奈米科學及工程學士學位學程

Alignment and Transfer of Silver Nanowire Arrays onto Unconventional Substrates for Optoelectronic Devices via Dielectrophoresis Force
Chen, Y. S., Liu, S. Y., Lin, C. C., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 255-256 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).
研究成果: Conference contribution › 同行評審
Aluminum-doped zinc oxide thickness controllable wavelengths in visible light and high responsivity devices using interrupted flow atomic layer deposition
Tseng, P. H., Lai, Y. S., Huang, C. M., Tsai, S. Y. & Ko, F. H., 5月 2024, 於: Journal of Materials Science: Materials in Electronics. 35, 13, 922.
研究成果: Article › 同行評審

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1 引文斯高帕斯（Scopus）
Carbon/Nitrogen Dual-Doped in <100> P-Type Silicon Hard Mask for Wafer Thinning and Dishing Less for Hybrid Bonding
Chen, Y. S., Chiu, T. W., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 75-76 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).
研究成果: Conference contribution › 同行評審

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