啟川 王 的照片

查看斯高帕斯 (Scopus) 概要

王 啟川

教授

 https://orcid.org/0000-0002-4451-3401
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
1985 …2025

每年研究成果

篩選
Conference contribution

搜尋結果

  • 2024

    High Heat Flux Investigation of Copper-Nickel Alloys in R-1233zd(E) Pool Boiling

    Cheng, S. W., Sharma, S., Yang, C. H., Shih, C. S., Chung, Y. L. & Wang, C. C., 2024, Proceedings of the 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024. IEEE Computer Society, (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).

    研究成果: Conference contribution › 同行評審

  • Innovative Two-Phase Immersion Cooling Solutions for high-power Advanced Packages

    Sharma, S., Ahmad, A., Huang, I., Lu, Y. X., Huang, H. H., Wang, C. C., Hung, C. P. & Wang, C. C., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 1515-1521 7 p. (Proceedings - Electronic Components and Technology Conference).

    研究成果: Conference contribution › 同行評審

  • Physical Based Model of Air-Cooled Thermosyphon

    Huang, P. J., Lin, H. Y., Rukruang, A. & Wang, C. C., 2024, Proceedings of the 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024. IEEE Computer Society, (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).

    研究成果: Conference contribution › 同行評審

  • 2023

    Effects of the Gap on Microchannels Heat Sink Cooling Performance

    Sulaiman, M. W. & Wang, C. C., 2023, Proceedings of the 9th World Congress on Mechanical, Chemical, and Material Engineering, MCM 2023. Qiu, H., Zhang, Y. & Iasiello, M. (編輯). Avestia Publishing, (Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering).

    研究成果: Conference contribution › 同行評審

    開啟存取

  • Experimental Study on the Effect of Uneven Heat Load on the Airflow Uniformity and Thermal Performance in a Small-Scale Data Center

    Chang, Z. W. & Wang, C. C., 2023, Proceedings of ASME 2023 Heat Transfer Summer Conference, HT 2023. American Society of Mechanical Engineers (ASME), V001T01A001. (Proceedings of ASME 2023 Heat Transfer Summer Conference, HT 2023).

    研究成果: Conference contribution › 同行評審

  • 2021

    Application of Mobile Energy Storage System in Micro-Grid Management System

    Kuo, W. C., Chen, C.-H., Wang, C. C. & Chang, Y. C., 2021, 2021 IEEE International Conference on Electronic Communications, Internet of Things and Big Data, ICEIB 2021. Meen, T.-H. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 314-317 4 p. (2021 IEEE International Conference on Electronic Communications, Internet of Things and Big Data, ICEIB 2021).

    研究成果: Conference contribution › 同行評審

    1 引文 斯高帕斯（Scopus）

  • Effect of Inclination Angle on the Airside Hydrothermal Performance of the Rectangular Plain Fin Heat Exchangers Operating Under Wet Conditions

    Muneeshwaran, M. & Wang, C. C., 2021, ASHRAE Virtual Annual Conference, ASHRAE 2021. ASHRAE, p. 353-361 9 p. (ASHRAE Transactions; 卷 127).

    研究成果: Conference contribution › 同行評審

  • 2020

    Ai based energy optimization in association with class environment

    Yu, K. H., Jaimes, E. & Wang, C. C., 2020, ASME 2020 14th International Conference on Energy Sustainability, ES 2020. American Society of Mechanical Engineers (ASME), V001T16A004. (ASME 2020 14th International Conference on Energy Sustainability, ES 2020).

    研究成果: Conference contribution › 同行評審

    2 引文 斯高帕斯（Scopus）
  • 2019

    Effect of punching holes on the thermofluids characteristics of wavy fin-and-tube heat exchangers

    Sadeghianjahromi, A. & Wang, C. C., 1 1月 2019, ICR 2019 - 25th IIR International Congress of Refrigeration. Minea, V. (編輯). International Institute of Refrigeration, p. 2114-2121 8 p. 449. (Refrigeration Science and Technology; 卷 2019-August).

