每年專案
指紋
查看啟用 前瞻半導體研究所 的研究主題。這些主題標籤來自此機構會員的作品。共同形成了獨特的指紋。
過去五年中的合作和熱門研究領域
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
專案
- 4 已完成
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111年度晶片前瞻技術模組教材發展計畫-前瞻製程：三維鰭式電晶體全客製化電路設計
Tsai, T.-H. (PI)
1/10/22 → 30/09/23
研究計畫: Ministry of Education(Include School)
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整合水平與垂直電晶體之次二奈米技術節點L型互補式場效電晶體(L-CFET)的製作與設計
Lee, Y.-J. (PI)
1/08/22 → 31/07/23
研究計畫: Other Government Ministry Institute
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A GaN-Based Gate Driver with Adaptive Charge Sharing Bootstrap Technique to Improve the Conduction Loss
Sun, T. W., Hsu, Y. T., Tsai, T. H. & Chang, C. C., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).研究成果: Conference contribution › 同行評審
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A High-Dynamic-Range Ultrasound Receiver With Dual-Mode Time-Gain Compensation
Chen, G. Y. & Tsai, T. H., 2024, 於: IEEE Sensors Letters. 8, 8, 5502704.研究成果: Article › 同行評審
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A Multi-Bit Near-RRAM based Computing Macro with Highly Computing Parallelism for CNN Application
Lin, K. C., Zuo, H., Wang, H. Y., Huang, Y. P., Wu, C. H., Guo, Y. C., Jou, S. J., Hou, T. H. & Chang, T. S., 2024, 2024 Design, Automation and Test in Europe Conference and Exhibition, DATE 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings -Design, Automation and Test in Europe, DATE).研究成果: Conference contribution › 同行評審