國立陽明交通大學

2024

300-Gbit/s/λ PAM8 Modulation with a Silicon Microring Modulator using Long Short Term Memory Regression and Deep Neural Network Classification

Hung, T. Y., Chan, D. W. U., Peng, C. W., Chow, C. W., Yeh, C. H. & Tsang, H. K., 2024, 2024 Optical Fiber Communications Conference and Exhibition, OFC 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 Optical Fiber Communications Conference and Exhibition, OFC 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

31.2 A Ripple-Less Buck Converter with Sub -21.94dB EVM for 5G Low Earth Orbit Application

Kao, Y. H., Wu, J. L., Huang, W. C., Chang, H. H., Tsai, H. Y., Guo, R. B., Chen, K. H., Zeng, K. L., Lin, Y. H., Lin, S. R. & Tsai, T. Y., 2024, 2024 IEEE International Solid-State Circuits Conference, ISSCC 2024. Institute of Electrical and Electronics Engineers Inc., p. 498-500 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

31.4 98.7% Efficiency 1200V-to-48V LLC Converter with CC/CV Mode Charging Compliant with EVSE Level 1

Wang, T. W., Hung, S. H., Chiu, P. J., Chen, C. Y., Go, C. L., Huang, Y. T., Wu, X. Q., Chen, K. H., Zeng, K. L., Lin, Y. H., Lin, S. R. & Tsai, T. Y., 2024, 2024 IEEE International Solid-State Circuits Conference, ISSCC 2024. Institute of Electrical and Electronics Engineers Inc., p. 502-504 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

研究成果: Conference contribution › 同行評審

8.11 A 48V-to-5V Buck Converter with Triple EMI Suppression Circuit Meeting CISPR 25 Automotive Standards

Kao, Y. H., Hung, C. S., Chang, H. H., Huang, W. C., Guo, R. B., Tsai, H. Y., Chen, K. H., Zeng, K. L., Lin, Y. H., Lin, S. R. & Tsai, T. Y., 2024, 2024 IEEE International Solid-State Circuits Conference, ISSCC 2024. Institute of Electrical and Electronics Engineers Inc., p. 164-166 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

研究成果: Conference contribution › 同行評審

A 101-dB SFDR 98.5-dB DR 20-kHz BW Continuous Time Incremental Δ∑ ADC with FIR DAC and Robust Reset Timing for Sensor Interfaces

Wei, C. E., Wang, C. W., Hung, C. H., Wang, C. H., Chou, C. T., Hung, D. S., Lu, G. W. & Chen, C. H., 2024, 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

A 128 Gb/s LDPC Decoder Using Partial Syndrome-based Dynamic Decoding Scheme for Terahertz Wireless Multi-Media Networks

Wu, T. H., Yeh, C. L., Huang, Y. S. & Jou, S. J., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

A 2.56-μs Dynamic Range, 31.25-ps Resolution 2-D Vernier Digital-to-Time Converter (DTC) for Cell-Monitoring

Liu, H. Y., Lai, L. H., Lin, W. Y., Lu, Y. W., Lin, Y. W. & Lee, C. Y., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

A 28nm Energy-Area-Efficient Row-based pipelined Training Accelerator with Mixed FXP4/FP16 for On-Device Transfer Learning

Lu, W., Pei, H. H., Yu, J. R., Chen, H. M. & Huang, P. T., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

A 4-7 GHz Broadband Cryogenic GaAs mHEMT LNA with a Flatness Gain Variation of ±1.2 dB

Li, C. H., Su, T. H. & Kuo, C. N., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

A 4H-SiC Trench MOS Capacitor Structure for Sidewall Oxide Characteristics Measurement

Huang, H. L., Hsuesh, L. T., Tu, Y. C. & Tsui, B. Y., 2024, 2024 IEEE 36th International Conference on Microelectronic Test Structures, ICMTS 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE International Conference on Microelectronic Test Structures).

