Chih Chen

每年研究成果

篩選

2012
Electromigration in Pb-Free Solder Joints in Electronic Packaging
Chen, C., Liang, S. W., Chang, Y. W., Hsiao, H. Y., Han, J. K. & Tu, K.-N., 15 3月 2012, Lead-free Solders: Materials Reliability for Electronics. Wiley-Blackwell, p. 375-399 25 p.
研究成果: Chapter › 同行評審
1 引文斯高帕斯（Scopus）
Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints
Tian, T., Tu, K.-N., Chen, H. Y., Hsiao, H. Y. & Chen, C., 15 3月 2012, Lead-free Solders: Materials Reliability for Electronics. Wiley-Blackwell, p. 424-442 19 p.
研究成果: Chapter › 同行評審
2007
Electromigration issues in lead-free solder joints
Chen, C. & Liang, S. W., 1 12月 2007, Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics. Springer US, p. 259-268 10 p.
研究成果: Chapter › 同行評審
15 引文斯高帕斯（Scopus）
Stress analysis of spontaneous Sn whisker growth
Tu, K.-N., Chen, C. & Wu, A. T., 2007, Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics. Springer US, p. 269-281 13 p.
研究成果: Chapter › 同行評審
18 引文斯高帕斯（Scopus）

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