奈米科學及工程學士學位學程

2024

Alignment and Transfer of Silver Nanowire Arrays onto Unconventional Substrates for Optoelectronic Devices via Dielectrophoresis Force

Chen, Y. S., Liu, S. Y., Lin, C. C., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 255-256 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).

研究成果: Conference contribution › 同行評審

Benefits of Combining Gate-Field Plates Design and Hybrid Drains on Gold-Free GaN HEMT Devices

Chen, Y. S., Lai, Y., Lin, Z. Y., Huang, Y. C., Yu, C. T., Ko, F. H., Chen, C. C., Al-Hagri, A. & You, H. C., 2024, 2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices, AM-FPD 2024. Institute of Electrical and Electronics Engineers Inc., p. 136-139 4 p. (2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices, AM-FPD 2024).

研究成果: Conference contribution › 同行評審

Carbon/Nitrogen Dual-Doped in <100> P-Type Silicon Hard Mask for Wafer Thinning and Dishing Less for Hybrid Bonding

Chen, Y. S., Chiu, T. W., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 75-76 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).

研究成果: Conference contribution › 同行評審

Enhancing the Performance of Perovskite-Based Organic TFT Photodetectors by CsAc Post-treatment

Chen, Y. S., Lin, Z. Y., Lai, Y. W., Huang, Y. C., Al-Hagri, A., Ko, F. H. & You, H. C., 2024, 2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices, AM-FPD 2024. Institute of Electrical and Electronics Engineers Inc., p. 105-107 3 p. (2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices, AM-FPD 2024).

研究成果: Conference contribution › 同行評審

Investigation of In-Sn-Zn Composition on the Characterization of Submicron Channel Length Ultra-Thin Atomic Layer Deposited InSnZnO Channel Transistors

Liang, Y. K., Peng, L. C., Lin, Y. L., Zheng, J. Y., Hsieh, D. R., Chou, T. T., Huang, H. Y., Lin, Y. M., Tseng, Y. C., Chao, T. S., Chang, E. Y., Toprasertpong, K., Takagi, S. & Lin, C. H., 2024, 2024 IEEE Silicon Nanoelectronics Workshop, SNW 2024. Institute of Electrical and Electronics Engineers Inc., p. 63-64 2 p. (2024 IEEE Silicon Nanoelectronics Workshop, SNW 2024).

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

Maximizing Competing Spin Current of the W/Pt/ferromagnet Devices with Spin-Torque Ferromagnetic Resonance Analysis

Hsu, J., Cheng, C. W., Huang, Y. H., Wu, Y. H., Lin, Y. L., Chang, W. Y. & Tseng, Y. C., 2024, 2024 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

Neuromorphic Computing with the Ferromagnetic/Antiferromagnetic SOT Systems: The Role of Emerging Antiferromagnetic Phase

Ojha, D. K., Huang, Y. H., Lin, Y. L., Chatterjee, R., Chang, W. Y. & Tseng, Y. C., 2024, 2024 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Novel Single and Co-Ion Implantation Induced Backside Etch Stop Structures for 3D Multilayer Stacked Package

Chen, Y. S., Chiu, T. W., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 2184-2188 5 p. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Optimizing Performance of Perovskite Solar Cells Through AgI Doping in CsBi₃I₁₀ Perovskite Films is Crucial for Improving Their Efficiency

Wang, S. P., Huang, Y. C., Chen, Y. S., Lin, Z. Y., Lai, Y. W., Chang, C. Y., Ko, F. H. & You, H. C., 2024, 2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices, AM-FPD 2024. Institute of Electrical and Electronics Engineers Inc., p. 131-133 3 p. (2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices, AM-FPD 2024).

研究成果: Conference contribution › 同行評審

Synthetic Antiferromagnetic/Ferromagnetic Spin-Orbit Torque Devices with an Oxide Spacer

Huang, Y. H., Cheng, C. W., Hsu, J., Wu, Y. H., Lin, Y. L., Chang, W. Y. & Tseng, Y. C., 2024, 2024 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

2023

Aggressively Scaled Atomic Layer Deposited Amorphous InZnO_xThin Film Transistor Exhibiting Prominent Short Channel Characteristics (SS= 69 mV/dec.; DIBL = 27.8 mV/V) and High G_m(802 μS/μm at V_DS= 2V)

Liang, Y. K., Zheng, J. Y., Lin, Y. L., Li, W. L., Lu, Y. C., Hsieh, D. R., Peng, L. C., Chou, T. T., Kei, C. C., Lu, C. C., Huang, H. Y., Tseng, Y. C., Chao, T. S., Chang, E. Y. & Lin, C. H., 2023, 2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023. Institute of Electrical and Electronics Engineers Inc., (Digest of Technical Papers - Symposium on VLSI Technology; 卷 2023-June).