研究成果: Conference contribution › 同行評審

A 99.4 dB SFDR 91.9 dB DR Continuous-Time Incremental Delta-Sigma ADC with a Noise-Shaping SAR Quantizer and a Passive Input Feedforward Stabilization Path

Wei, C. E., Kuo, S. C. & Chen, C. H., 2024, 2024 IEEE Custom Integrated Circuits Conference, CICC 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings of the Custom Integrated Circuits Conference).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

A BIOMIMETIC ROBOTIC SYSTEM WITH TENSEGRITY-BASED COMPLIANT MECHANISM

Hsieh, P. Y. & Hou, J. H., 2024, Accelerated Design - 29th International Conference on Computer-Aided Architectural Design Research in Asia, CAADRIA 2024. Gardner, N., Herr, C. M., Wang, L., Toshiki, H. & Khan, S. A. (編輯). The Association for Computer-Aided Architectural Design Research in Asia, p. 131-140 10 p. (Proceedings of the International Conference on Computer-Aided Architectural Design Research in Asia; 卷 3).

研究成果: Conference contribution › 同行評審

A Cluster-based Privacy-Enhanced Hierarchical Federated Learning Framework with Secure Aggregation

Lin, C. Y., Han, C. H., Yin, W. C. & Kuo, T. T., 2024, 2024 International Conference on Computing, Networking and Communications, ICNC 2024. Institute of Electrical and Electronics Engineers Inc., p. 994-999 6 p. (2024 International Conference on Computing, Networking and Communications, ICNC 2024).

研究成果: Conference contribution › 同行評審

A comparative study of detecting relative glycation of porcine oral mucosa and skin

Kamely, N., Mondal, S., Roy, M., Lin, M. C., Leu, C. Y., Nair, A., Lou, P. J., Chen, S. J. & Dong, C. Y., 2024, Multiphoton Microscopy in the Biomedical Sciences XXIV 2024. Periasamy, A., So, P. T. & Konig, K. (編輯). SPIE, 128470L. (Progress in Biomedical Optics and Imaging - Proceedings of SPIE; 卷 12847).

研究成果: Conference contribution › 同行評審

ADL Simulation with Abnormal Behavior of Mild Cognitive Impairment Sufferers

Li, J. H., Wang, H. C. & Chan, C. T., 2024, Proceedings of the 2024 10th International Conference on Applied System Innovation, ICASI 2024. Chang, S.-J., Young, S.-J., Lam, A. D.K.-T., Ji, L.-W. & Prior, S. D. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 208-210 3 p. (Proceedings of the 2024 10th International Conference on Applied System Innovation, ICASI 2024).

研究成果: Conference contribution › 同行評審

A GaN-based Doherty Power Amplifier for 5G Basestation Applications

Tsao, Y. F., Hsu, H. T. & Huang, J. J., 2024, 15th Global Symposium on Millimeter-Waves and Terahertz, GSMM 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 228-230 3 p. (15th Global Symposium on Millimeter-Waves and Terahertz, GSMM 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

A GaN-Based Gate Driver with Adaptive Charge Sharing Bootstrap Technique to Improve the Conduction Loss

Sun, T. W., Hsu, Y. T., Tsai, T. H. & Chang, C. C., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

A Hardware-Friendly Alternative to Softmax Function and Its Efficient VLSI Implementation for Deep Learning Applications

Hsieh, M. H., Li, X. H., Huang, Y. H., Kuo, P. H. & Huang, J. D., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

A Highly Reliable PPG Authentication System Based on an Improved AI Model with Dynamic Weighted Triplet Loss Function

Yang, Y. & Fang, W. C., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

A Ka- to W-Band Tightly Coupled Array Antenna-in-Package Using Glass IPD for Ultrawideband mmWave Wireless Communication

Chiang, C. W., Khiabani, N., Gao, D., Kuo, C. N., Kuan, Y. C. & Wu, C. T. M., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

Alignment and Transfer of Silver Nanowire Arrays onto Unconventional Substrates for Optoelectronic Devices via Dielectrophoresis Force

Chen, Y. S., Liu, S. Y., Lin, C. C., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 255-256 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).