    研究成果: Conference contribution › 同行評審

  • 2018

    Simulation and analysis of the supercritical orc heat exchanger

    Li, Y. M. & Wang, C.-C., 2018, Heat Exchanger Technologies; Plant Performance; Thermal Hydraulics and Computational Fluid Dynamics; Water Management for Power Systems; Student Competition. American Society of Mechanical Engineers (ASME), (American Society of Mechanical Engineers, Power Division (Publication) POWER; 卷 2).

    研究成果: Conference contribution › 同行評審

  • 2017

    Analytical and experimental verification of interleaved trapezoidal heat sink

    Chen, H. L. & Wang, C.-C., 11 4月 2017, 33rd Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 197-203 7 p. 7896930. (Annual IEEE Semiconductor Thermal Measurement and Management Symposium).

    研究成果: Conference contribution › 同行評審

    3 引文 斯高帕斯（Scopus）

  • Numerical examination and verification of the directional solidification of silicon process

    Yang, C. H., Wang, C. L., Huang, S. H., Chu, R. S., Lan, M. T. & Wang, C.-C., 2017, Proceedings of CHT-17 ICHMT International Symposium on Advances in Computational Heat Transfer, 2017. Begell House Inc., p. 1157-1170 14 p. (International Symposium on Advances in Computational Heat Transfer).

    研究成果: Conference contribution › 同行評審

  • 2016

    Investigating micro-fin and smooth tubes in horizontal two-phase flow boiling using R-1234ze and R-134a refrigerants

    Abdul, K. & Wang, C.-C., 1 1月 2016, 4th IIR International Conference on Sustainability and the Cold Chain, Proceedings. Cleland, D., East, A., Carson, J. & Love, R. (編輯). International Institute of Refrigeration, p. 104-111 8 p. (Refrigeration Science and Technology; 卷 2016-January).

    研究成果: Conference contribution › 同行評審

  • 2015

    A study on heat sink performance using V-shaped cannelure structure fin

    Huang, P. S. & Wang, C.-C., 1 1月 2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, (ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems).

    研究成果: Conference contribution › 同行評審

    1 引文 斯高帕斯（Scopus）

  • Modeling and simulation of a transcritical CO 2 heat pump system with an internal heat exchanger

    Sian, R. & Wang, C.-C., 2015, 24th IIR International Congress of Refrigeration, ICR 2015. International Institute of Refrigeration, p. 3485-3493 9 p. (Refrigeration Science and Technology).

    研究成果: Conference contribution › 同行評審

    2 引文 斯高帕斯（Scopus）
  • 2014

    An optimized heat dissipation fin design applicable for natural convection augmentation (IMPACT 2014)

    Charles, R. & Wang, C. C., 2014, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 61-64 4 p. 7048391. (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

    研究成果: Conference contribution › 同行評審

    2 引文 斯高帕斯（Scopus）
  • 2013

    A 3-D numerical analysis of the effect of fin pattern on the thermo-hydraulic performance of plate heat exchangers

    Li, K. H. & Wang, C.-C., 1 12月 2013, ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013. V002T04A009. (ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013; 卷 2).

    研究成果: Conference contribution › 同行評審

  • On studying fluidic motions in an oscillating heat pipe

    Chen, H. M., Chiang, C. M., Chien, K. H. & Wang, C.-C., 2013, Innovation for Applied Science and Technology. p. 513-517 5 p. (Applied Mechanics and Materials; 卷 284-287).

    研究成果: Conference contribution › 同行評審

  • 2012

    A visualization study of venting gas via hydrophobic nanoporous membrane

    Shyu, J. C., Dai, S. M., Yang, K. S. & Wang, C.-C., 2012, 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012. p. 640-643 4 p. 6196857. (2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012).

    研究成果: Conference contribution › 同行評審

  • Effect of a Delta-Winglet vortex generator on the performance of a fin-and-tube heat exchanger

    Tseng, C. Y., Liaw, J. S., Chang, Y. C. & Wang, C.-C., 2012, 6th Asian Conference on Refrigeration and Air Conditioning, ACRA 2012. Chinese Association of Refrigeration (CAR), p. 818-825 8 p. (6th Asian Conference on Refrigeration and Air Conditioning, ACRA 2012).

