陳 智

研究成果

每年研究成果 1997 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2018 2019 2020 2021 2022 2023 2024 2024

• 209 Article
• 122 Conference contribution
• 46 Patent
• 5 Review article
• 8 更多
  • 4 Chapter
  • 2 Conference article
  • 1 Paper
  • 1 Comment/debate

每年研究成果

每年研究成果

搜尋結果

• 2005

  3-D simulation on current density distribution in flip-chip solder joints with thick Cu UBM under current stressing

  Liang, S. W., Shao, T. L. & Chen, C., 2005, 於: Proceedings - Electronic Components and Technology Conference. 2, p. 1416-1420 5 p.

  研究成果 › 同行評審

  • On-state Current 100%
  • Thick Cu 100%
  • Flip Chip Solder Joints 100%
  • 3D Simulation 100%
  • Current Stressing 100%
  21 引文 斯高帕斯（Scopus）
• 2004

  Electromigration failure mechanism of Sn96.5Ag3.5 flip-chip solder bumps

  Shao, T. L., Chen, I. H. & Chen, C., 27 12月 2004, 於: Proceedings - Electronic Components and Technology Conference. 1, p. 979-982 4 p.

  研究成果: Conference article › 同行評審

  • Electromigration 100%
  • Failure Mechanism 100%
  • Flip chip 100%
  • Solder Bump 100%
  • Intermetallics 100%
  7 引文 斯高帕斯（Scopus）