陳 智

研究成果

每年研究成果 1997 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2018 2019 2020 2021 2022 2023 2024 2024

• 209 Article
• 122 Conference contribution
• 46 Patent
• 5 Review article
• 8 更多
  • 4 Chapter
  • 2 Conference article
  • 1 Paper
  • 1 Comment/debate

每年研究成果

每年研究成果

搜尋結果

• 2004

  Self-aligned hermetic packaging using eutectic SnPb solder and Cr/Ni/Cu metallization layer

  Huang, A. T., Chou, C. K. & Chen, C., 1 12月 2004, p. 327-328. 2 p.

  研究成果 › 同行評審

  • Self-aligned 100%
  • SnPb Solder 100%
  • Metallized Layer 100%
  • Hermetic Packaging 100%
  • Ni-Cu Metallization 100%