按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
1992 …2023

每年研究成果

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Stillman G. E.

  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Elec. and Comp. Eng. Department
  • Univ. Illinois at Urbana-Champaign
  • CCEEL
  • Department of Materials Science and Engineering
  • Depament of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Liang Yan Kui

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Diaz C. H.

  • Advanced Device Technology Department
  • Taiwan Semiconductor Manufacturing Company
  • IEEE
  • Device Technology and Modeling Department
  • Research and Development
  • SBIP

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lin Y. C.

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • Department of Materials Science and Engineering
  • Institute of Materials Science and Engineering
  • Department of Material Science and Engineering
  • Nippon Telegraph & Telephone
  • Department of Electrical Engineering
  • Microelectronics and Information Systems Research Center
  • Taiwan Semiconductor Manufacturing Company
  • Integrated Interconnect and Packaging Division
  • Dept. of Matl. Sci. & Eng.

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Wu T. B.

  • National Tsing Hua University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department O Electronics Engineering
  • National Yang Ming Chiao Tung University
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Huang Mao Lin

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Huang Yi Shuo

  • National Yang Ming Chiao Tung University
  • International College of Semiconductor Technology

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Ma C. H.

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Kuo J. M.

  • Lucent
  • Rutgers - The State University of New Jersey, New Brunswick
  • Lucent Technologies
  • Multiplex Inc.
  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign
  • Rutgers University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Curtis A. P.

  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Elec. and Comp. Eng. Department
  • Dept. of Mat. Sci. and Engineering
  • CCEEL

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Friddle P. A.

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Physics and Materials Sci.
  • City University of Hong Kong

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Thomas S.

  • University of Illinois at Urbana-Champaign
  • Elec. and Comp. Eng. Department
  • CCEEL

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lu Chun Chieh

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Yeong Sai Hooi

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Yen B. M.

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Texas Instruments

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chen Meng Ku

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Hwang He Yong

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Jang Syun Ming

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Dee Chang Fu

  • Institute of Micronengineering and Nanoelectronics (IMEN)
  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • Universiti Kebangsaan Malaysia
  • Institute of Microengineering and Nanoelectronics
  • Institute of Microengineering and Nanoelectronics (IMEN)
  • Institute of Microengineering and Nanoelectronics
  • Institute of Microengineering and Nanoelectronics
  • Univ Kebangsaan Malaysia, Universiti Kebangsaan Malaysia, Inst Microengn & Nanoelect

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Wolbach W.

  • Department of Materials Science and Engineering
  • Northwestern University
  • The University of Chicago

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Moser B. C.

  • CCEEL
  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • RFMD Inc.

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chang Ya Ting

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chiang Chung Han

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lin Chang Hsien

  • National Applied Research Laboratories Taiwan
  • National Nano Device Laboratories Taiwan
  • National Nano Device Laboratories (NDL
  • Taiwan Semiconductor Manufacturing Company
  • Stanford University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lu Y.

  • Rutgers - The State University of New Jersey, New Brunswick
  • Electrical and Computer Engineering Department
  • United States Army Research Laboratory
  • Beijing Univ Technol, Beijing University of Technology, Inst Microstruct & Property Adv Mat
  • Rutgers University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lee K. Y.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Tzou An Jye

  • National Nano Device Laboratories Taiwan
  • Department of Photonics and Institute of Electro-Optical Engineering
  • National Yang Ming Chiao Tung University
  • Department of Electrophysics
  • Department of Photonics
  • Inst. of Electro-Optical Engineering
  • Department of Photonics
  • National Applied Research Laboratories Taiwan
  • Taiwan Semiconductor Research Institute

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chang Hui Chen

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Young Bo Feng

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lee Ching Ting

  • Yuan Ze University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Hsu Lung Hsing

  • Industrial Technology Research Institute Hsinchu
  • National Yang Ming Chiao Tung University
  • Academia Sinica - Research Center for Applied Science
  • Acad Sinica, Academia Sinica - Taiwan, Res Ctr Appl Sci

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Marks L. D.