研究成果: Conference contribution › 同行評審

A Low-Power Resonance Detector for Output Power Optimization in Wireless Power Transfer Systems

Yao, D. H., Ting, C. W., Yang, F. B. & Chen, P. H., 2024, Proceedings of 2024 IEEE Wireless Power Technology Conference and Expo, WPTCE 2024. Institute of Electrical and Electronics Engineers Inc., p. 678-681 4 p. (Proceedings of 2024 IEEE Wireless Power Technology Conference and Expo, WPTCE 2024).

研究成果: Conference contribution › 同行評審

A Multi-Bit Near-RRAM based Computing Macro with Highly Computing Parallelism for CNN Application

Lin, K. C., Zuo, H., Wang, H. Y., Huang, Y. P., Wu, C. H., Guo, Y. C., Jou, S. J., Hou, T. H. & Chang, T. S., 2024, 2024 Design, Automation and Test in Europe Conference and Exhibition, DATE 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings -Design, Automation and Test in Europe, DATE).

研究成果: Conference contribution › 同行評審

Analysis of Event-Based Camera’s Potential for In-Flight Measurement on Hypersonic Test Vehicles

Tan, J. M., Hsu, K., Wang, M. H., Tan, Z. P. & Currao, G. M. D., 2024, AIAA SciTech Forum and Exposition, 2024. American Institute of Aeronautics and Astronautics Inc, AIAA, (AIAA SciTech Forum and Exposition, 2024).

研究成果: Conference contribution › 同行評審

Analysis of the Characteristics of Different Peer-To-Peer Risky Loans

Jin, B. H., Li, Y. M. & Ho, K. T., 2024, Information Systems and Technologies - WorldCIST 2023. Rocha, A., Adeli, H., Dzemyda, G., Moreira, F. & Colla, V. (編輯). Springer Science and Business Media Deutschland GmbH, p. 97-105 9 p. (Lecture Notes in Networks and Systems; 卷 799 LNNS).

研究成果: Conference contribution › 同行評審

Analysis of Vehicle-Bridge Interaction Using Advanced Vehicle Model

Yang, J. P. & Feng, T. Y., 2024, Proceedings of the 6th International Conference on Smart Monitoring, Assessment and Rehabilitation of Civil Structures. Gu, X.-L., Motavalli, M., Ilki, A. & Yu, Q.-Q. (編輯). Springer Science and Business Media Deutschland GmbH, p. 981-986 6 p. (Lecture Notes in Civil Engineering; 卷 259).

研究成果: Conference contribution › 同行評審

Analyzing the Use of Scaffolding Based on Different Learning Styles to Enhance the Effectiveness of Game-Based Learning

Wang, H. M., Fang, W. L. & Sun, C. T., 2024, Methods and Applications for Modeling and Simulation of Complex Systems - 22nd Asia Simulation Conference, AsiaSim 2023, Proceedings. Hassan, F., Sunar, N., Mohd Basri, M. A., Mahmud, M. S. A., Ishak, M. H. I. & Mohamed Ali, M. S. (編輯). Springer Science and Business Media Deutschland GmbH, p. 362-376 15 p. (Communications in Computer and Information Science; 卷 1912 CCIS).

研究成果: Conference contribution › 同行評審

An Ambient Energy Harvesting Interface for Battery-Free Wireless Sensor Nodes

Liu, C. W., Huang, C. S., Lo, W. P. & Chen, P. H., 2024, Proceedings of 2024 IEEE Wireless Power Technology Conference and Expo, WPTCE 2024. Institute of Electrical and Electronics Engineers Inc., p. 459-462 4 p. (Proceedings of 2024 IEEE Wireless Power Technology Conference and Expo, WPTCE 2024).

研究成果: Conference contribution › 同行評審

An Edge AI Accelerator Design Based on HDC Model for Real-time EEG-based Emotion Recognition System with RISC-V FPGA Platform

Li, J. Y. & Fang, W. C., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

An Empirical Analysis of Gumbel MuZero on Stochastic and Deterministic Einstein Würfelt Nicht!