    研究成果: Conference contribution › 同行評審

  • 2011

    Liquid flow distribution in compact parallel flow heat exchangers

    Chen, I. Y., Tsai, J. S., Wang, C.-C. & Yang, K. S., 29 9月 2011, 2011 IEEE 3rd International Conference on Communication Software and Networks, ICCSN 2011. p. 333-337 5 p. 6014907. (2011 IEEE 3rd International Conference on Communication Software and Networks, ICCSN 2011).

    研究成果: Conference contribution › 同行評審

    2 引文 斯高帕斯（Scopus）
  • 2010

    Airside performance of wavy fin-and-tube heat exchangers - Data with larger diameter tube

    Lo, H. P., Hung, C.-H. & Wang, C.-C., 1 12月 2010, 2010 14th International Heat Transfer Conference, IHTC 14. p. 423-428 6 p. (2010 14th International Heat Transfer Conference, IHTC 14; 卷 4).

    研究成果: Conference contribution › 同行評審

  • Analysis and optimum for air cooling thermal module using dimple vortex generators

    Yang, K. S., Li, S. L., Chen, I. Y. & Wang, C.-C., 2010, 2010 14th International Heat Transfer Conference, IHTC 14. p. 441-448 8 p. (2010 14th International Heat Transfer Conference, IHTC 14; 卷 3).

    研究成果: Conference contribution › 同行評審

    3 引文 斯高帕斯（Scopus）

  • Experimental investigation of high performance thermal module with dimple vortex generators

    Yang, K. S., Wun, K. L., Chen, I. Y. & Wang, C.-C., 2010, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 5699525. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

    研究成果: Conference contribution › 同行評審

    2 引文 斯高帕斯（Scopus）

  • Experimental studies of nozzle/diffuser micropumps using enhancement structure

    Yang, K. S., Chao, T. F., Chen, I. Y. & Wang, C.-C., 2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels Collocated with 3rd Joint US-European Fluids Engineering Summer Meeting, ICNMM2010. PARTS A AND B 編輯 p. 887-891 5 p. (ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels Collocated with 3rd Joint US-European Fluids Engineering Summer Meeting, ICNMM2010; 編號 PARTS A AND B).

    研究成果: Conference contribution › 同行評審

  • On the heat transfer characteristics of highly compact heat sinks

    Wang, C.-C., 2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels Collocated with 3rd Joint US-European Fluids Engineering Summer Meeting, ICNMM2010. PARTS A AND B 編輯 p. 335-341 7 p. (ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels Collocated with 3rd Joint US-European Fluids Engineering Summer Meeting, ICNMM2010; 編號 PARTS A AND B).

    研究成果: Conference contribution › 同行評審

  • Performance of the LED array panel in a confined enclosure

    Shyu, J. C., Hsu, K. W., Yang, K. S. & Wang, C.-C., 1 12月 2010, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 5699520. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

    研究成果: Conference contribution › 同行評審

    5 引文 斯高帕斯（Scopus）
  • 2009

    A condensate-less design of cold plate in vapor-compression system applicable to high-end computing

    Wu, Y. L., Yang, K. S., Lin, S. J., Chang, W. R. & Wang, C.-C., 2009, 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2009 - Proceedings. p. 17-21 5 p. 4810737. (Annual IEEE Semiconductor Thermal Measurement and Management Symposium).

    研究成果: Conference contribution › 同行評審

  • An investigation of thermal spreading device with thermal via in high power LEDs

    Yang, K. S., Wu, Y. L., Chen, I. Y. & Wang, C.-C., 2009, IMPACT Conference 2009 International 3D IC Conference - Proceedings. p. 195-198 4 p. 5382141. (IMPACT Conference 2009 International 3D IC Conference - Proceedings).

    研究成果: Conference contribution › 同行評審

    2 引文 斯高帕斯（Scopus）

  • A study concerning the influence of nanofluids on the performance of water chiller

    Liu, M. S., Lin, M. C. C., Liaw, J. S., Hu, R. & Wang, C.-C., 2009, 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009. National Taipei University of Technology, p. 214-216 3 p. (4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009).