  • Department of Materials Science and Engineering
  • Northwestern University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Dutta M.

  • Electronics and Power Sources Directorate
  • United States Army Research Laboratory
  • Rutgers - The State University of New Jersey, New Brunswick
  • U.S. Army ETDL
  • Rutgers University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Jang Simon M.

  • Taiwan Semiconductor Manufacturing Company
  • Research and Development
  • SBIP

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Langpoklakpam Catherine

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Huang Jia Hong

  • Department of Engineering and System Science
  • National Tsing Hua University
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • National Taiwan University of Science and Technology
  • Department of Materials Science and Engineering
  • Department of Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Kuo Hao Chung

  • Hon Hai Research Institute
  • National Yang Ming Chiao Tung University
  • Hon Hai Research Institute
  • Hon Hai Precision Industry

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Yeo Y. C.

  • National University of Singapore
  • Silicon Nano Device Laboratory
  • University of California at Berkeley
  • Department of Electrical Engineering and Computer Science
  • Taiwan Semiconductor Manufacturing Company
  • Department of EECS
  • Department of Electrical Engineering and Computer Sciences
  • Agency for Science, Technology and Research, Singapore
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Silicon Nano Device Lab.
  • Department of Materials Science and Engineering
  • Silicon Nano Device Lab (SNDL)
  • Department of Electrical Engineering and Computer Science
  • IEEE
  • Technology
  • Department of Electrical Engineering and Computer Sciences
  • Silicon Nano Devices Laboratory
  • Department of Electrical Engineering
  • Silicon Nana Device Lab (SNDL)
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chu Chun Lin

  • National Nano Device Laboratories Taiwan
  • Department of Electrical Engineering
  • National Taiwan University
  • Natl Appl Res Labs, National Applied Research Laboratories - Taiwan, Natl Nano Device Labs
  • Taiwan Semiconductor Manufacture Co.
  • National Applied Research Laboratories Taiwan
  • NARL

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lee C. T.

  • Institute of Optical Sciences
  • National Central University
  • Institute of Microelectronics
  • National Cheng Kung University
  • Yuan Ze University
  • Department of Photonics Engineering
  • Department of Electrical Engineering
  • Institute of Microelectronics
  • Institute of Microelectronics
  • Department of Material Science and Engineering
  • National Yang Ming Chiao Tung University
  • Institute of Microelectronics
  • Department of Electrical Engineering
  • Institute of Optical Sciences
  • Institute of Optical Sciences

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lin Hung Ta

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chen Z. C.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lin L. T.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Levi-Setti R.

  • Department of Materials Science and Engineering
  • Northwestern University
  • The University of Chicago

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Peng Li Chi

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chen Yu

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lee Yao Jen

  • NARL

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Horton T.

  • University of Illinois at Urbana-Champaign
  • Elec. and Comp. Eng. Department
  • Dept. of Mat. Sci. and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chang S. W.

  • Taiwan Semiconductor Manufacturing Company
  • TSMC R and D Europe B.V.

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Huang Yu Wen

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Eades J. A.

  • Department of Materials Science and Engineering
  • Northwestern University
  • Department of Metallurgy and Mining Engineering
  • University of Illinois at Urbana-Champaign

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Tu Po Tsung

  • Industrial Technology Research Institute Hsinchu
  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Shen H.

  • United States Army Research Laboratory
  • Electronics and Power Sources Directorate
  • Rutgers - The State University of New Jersey, New Brunswick
  • U.S. Army ETDL
  • Rutgers University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lin Yu Ming

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chang Wei Yuan

  • NARL

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Wu W. F.