Kuo, C. L., Chen, P. T., Guei, H., Sung, D. R., Hsueh, C. H., Wu, T. R. & Wu, I. C., 2024, Technologies and Applications of Artificial Intelligence - 28th International Conference, TAAI 2023, Proceedings. Lee, C.-Y., Lin, C.-L. & Chang, H.-T. (編輯). Springer Science and Business Media Deutschland GmbH, p. 329-342 14 p. (Communications in Computer and Information Science; 卷 2074 CCIS).

研究成果: Conference contribution › 同行評審

An Empirical Evaluation of the Calibration of Auditory Distance Perception under Different Levels of Virtual Environment Visibilities

Lin, W. Y., Venkatakrishnan, R., Venkatakrishnan, R., Babu, S. V., Pagano, C. & Lin, W. C., 2024, Proceedings - 2024 IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2024. Institute of Electrical and Electronics Engineers Inc., p. 690-700 11 p. (Proceedings - 2024 IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2024).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

An RRAM-Based 40.6 TOPS/W Energy-Efficient AI Inference Accelerator with Quad Neuromorphic-Processor-Unit for Highly Contrast Recognition

Lin, Y. L., Liu, Y. R., Kao, T. C., Lee, M. Y., Guo, J. C., Hou, T. H. & Chung, S. S., 2024, 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

A PNEUMATIC SYSTEM DESIGN TOOLKIT FOR LEARNING AND CREATIVE APPLICATIONS

Chen, H. & Hou, J. H., 2024, Accelerated Design - 29th International Conference on Computer-Aided Architectural Design Research in Asia, CAADRIA 2024. Gardner, N., Herr, C. M., Wang, L., Toshiki, H. & Khan, S. A. (編輯). The Association for Computer-Aided Architectural Design Research in Asia, p. 371-380 10 p. (Proceedings of the International Conference on Computer-Aided Architectural Design Research in Asia; 卷 3).

研究成果: Conference contribution › 同行評審

Application of Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique on Different Oriented Wafers for Monolithic 3DIC Integration

Shih, B. J., Pan, Y. M., Wang, C. Y., Chiu, H. Y., Yang, C. C., Shen, C. H., Cheng, H. C. & Chen, K. N., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 2167-2171 5 p. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution › 同行評審

A Programmable CMOS Dielectrophoresis Array Chip with 128 × 128 Electrodes for Cell Manipulation

Lin, W. Y., Lai, L. H., Lin, Y. W. & Lee, C. Y., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

Arbitrary-Resolution and Arbitrary-Scale Face Super-Resolution with Implicit Representation Networks

Tsai, Y. T., Wei Chen, Y., Shuai, H. H. & Huang, C. C., 3 1月 2024, Proceedings - 2024 IEEE Winter Conference on Applications of Computer Vision, WACV 2024. Institute of Electrical and Electronics Engineers Inc., p. 4258-4267 10 p. (Proceedings - 2024 IEEE Winter Conference on Applications of Computer Vision, WACV 2024).

研究成果: Conference contribution › 同行評審

A Resistor-Based High-Resolution Temperature-to-Digital Converter

Lee, R. S., Lam, C. H., Chen, W. H., Liu, C. F., Tsai, C. Y., Lu, C. J. & Chen, C. H., 2024, 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

A Smartphone-based Balance Assessment System for Vestibular Hypofunction

Lin, Y. C., Ting, K. C. & Chan, C. T., 2024, Proceedings of the 2024 10th International Conference on Applied System Innovation, ICASI 2024. Chang, S.-J., Young, S.-J., Lam, A. D.K.-T., Ji, L.-W. & Prior, S. D. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 214-216 3 p. (Proceedings of the 2024 10th International Conference on Applied System Innovation, ICASI 2024).