    研究成果: Conference contribution › 同行評審

    1 引文 斯高帕斯（Scopus）

  • Effect of orientation on the convective boiling performance of microchannel heat sink using HFE-7100

    Yang, K. S., Jeng, Y. R., Huang, C. M. & Wang, C.-C., 2009, IMPACT Conference 2009 International 3D IC Conference - Proceedings. p. 360-363 4 p. 5382191. (IMPACT Conference 2009 International 3D IC Conference - Proceedings).

    研究成果: Conference contribution › 同行評審

  • Heat transfer and pressure drop characteristics for HFE-7100 within microchannel heat sinks

    Huang, C. M., Jeng, Y. R., Yang, K. S., Wang, C.-C. & Wu, Y. L., 2009, Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009. PART B 編輯 p. 1127-1131 5 p. (Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009; 編號 PART B).

    研究成果: Conference contribution › 同行評審

    2 引文 斯高帕斯（Scopus）

  • Research and development on no-moving-part valves using enhancement

    Yang, K. S., Liu, Y. C., Wang, C.-C. & Shyu, J. C., 2009, Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009. PART A 編輯 p. 739-743 5 p. (Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009; 編號 PART A).

    研究成果: Conference contribution › 同行評審

    1 引文 斯高帕斯（Scopus）
  • 2008

    Electroosmotic pumping using porous anodic alumina membranes

    Chen, Y. F., Li, M. C., Chang, W. J., Wang, C.-C. & Chen, C. P., 2008, 2008 Proceedings of the ASME Micro/Nanoscale Heat Transfer International Conference, MNHT 2008. p. 139-146 8 p. (2008 Proceedings of the ASME Micro/Nanoscale Heat Transfer International Conference, MNHT 2008; 卷 PART A).

    研究成果: Conference contribution › 同行評審

  • Influence of variable heat load on the refrigerant distribution of a dual cold-plate system

    Yang, K. S., Yu, K. H., Liu, C. C. & Wang, C.-C., 1 12月 2008, Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008. PART B 編輯 p. 1431-1435 5 p. (Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008; 編號 PART B).

    研究成果: Conference contribution › 同行評審

  • Two-phase heat transfer performance of dielectric fluid HFE-7100 within multiport microchannel

    Lin, L. Y., Jeng, Y. R. & Wang, C.-C., 2008, 2008 Proceedings of the ASME Micro/Nanoscale Heat Transfer International Conference, MNHT 2008. p. 975-980 6 p. (2008 Proceedings of the ASME Micro/Nanoscale Heat Transfer International Conference, MNHT 2008; 卷 PART B).

    研究成果: Conference contribution › 同行評審

  • 2007

    EHD enhanced heat transfer with needle-arrayed electrodes

    Li, H. Y., Huang, R. T., Sheu, W. J. & Wang, C.-C., 27 8月 2007, Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM Proceedings 2007. p. 149-154 6 p. 4160903. (Annual IEEE Semiconductor Thermal Measurement and Management Symposium).

    研究成果: Conference contribution › 同行評審

    5 引文 斯高帕斯（Scopus）

  • Experimental investigations on airside performance of heat sinks having pin fin configurations

    Yang, K. S., Chu, W. H., Chen, I. Y. & Wang, C.-C., 2007, Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM Proceedings 2007. p. 208-212 5 p. 4160913. (Annual IEEE Semiconductor Thermal Measurement and Management Symposium).

    研究成果: Conference contribution › 同行評審

    1 引文 斯高帕斯（Scopus）
  • 2006

    A novel micro magnetic bearing motor design

    Wang, C.-C., Wang, S. & Yao, Y., 1 12月 2006, INTERMAG 2006 - IEEE International Magnetics Conference. 1 p. 4261657. (INTERMAG 2006 - IEEE International Magnetics Conference).

    研究成果: Conference contribution › 同行評審

  • Frictional pressure drops of two-phase R-134A flow in horizontal and vertical U-type wavy and straight tubes

    Chen, I. Y., Wu, Y. S., Chang, Y. J. & Wang, C. C., 2006, Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Fluids Engineering Division. American Society of Mechanical Engineers (ASME), (American Society of Mechanical Engineers, Fluids Engineering Division (Publication) FED).