  • National Nano Device Laboratories Taiwan
  • National Yang Ming Chiao Tung University
  • Hsinchu
  • Taiwan Semicond Res Inst
  • Taiwan Semiconductor Manufacture Co.
  • National Applied Research Laboratories Taiwan
  • NARL
  • National Tsing Hua University
  • Taiwan Semiconductor Research Institute
  • Taiwan Semiconductor Research Institute
  • Taiwan Semiconductor Research Institute

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Li D. J.

  • Department of Materials Science and Engineering
  • Northwestern University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Yang Q.

  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign
  • Univ. Illinois at Urbana-Champaign

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chen Shih Chen

  • Hon Hai Research Institute
  • Hon Hai Precision Industry

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Luc Quang Ho

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • International College of Semiconductor Technology

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lin Jing Wei

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Luo G. L.

  • National Nano Device Laboratories Taiwan
  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • Microelectronics and Information Systems Research Center
  • National Applied Research Laboratories Taiwan
  • Department O Electronics Engineering
  • Hsinchu
  • Information Systems Research Center
  • Nano Device Laboratory
  • Hsinchu Science Park
  • Hsinchu Science Park
  • Taiwan Semiconductor Research Institute
  • Taiwan Semiconductor Manufacture Co.
  • NARL
  • Taiwan Semiconductor Research Institute

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Khaderbad M. A.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Trinh Hai Dang

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • Department of Materials Science and Engineering
  • Department of Physics
  • Hanoi National University of Education
  • Taiwan Semiconductor Manufacturing Company
  • Department of Material Science and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chen B. Y.

  • National Nano Device Laboratories Taiwan
  • Hsinchu
  • Taiwan Semiconductor Research Institute
  • Taiwan Semiconductor Research Institute
  • Taiwan Semiconductor Manufacture Co.
  • National Applied Research Laboratories Taiwan
  • National Yang Ming Chiao Tung University
  • NARL
  • Taiwan Semiconductor Research Institute

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Feng M.

  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Elec. and Comp. Eng. Department
  • Univ. Illinois at Urbana-Champaign
  • CCEEL
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chang Hui Cheng

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chabala J. M.

  • Department of Materials Science and Engineering
  • Northwestern University
  • The University of Chicago

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Pamulapati Jagadeesh

  • Center for High-Frequency Microelectronics
  • University of Michigan, Ann Arbor
  • Electronics and Power Sources Directorate
  • United States Army Research Laboratory
  • Rutgers - The State University of New Jersey, New Brunswick
  • U.S. Army ETDL
  • Rutgers University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Wang H. C.H.

  • Taiwan Semiconductor Manufacturing Company
  • National Taichung University of Science and Technology

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chen Y. Y.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Wang Shin Yuan

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • Department of Electrical Engineering
  • Dept. of Electronics Engineering
  • Department of Electronics Engineering and Institute of Electronics
  • Institute of Electronics
  • Natl Chiao Tung Univ, National Chiao Tung University, Coll Elect & Comp Engn, Inst Electroopt Engn
  • National Applied Research Laboratories Taiwan

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Kim Young

  • Department of Metallurgy and Mining Engineering
  • University of Illinois at Urbana-Champaign

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Ko Hua Lun

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Li J.

  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Teng Chih Yu

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Shih Yu Chuan

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Huang Huai Ying

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Bishop S. G.

  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Elec. and Comp. Eng. Department

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lee Wen Chin

  • University of California at Berkeley
  • IEEE
  • Intel
  • Taiwan Semiconductor Manufacturing Company
  • Department of Electrical Engineering
  • Advanced Micro Devices
  • Strategie Technology Group
  • Department of EECS
  • Hitachi, Ltd.
  • Exploratory Research Division
  • Department of Electrical Engineering and Computer Science
  • Dept. of Elec. Eng./Comp. Sciences
  • Department of Electrical Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Peng Chun Yen

  • Department of Electrical Engineering
  • National Taiwan University
  • Institute of Photonics and Optoelectronics
  • Hon Hai Research Institute
  • Hon Hai Research Institute
  • Hon Hai Precision Industry

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Batzer R. S.

