每年研究成果
每年研究成果
- 4結果
搜尋結果
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2018
Deposition of polymer films by atmospheric pressure plasma
Li, C., Yu, C. T. & Hsieh, J. H., 22 6月 2018, Proceedings - 2018 7th International Symposium on Next-Generation Electronics, ISNE 2018. Institute of Electrical and Electronics Engineers Inc., p. 1-4 4 p. (Proceedings - 2018 7th International Symposium on Next-Generation Electronics, ISNE 2018).研究成果: Conference contribution › 同行評審
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2014
Enhancement of bonding strength for low temperature Si3N4/Si3N4 direct wafer bonding by nitrogen-plasma activation and hydrofluoric pre-dip
Lo, F. S., Chiang, C. C., Li, C. & Lee, T. H., 2014, Semiconductor Wafer Bonding 13: Science, Technology, and Applications. Suga, T., Goorsky, M. S., Knechtel, R., Moriceau, H., Baumgart, H., Tan, C. S. & Hobart, K. D. (編輯). 5 編輯 Electrochemical Society Inc., p. 111-117 7 p. (ECS Transactions; 卷 64, 編號 5).研究成果: Conference contribution › 同行評審
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2006
The dynamic analysis of a planar parallel manipulator with joint-coupling
Theingi, Chen, I. M., Li, C. & Angeles, J., 2006, 9th International Conference on Control, Automation, Robotics and Vision, 2006, ICARCV '06. 4150217. (9th International Conference on Control, Automation, Robotics and Vision, 2006, ICARCV '06).研究成果: Conference contribution › 同行評審
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2002
Singularity Management Of 2DOF Planar Manipulator Using Coupled Kinematics
Theingi, Li, C., Chen, I. M. & Angeles, J., 12月 2002, Proceedings of the 7th International Conference on Control, Automation, Robotics and Vision, ICARCV 2002. p. 402-407 6 p. (Proceedings of the 7th International Conference on Control, Automation, Robotics and Vision, ICARCV 2002).研究成果: Conference contribution › 同行評審
8 引文 斯高帕斯（Scopus）