每年專案
個人檔案
研究專長
覆晶銲錫電遷移與冶金反應
三維積體電路封裝
奈米雙晶銅的製備與應用
低溫銅-銅直接接合
教育/學術資格
PhD, 材料科學及工程, University of California, Los Angeles
外部位置
指紋
查看啟用 Chih Chen 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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過去五年中的合作和熱門研究領域
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
專案
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前瞻材料研究中心111年9月至10月技術服務(公家機構)
Chen, C. (PI)
1/09/22 → 31/10/22
研究計畫: Other Government Ministry Institute
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Breaking strength-conductivity trade-off in nanotwinned Cu by Fe Co-electroplating and its thermal stability characterization
Tran, D. P., Chen, B. Y., La, M. P., Lee, K. P. & Chen, C., 5月 2025, 於: Materials Characterization. 223, 114925.研究成果: Article › 同行評審
8 引文 斯高帕斯（Scopus） -
Design of surface topography for fabricating nanotwinned copper/polyimide hybrid joints using in-situ heating atomic force microscopy
He, P. S., Tran, D. P., Shie, K. C. & Chen, C., 15 3月 2025, 於: Applied Surface Science. 685, 162023.研究成果: Article › 同行評審
3 引文 斯高帕斯（Scopus） -
Dimensional Effects on Grain Size and Surface Orientation of Nanocrystalline Cu in SiO2 Micro-Vias
Chao, T. H., Lin, H. E., Tran, D. P. & Chen, C., 2025, 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025. Institute of Electrical and Electronics Engineers Inc., p. 93-94 2 p. (2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025).研究成果: Conference contribution › 同行評審
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Direction-dependent mechanical strength of nanostructure-tuned copper
Lee, K. P., Chen, H. C., Tran, D. P., Chen, B. Y. & Chen, C., 10月 2025, 於: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 942, 148666.研究成果: Article › 同行評審
2 引文 斯高帕斯（Scopus） -
Effect of Cu microstructures on Cu/SiO2 hybrid bonding for 3D IC heterogeneous integration
Chen, C., Lin, H. E., Chiu, W. L. & Chang, H. H., 2025, 9th IEEE Electron Devices Technology and Manufacturing Conference: Shaping the Future with Innovations in Devices and Manufacturing, EDTM 2025. Institute of Electrical and Electronics Engineers Inc., (9th IEEE Electron Devices Technology and Manufacturing Conference: Shaping the Future with Innovations in Devices and Manufacturing, EDTM 2025).研究成果: Conference contribution › 同行評審
獎項
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Scientific Reports (事件)
Chen, C. (Member of editorial board)
1 1月 2018 → 31 12月 2018活動: Editorial work
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The 66th Annual Meeting of the International Society of Electrochemistry
Chen, C. (Speaker)
4 10月 2015活動: Invited talk