  • Semiconduct. Prod. Grp./Qual. R.
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Intel

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Kakushima Kuniyuki

  • Department of Electronics and Applied Physics
  • Tokyo Institute of Technology
  • Interdisciplinary Graduate School of Sci. and Eng.
  • Interdisciplinary Graduate School of Science and Technology
  • Department of Physical Electronics
  • The University of Tokyo
  • CSIR - Indian Institute of Chemical Technology
  • Frontier Collaborative Research Center
  • Université Grenoble Alpes
  • The Electrochemical Society
  • Kyoto University
  • CSIR - National Physical Laboratory
  • IMEP (UMR CNRS-INPG-UJF) ENSERG

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Vellianitis G.

  • TSMC
  • TSMC R and D Europe B.V.

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Hong Yu Heng

  • Department of Photonics and Institute of Electro-Optical Engineering
  • National Yang Ming Chiao Tung University
  • Department of Photonics
  • Natl Chiao Tung Univ, National Yang Ming Chiao Tung University, Coll Elect & Comp Engn, Grad Inst Electroopt Engn
  • Hon Hai Research Institute
  • Hon Hai Precision Industry

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Malin J. I.

  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Tsai Pang Yan

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Boldt C.

  • Department of Materials Science and Engineering
  • Northwestern University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lin Yu Ming

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Liu H. C.

  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Inst. for Microstructural Sciences
  • National Research Council of Canada
  • Inst. of Microstructural Sciences
  • Institute for Microstructural Sciences

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chang Y. S.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Cheng Yuh Jen

  • Academia Sinica - Research Center for Applied Science
  • Department of Electro-Optical Engineering
  • National Yang Ming Chiao Tung University
  • Department of Photonics
  • Research Center for Applied Sciences
  • Department of Photonic
  • Department of Electrical Engineering
  • Department of Photonics and Institute of Electro-Optical Engineering
  • Department of Photonics
  • Department of Photonics
  • Department of Photonics
  • Research Center for Applied Sciences
  • Department of Photonics
  • Department of Photonics
  • Department of Photonics
  • Department of Photonics
  • Acad Sinica, Academia Sinica - Taiwan, Res Ctr Appl Sci

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Astromskas G.

  • TSMC

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Tsai P. Y.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Hsu Wei Chou

  • Institute of Microelectronics
  • National Cheng Kung University
  • Institute of Microelectronics
  • Institute of Microelectronics
  • Advanced Optoelectronic Technology Center
  • Department of Electrical Engineering
  • Institute of Microelectronics
  • Department of Electrical Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Fang W.

  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Ramvall P.

  • Lund University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Ren Fan

  • Department of Chemical Engineering
  • University of Florida
  • Department of Chemical Engineering
  • Lucent
  • Department of Chemical Engineering
  • Multiplex Inc.

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Ahmari D.

  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Weng You Chen

  • National Yang Ming Chiao Tung University
  • Institute of Lighting and Energy Photonics

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Sung P. J.

  • Department of Electrophysics
  • National Nano Device Laboratories Taiwan
  • National Yang Ming Chiao Tung University
  • National Applied Research Laboratories Taiwan
  • Hsinchu
  • Scientific
  • Taiwan Semiconductor Research Institute
  • Taiwan Semiconductor Research Institute
  • Taiwan Semiconductor Manufacture Co.
  • Taiwan Semiconductor Research Institute
  • Taiwan Semiconductor Research Institute
  • NARL

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Hamzah Azrul Azlan

  • Universiti Kebangsaan Malaysia
  • Institute of Micronengineering and Nanoelectronics (IMEN)
  • Univ Kebangsaan Malaysia, Universiti Kebangsaan Malaysia, Inst Microengn & Nanoelect

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Ren F.

