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個人檔案
研究專長
覆晶銲錫電遷移與冶金反應
三維積體電路封裝
奈米雙晶銅的製備與應用
低溫銅-銅直接接合
教育/學術資格
PhD, 材料科學及工程, University of California, Los Angeles
外部位置
指紋
查看啟用 Chih Chen 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
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In Situ Study of Twin Boundary Stability in Nanotwinned Copper Pillars under Different Strain Rates
Chang, S. Y., Huang, Y. C., Lin, S. Y., Lu, C. L., Chen, C. & Dao, M., 1月 2023, 於: Nanomaterials. 13, 1, 190.研究成果: Article › 同行評審
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Artificial intelligence deep learning for 3D IC reliability prediction
Hsu, P. N., Shie, K. C., Chen, K. P., Tu, J. C., Wu, C. C., Tsou, N. T., Lo, Y. C., Chen, N. Y., Hsieh, Y. F., Wu, M., Chen, C. & Tu, K-N., 12月 2022, 於: Scientific reports. 12, 1, 6711.研究成果: Article › 同行評審
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Characterization of Nanomechanical Properties and Scratch Hardness of (111) Nanotwinned Copper Thin Film in Ambient and Slurry Conditions
Sharma, M., Chen, C. C. A., Chen, C. & He, P. S., 6月 2022, 於: ECS Journal of Solid State Science and Technology. 11, 6, 064004.研究成果: Article › 同行評審
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Distribution of elastic stress as a function of temperature in a 2-μm redistribution line of Cu measured with X-ray nanodiffraction analysis
Hsu, W. Y., Tseng, I. H., Chiang, C. Y., Tu, K. N. & Chen, C., 9月 2022, 於: Journal of Materials Research and Technology. 20, p. 2799-2808 10 p.研究成果: Article › 同行評審
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Effect of Electroplating Current Density on Tensile Properties of Nanotwinned Copper Foils
Fang, C. Y., Tran, D. P., Liu, H. C., Ong, J. J., Lin, Y. Q., Hsu, W. Y. & Chen, C., 1 4月 2022, 於: Journal of the Electrochemical Society. 169, 4, 042503.研究成果: Article › 同行評審
開啟存取1 引文 斯高帕斯（Scopus）
獎品
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Scientific Reports (事件)
Chih Chen (Member of editorial board)
1 1月 2018 → 31 12月 2018活動: Editorial work
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The 66th Annual Meeting of the International Society of Electrochemistry
Chih Chen (Speaker)
4 10月 2015活動: Invited talk