEE 1st Global Emerging Technology Blockchain Forum: Blockchain and Beyond, iGETblockchain 2022. Institute of Electrical and Electronics Engineers Inc., (2022 IEEE 1st Global Emerging Technology Blockchain Forum: Blockchain and Beyond, iGETblockchain 2022).研究成果: Conference contribution › 同行評審
開啟存取1 引文 斯高帕斯(Scopus) -
How can chip technology realize electronic sensing of viruses?
Watanabe, H. & Lee, C. A., 19 4月 2021, VLSI-TSA 2021 - 2021 International Symposium on VLSI Technology, Systems and Applications, Proceedings. Institute of Electrical and Electronics Engineers Inc., 9440116. (VLSI-TSA 2021 - 2021 International Symposium on VLSI Technology, Systems and Applications, Proceedings).研究成果: Conference contribution › 同行評審
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Impact on the Conductance Method of the Asymmetry in the AC Response Induced by Interface Trap Levels
Lin, H. J., Watanabe, H., Teramoto, A., Kuroda, R., Umezawa, K., Furukawa, K. & Sugawa, S., 4月 2021, 於: ECS Journal of Solid State Science and Technology. 10, 4, 043004.研究成果: Article › 同行評審
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Proof of Authenticity of Logistics Information with Passive RFID Tags and Blockchain
Watanabe, H., Saito, K., Miyazaki, S., Okada, T., Fukuyama, H., Kato, T. & Taniguchi, K., 2021, 2021 IEEE International Conference on Electronic Communications, Internet of Things and Big Data, ICEIB 2021. Meen, T.-H. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 213-216 4 p. (2021 IEEE International Conference on Electronic Communications, Internet of Things and Big Data, ICEIB 2021).研究成果: Conference contribution › 同行評審
開啟存取7 引文 斯高帕斯(Scopus)