  • Rutgers - The State University of New Jersey, New Brunswick
  • Rutgers University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Fan C. H.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Su Chun-Jung

  • Taiwan Semiconductor Research Institute

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Anandan Deepak

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Norton T. U.

  • CCEEL
  • University of Illinois at Urbana-Champaign

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Panda Debashis

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Ahmet P.

  • Frontier Research Center
  • Tokyo Institute of Technology
  • Department of Electronics and Applied Physics
  • Frontier Collaborative Research Center
  • The Electrochemical Society

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lin H. J.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Passlack M.

  • TSMC
  • TSMC R and D Europe B.V.

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Hartmann Q. J.

  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Liu Ching Yao

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Wu Jui-Sheng

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Liu An Chen

  • National Yang Ming Chiao Tung University
  • Natl Chiao Tung Univ, National Yang Ming Chiao Tung University, Coll Elect & Comp Engn, Grad Inst Electroopt Engn

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Tsai M. H.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chu R. L.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chen Shih Hong

  • Taiwan Semiconductor Manufacture Co.
  • National Applied Research Laboratories Taiwan
  • NARL

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Cheng J. Y.

  • Rutgers - The State University of New Jersey, New Brunswick
  • Rutgers University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Tang Li Chuan

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lee T. L.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lin Wei Cheng

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Daga A.

  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Department of Materials Science

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chen Shih Chen

  • Hon Hai Precision Industry

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Taysing-Lara M.

  • Electronics and Power Sources Directorate
  • United States Army Research Laboratory
  • Rutgers - The State University of New Jersey, New Brunswick
  • Rutgers University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chen Jun Da

  • Hon Hai Research Institute

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Mazumder J.

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Ctr. for Laser-Aided Mat. Processing
  • Center for Laser-Aided Material Processing

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Plass R.

  • Department of Materials Science and Engineering
  • Northwestern University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Su C. J.

  • National Nano Device Laboratories Taiwan
  • Department of Electrical Engineering
  • National Yang Ming Chiao Tung University
  • Institute of Electronics
  • Department of Electronics Engineering and Institute of Electronics
  • Nano Facility Center
  • Institute of Electronics
  • Hsinchu
  • Department O Electronics Engineering
  • Department of Electrical Engineering
  • IEEE
  • Taiwan Semiconductor Research Institute
  • Taiwan Semiconductor Research Institute
  • National Applied Research Laboratories Taiwan
  • Taiwan Semicond Res Inst
  • Taiwan Semiconductor Research Institute
  • Taiwan Semiconductor Research Institute
  • Taiwan Semiconductor Manufacture Co.
  • Taiwan Semiconductor Research Institute
  • University of Houston

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Turnbull D.

  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Oxland R.

  • TSMC
  • TSMC R and D Europe B.V.

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lind E.

  • Lund University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Nguyen Hoang Tan Ngoc

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Hsia H.

  • Univ. Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • CCEEL
  • Department of Materials Science and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Oniki Y.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Gibson J. M.

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Holland M. C.

  • TSMC

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Mayo W. E.

  • Dept. of Mechanics and Mat. Science
  • Rutgers - The State University of New Jersey, New Brunswick
  • Lucent
  • Department of Chemical Engineering
  • University of Florida
  • Rutgers University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Nagarajan Venkatesan

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • Hexawave, Inc.

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lee Tze Liang

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Yang Tsung Ying

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Wang Y. C.

  • Rutgers - The State University of New Jersey, New Brunswick
  • Electrical and Computer Engineering Department
  • Lucent
  • Department of Ceramic and Materials Engineering
  • Rutgers University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Hieu Le Trung

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Wang Y. C.

  • Lucent
  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign
  • Lucent Technologies

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Hsieh K. C.

  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign
  • CCEEL
  • Dept. of Mat. Sci. and Engineering
  • Nano Device Laboratory
  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chiang Tsung Che

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Yang C. L.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Tsai Ping Yu

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Adesida I.