    研究成果: Conference contribution › 同行評審

  • Natural convection heat transfer from square pin fin heat sinks subject to the influence of orientation

    Huang, R. T., Sheu, W. J., Li, H. Y., Wang, C.-C. & Yang, K. S., 2006, Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, SEMI-THERM 2006. p. 102-107 6 p. 1625213. (Annual IEEE Semiconductor Thermal Measurement and Management Symposium; 卷 2006).

    研究成果: Conference contribution › 同行評審

    11 引文 斯高帕斯（Scopus）
  • 2005

    A novel concept to improve the performance of led panel using drilled holes

    Chiang, S. B. & Wang, C.-C., 2005, Proceedings of the ASME Heat Transfer Division 2005. 1 編輯 p. 813-817 5 p. (American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD; 卷 376 HTD, 編號 1).

    研究成果: Conference contribution › 同行評審

  • Thermal management of a notebook computer

    Chiang, S. B., Chien, K. H., Yang, K. S., Wu, S. K. & Wang, C.-C., 2005, Proceedings of the ASME Heat Transfer Division 2005. 1 編輯 p. 831-835 5 p. (American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD; 卷 376 HTD, 編號 1).

    研究成果: Conference contribution › 同行評審

    1 引文 斯高帕斯（Scopus）
  • 2004

    A numerical examination of the inkjet refilling

    Yang, K. S., Chen, I. Y. & Wang, C.-C., 2004, Proceedings of the Second International Conference on Microchannels and Minichannels (ICMM2004). American Society of Mechanical Engineers, p. 709-715 7 p. (Proceedings of the Second International Conference on Microchannels and Minichannels (ICMM2004)).

    研究成果: Conference contribution › 同行評審

  • A numerical study of the nozzle/diffuser micro-pump

    Yang, K. S., Chen, I. Y., Chien, K. H. & Wang, C.-C., 1 12月 2004, Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004. Badawy, W. & Moussa, W. (編輯). p. 104-109 6 p. (Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004).

    研究成果: Conference contribution › 同行評審

    5 引文 斯高帕斯（Scopus）

  • A study on the behavior of the pressure drop for the fluid flow in a triangular microchannel

    Teng, J. T., Chu, J. C., Chen, J. J., Wang, C.-C., Lin, C. H. & Greif, R., 2004, Proceedings of the 7th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2004. American Society of Mechanical Engineers, p. 519-525 7 p. (Proceedings of the 7th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2004; 卷 3).

    研究成果: Conference contribution › 同行評審

  • 2003

    A study of the fabrication and analysis of micro diffuser/nozzles

    Yang, K. S., Chen, I. Y., Shew, B. Y. & Wang, C.-C., 1 12月 2003, International Conference on Microchannels and Minichannels. Kandlikar, S. G. (編輯). p. 781-786 6 p. (International Conference on Microchannels and Minichannels; 卷 1).

    研究成果: Conference contribution › 同行評審

    1 引文 斯高帕斯（Scopus）

  • Influence of vertical return bend on the twophase flow pattern in A 3-MM minichannel

    Chen, I. Y., Wang, C. C., Huang, P. S., Yang, B. C. & Chang, Y. J., 2003, International Conference on Microchannels and Minichannels. Kandlikar, S. G. (編輯). p. 493-498 6 p. (International Conference on Microchannels and Minichannels; 卷 1).

    研究成果: Conference contribution › 同行評審

    1 引文 斯高帕斯（Scopus）

  • Investigation of the flow mal-distribution in microchannels

    Teng, J. T., Chu, J. C., Liu, M. S., Wang, C.-C. & Greif, R., 1 1月 2003, Micro-Electro-Mechanical Systems (MEMS) - 2003. American Society of Mechanical Engineers, p. 465-469 5 p. (American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS); 卷 5).

    研究成果: Conference contribution › 同行評審

    12 引文 斯高帕斯（Scopus）
  • 2002

    Two-phase friction pressure drop of small diameter U-type wavy pipes

    Chen, I. Y., Lai, Y. K., Yang, B. C. & Wang, C. C., 2002, 8th AIAA/ASME Joint Thermophysics and Heat Transfer Conference. American Institute of Aeronautics and Astronautics Inc., (8th AIAA/ASME Joint Thermophysics and Heat Transfer Conference).

    研究成果: Conference contribution › 同行評審

    2 引文 斯高帕斯（Scopus）