研究成果: Conference contribution › 同行評審

9 引文斯高帕斯（Scopus）

Boron Ion Implantation-Induced Embedded Layers for Ultra-Thin Die Structures

Chen, Y. S., Chiu, T. W., Ko, Y. C., Fan, H. T., Huang, Y. C. & Ko, F. H., 2023, 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023. Institute of Electrical and Electronics Engineers Inc., p. 717-720 4 p. (2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Demonstration of Mos2 Memtransistor with Poly-Si Source/Drain Featuring Tunable Conductance States and Boosted I_ON

Li, K. S., Huang, M. K., Wang, Y. H., Tseng, Y. C. & Su, C. J., 2023, 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023. Institute of Electrical and Electronics Engineers Inc., (7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Electrical Determination of Magnetization Switching in In-plane Anisotropy Spin-orbit Systems

Huang, Y. H., Lin, Y. L., Wu, Y. H. & Tseng, Y. C., 2023, 2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

First Demonstration of Highly Scaled Atomic Layer Deposited Ultrathin InSnZnO Channel Thin Film Transistor Exhibiting Superior Electrical Characteristics

Liang, Y. K., Zheng, J. Y., Lin, Y. L., Chen, Y., Chen, K. L., Hsieh, D. R., Peng, L. C., Chiu, C. H., Lu, Y. C., Chou, T. T., Kei, C. C., Lu, C. C., Huang, H. Y., Lin, Y. M., Tseng, Y. C., Chao, T. S., Chang, E. Y. & Lin, C. H., 2023, 2023 International Electron Devices Meeting, IEDM 2023. Institute of Electrical and Electronics Engineers Inc., (Technical Digest - International Electron Devices Meeting, IEDM).

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

Novel Strain Release Self-Assembly Design of Silver Nanowires and Application in Flexible Strain Sensors

Chen, Y. S., Ko, Y. C., Fan, H. T., Lin, C. C. & Ko, F. H., 2023, 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023. Institute of Electrical and Electronics Engineers Inc., p. 761-765 5 p. (2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023).

研究成果: Conference contribution › 同行評審

Reduced Switching Current with a Light Metal in a Tri-layer Spin-orbit Torque Device

Wu, Y. H., Cheng, C. W., Lin, Y. L., Chen, M. C. & Tseng, Y. C., 2023, 2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

Reusable Detector of ZnO-based Transistor in Floating Gate Structure for High Sensitivity pH Sensor

Chen, Y. S., You, H. C., Lin, C. C. & Ko, F. H., 2023, 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023. Institute of Electrical and Electronics Engineers Inc., p. 664-667 4 p. (2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023).

研究成果: Conference contribution › 同行評審

Scalable Spin-to-Charge Conversion Effect in the Inverse Spin Hall Nanodevice

Lin, Y. L., Hsin, T. C., Wu, Y. H., Sun, J. Y. C. & Tseng, Y. C., 2023, 2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

Using a Mixed Solvent to Improve the Morphology of Thin Films, a One-Step Method is Employed to form Three-Dimensional Lead-Free Perovskite Solar Cells

Huang, Y. C., Chen, Y. S., Tseng, P. C., Lin, C. C., You, H. C. & Ko, F. H., 2023, 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023. Institute of Electrical and Electronics Engineers Inc., p. 227-230 4 p. (2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023).

研究成果: Conference contribution › 同行評審

2022

The thermal stability improvement of spin-orbit-torque (SOT) devices with a thin PtMn insertion

Chang, Y. J., Chen, F. M., Chen, K. M., Yang, S. Y., Hsin, Y. C., Rahaman, S. Z., Wang, I. J., Lee, H. H., Su, Y. H., Chen, G. L., Shih, C. Y., Chiu, S. C., Wei, J. H., Sheu, S. S., Lo, W. C., Tseng, Y. C., Lai, C. H., Tang, D. & Wu, C. I., 2022, 2022 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2022. Institute of Electrical and Electronics Engineers Inc., (2022 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2022).

研究成果: Conference contribution › 同行評審

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