  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Hung C. L.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Li Zhen Hao

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Dravid V. P.

  • Department of Materials Science and Engineering
  • Northwestern University
  • Department of Materials Science and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Sengupta D. K.

  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Elec. and Comp. Eng. Department
  • Ctr. Space Microlectron. Technol.
  • Jet Propulsion Laboratory, California Institute of Technology
  • Ctr. Space Microelectronics Technol.
  • Dept. of Mat. Sci. and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lo Chia Chiung

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Wraback M.

  • Electronics and Power Sources Directorate
  • United States Army Research Laboratory
  • Rutgers - The State University of New Jersey, New Brunswick
  • Rutgers University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Zhang J. P.

  • Department of Materials Science and Engineering
  • Northwestern University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Wernersson L. E.

  • Lund University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chuang Ting Wei

  • Institute of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • Department of Materials Science and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Scott D.

  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign
  • Univ. Illinois at Urbana-Champaign

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Ren F.

  • Rutgers - The State University of New Jersey, New Brunswick
  • Rutgers University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chen Young Kai

  • Communication Science Research Department
  • Lucent
  • Communication Science Research Department at Bell Laboratories
  • Nokia
  • Defense Advanced Research Projects Agency
  • Communication Science Research Department
  • Communication Science Research Department at Bell Laboratories
  • Department of Chemical Engineering
  • University of Florida

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Sodonis A.

  • The University of Chicago

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Tang Z.

  • CCEEL
  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Hsieh C. H.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Tsai Huan Shang

  • Lucent

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Leung Y. K.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lee Sang Woo

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Dept. Mat. Sci. Eng. Frederick S.
  • Department of Materials Science and Engineering
  • Department of Materials Science

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Wu Jui Sheng

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lin Jing-Wei

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Huang T. C.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chu Ying Hao

  • National Yang Ming Chiao Tung University
  • National Tsing Hua University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lu X.

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Kao Min Lu

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chen C. H.

  • Taiwan Semiconductor Manufacturing Company
  • Research and Development
  • Institute of Microelectronics
  • National Cheng Kung University
  • Logic Technology Division

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Hsu Heng Tung

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lin Yuan

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chen Chen Yu

  • Institute of Materials Science and Engineering
  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Kuo Hao Chung

  • Hon Hai Precision Industry

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Wang C. H.

  • TSMC
  • National Cheng Kung University
  • Department of Electrical Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chiu Yu Sheng

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • Compound Semiconductor Device Laboratory

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Weiner Joseph S.

  • Department of Chemical Engineering
  • Multiplex Inc.
  • University of Florida
  • Lucent

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Holonyak N.

  • University of Illinois at Urbana-Champaign

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Kellogg D. A.

  • University of Illinois at Urbana-Champaign

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Tsai Ping Yu

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Doornbos G.

  • TSMC
  • TSMC R and D Europe B.V.

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Droopad R.

  • Ingram School of Engineering
  • Texas State University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lai Yung Yu

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • Academia Sinica - Research Center for Applied Science

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Nguyen Hong Quan

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • Department of Materials Science and Engineering
  • Department of Electrical Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chuang S. L.

  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Chen H. C.

  • Taiwan Semiconductor Manufacturing Company

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Hieu Le Trung

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Li Wei Li

  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Zheng Xia Xi

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lothian James R.

  • Department of Ceramic and Materials Engineering
  • Lucent
  • Rutgers - The State University of New Jersey, New Brunswick
  • Elec. and Comp. Eng. Department
  • University of Illinois at Urbana-Champaign
  • Filtronic Solid State
  • Rutgers University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Wang Yong Jyun

  • National Tsing Hua University

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???

Lee W. C.

  • Department of Electrophysics
  • National Yang Ming Chiao Tung University
  • Industrial Technology Research Institute Hsinchu

外部人員: ???externalperson.externalpersontypes.externalperson.externalperson???