研究成果: Conference contribution › 同行評審

Assessing Internet Search Models in Predicting Daily New COVID-19 Cases and Deaths in South Korea

Husnayain, A. & Su, E. C. Y., 25 1月 2024, MEDINFO 2023 - The Future is Accessible: Proceedings of the 19th World Congress on Medical and Health Informatics. Bichel-Findlay, J., Otero, P., Scott, P. & Huesing, E. (編輯). IOS Press BV, p. 855-859 5 p. (Studies in Health Technology and Informatics; 卷 310).

研究成果: Conference contribution › 同行評審

開啟存取

ASYMMETRIC CLEAN SEGMENTS-GUIDED SELF-SUPERVISED LEARNING FOR ROBUST SPEAKER VERIFICATION

Gan, C. X., Mak, M. W., Lin, W. & Chien, J. T., 2024, 2024 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 11081-11085 5 p. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings).

研究成果: Conference contribution › 同行評審

開啟存取

ATTENTION-GUIDED ADAPTATION FOR CODE-SWITCHING SPEECH RECOGNITION

Aditya, B., Rohmatillah, M., Tai, L. H. & Chien, J. T., 2024, 2024 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 10256-10260 5 p. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings).

研究成果: Conference contribution › 同行評審

開啟存取

A VAE-Based Data Augmentation Method for Fall Detection System using Wearable Sensor

Tu, Y. C., Wang, H. C., Liu, C. P., Hsieh, C. Y. & Chan, C. T., 2024, Proceedings of the 2024 10th International Conference on Applied System Innovation, ICASI 2024. Chang, S.-J., Young, S.-J., Lam, A. D.K.-T., Ji, L.-W. & Prior, S. D. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 217-219 3 p. (Proceedings of the 2024 10th International Conference on Applied System Innovation, ICASI 2024).

研究成果: Conference contribution › 同行評審

A Versatile 8-Channel High Voltage Stimulator for Comprehensive Neural Stimulation

Lin, K. T. & Ker, M. D., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

A Wideband Linear GaN-on-SiC Power Amplifier using Harmonic-Tuning Technique for 5G NewRadio FR2 Applications

Tsao, Y. F. & Hsu, H. T., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

BEOL-Compatible Ferroelectric Capacitor with Excellent Endurance and Retention by Improving Interface Quality

Teng, L. C., Huang, Y. C., Wang, S. Y., Lin, Y. H. & Chien, C. H., 2024, 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

Best of Both Worlds: Learning Arbitrary-scale Blind Super-Resolution via Dual Degradation Representations and Cycle-Consistency

Weng, S. Y., Yuan, H., Xu, Y. S., Huang, C. C. & Chiu, W. C., 3 1月 2024, Proceedings - 2024 IEEE Winter Conference on Applications of Computer Vision, WACV 2024. Institute of Electrical and Electronics Engineers Inc., p. 1536-1545 10 p. (Proceedings - 2024 IEEE Winter Conference on Applications of Computer Vision, WACV 2024).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Carbon/Nitrogen Dual-Doped in <100> P-Type Silicon Hard Mask for Wafer Thinning and Dishing Less for Hybrid Bonding

Chen, Y. S., Chiu, T. W., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 75-76 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).

研究成果: Conference contribution › 同行評審

Carrier-suppressed Silicon IQ Modulator at 75 Gbaud

Chan, D. W. U., Wu, X., Tong, Y., Chow, C. W., Lu, C., Tao Lau, A. P. & Ki Tsang, H., 2024, 2024 IEEE Silicon Photonics Conference, SiPhotonics 2024 - Proceedings. IEEE Computer Society, (IEEE International Conference on Group IV Photonics GFP).

研究成果: Conference contribution › 同行評審

Channel Estimation and Equalization Design with SNR Decision Based Universal Threshold for Sub-THz Single Carrier Baseband Receiver

Liao, F. J., Tu, C. L. & Jou, S. J., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

Characterization of Surface Activation on Nanotwinned Copper and SiCN by using Ar and N₂ Plasma

Lee, R. J., He, P. S., Chiu, W. L., Chang, H. H., Hsu, W. Y. & Chen, C., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 77-78 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).

研究成果: Conference contribution › 同行評審

國立陽明交通大學

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