產學創新研究學院

2024

A GaN-based Doherty Power Amplifier for 5G Basestation Applications

Tsao, Y. F., Hsu, H. T. & Huang, J. J., 2024, 15th Global Symposium on Millimeter-Waves and Terahertz, GSMM 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 228-230 3 p. (15th Global Symposium on Millimeter-Waves and Terahertz, GSMM 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

A GaN-Based Gate Driver with Adaptive Charge Sharing Bootstrap Technique to Improve the Conduction Loss

Sun, T. W., Hsu, Y. T., Tsai, T. H. & Chang, C. C., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

A Multi-Bit Near-RRAM based Computing Macro with Highly Computing Parallelism for CNN Application

Lin, K. C., Zuo, H., Wang, H. Y., Huang, Y. P., Wu, C. H., Guo, Y. C., Jou, S. J., Hou, T. H. & Chang, T. S., 2024, 2024 Design, Automation and Test in Europe Conference and Exhibition, DATE 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings -Design, Automation and Test in Europe, DATE).

研究成果: Conference contribution › 同行評審

An RRAM-Based 40.6 TOPS/W Energy-Efficient AI Inference Accelerator with Quad Neuromorphic-Processor-Unit for Highly Contrast Recognition

Lin, Y. L., Liu, Y. R., Kao, T. C., Lee, M. Y., Guo, J. C., Hou, T. H. & Chung, S. S., 2024, 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

A Wideband Linear GaN-on-SiC Power Amplifier using Harmonic-Tuning Technique for 5G NewRadio FR2 Applications

Tsao, Y. F. & Hsu, H. T., 2024, ISCAS 2024 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems).

研究成果: Conference contribution › 同行評審

CMOS-RRAM based In-Memory Hamming Distance Calculation Technique

Kumar, M., Wu, M. H., Hou, T. H. & Suri, M., 2024, IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024. Institute of Electrical and Electronics Engineers Inc., (IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024).

研究成果: Conference contribution › 同行評審

NYCU-NLP at EXALT 2024: Assembling Large Language Models for Cross-Lingual Emotion and Trigger Detection

Lin, T. M., Xu, Z. Y., Zhou, J. Y. & Lee, L. H., 2024, WASSA 2024 - 14th Workshop on Computational Approaches to Subjectivity, Sentiment, and Social Media Analysis, Proceedings of the Workshop. De Clercq, O., Barriere, V., Barnes, J., Klinger, R., Sedoc, J. & Tafreshi, S. (編輯). Association for Computational Linguistics (ACL), p. 505-510 6 p. (WASSA 2024 - 14th Workshop on Computational Approaches to Subjectivity, Sentiment, and Social Media Analysis, Proceedings of the Workshop).

研究成果: Conference contribution › 同行評審

OC-DLRM: Minimizing the I/O Traffic of DLRM Between Main Memory and OCSSD

Ti, S. H., Chen, T. Y., Yeh, T. T., Chen, S. H. & Liang, Y. P., 2024, 2024 Design, Automation and Test in Europe Conference and Exhibition, DATE 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings -Design, Automation and Test in Europe, DATE).

研究成果: Conference contribution › 同行評審

Overview of the SIGHAN 2024 Shared Task for Chinese Dimensional Aspect-Based Sentiment Analysis

Lee, L. H., Yu, L. C., Wang, S. & Liao, J., 2024, SIGHAN 2024 - 10th SIGHAN Workshop on Chinese Language Processing, Proceedings of the Workshop. Wong, K.-F., Zhang, M., Xu, R., Li, J., Wei, Z., Gui, L., Liang, B. & Zhao, R. (編輯). Association for Computational Linguistics (ACL), p. 165-174 10 p. (SIGHAN 2024 - 10th SIGHAN Workshop on Chinese Language Processing, Proceedings of the Workshop).

研究成果: Conference contribution › 同行評審

9 引文斯高帕斯（Scopus）

Perspective Roadmap of Advanced HfO₂-based Ferroelectric Field Effect Transistors

De, S., Cho, C. Y., Ali, T., Banerjee, W., Ramirez, L. P., Barrett, N., Majumder, S. & Hou, T. H., 2024, IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024. Institute of Electrical and Electronics Engineers Inc., (IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024).

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

Reinforcement Learning-Based Read Performance Throttling to Enhance Lifetime of 3D NAND SSD

Liaw, Y. C., Chen, S. H. & Liang, Y. P., 2024, Proceedings - 2024 13th IEEE Non-Volatile Memory Systems and Applications Symposium, NVMSA 2024. Institute of Electrical and Electronics Engineers Inc., (Proceedings - 2024 13th IEEE Non-Volatile Memory Systems and Applications Symposium, NVMSA 2024).

研究成果: Conference contribution › 同行評審

Reinforcement Learning or Simulated Annealing for Analog Placement? A Study based on Bounded-Sliceline Grids

Lin, M. P. H., Lee, C. C. & Hsieh, Y. C., 12 3月 2024, ISPD 2024 - Proceedings of the 2024 International Symposium on Physical Design. Association for Computing Machinery, p. 143-150 8 p. (Proceedings of the International Symposium on Physical Design).

研究成果: Conference contribution › 同行評審

Revocable Attribute-Based Encryption Scheme with Cryptographic Reverse Firewalls

Zhao, Y., Ke, X. Y., Pang, Y. W., Xiong, H., Zhu, G. B. & Yeh, K. H., 2024, Big Data Technologies and Applications - 13th EAI International Conference, BDTA 2023, Proceedings. Tan, Z., Wu, Y. & Xu, M. (編輯). Springer Science and Business Media Deutschland GmbH, p. 79-94 16 p. (Lecture Notes of the Institute for Computer Sciences, Social-Informatics and Telecommunications Engineering, LNICST; 卷 555 LNICST).

研究成果: Conference contribution › 同行評審

Securing Deep Neural Networks on Edge from Membership Inference Attacks Using Trusted Execution Environments

Yang, C. Y., Ramshankar, G., Eliopoulos, N., Jajal, P., Nambiar, S., Miller, E., Zhang, X., Tian, D. J., Chen, S. H., Perng, C. F. & Lu, Y. H., 5 8月 2024, Proceedings of the 29th International Symposium on Low Power Electronics and Design, ISLPED 2024. Association for Computing Machinery, Inc, (Proceedings of the 29th International Symposium on Low Power Electronics and Design, ISLPED 2024).

研究成果: Conference contribution › 同行評審

Spin-Orbit Torque Switching of Mn3Sn in Configuration II

Xu, Z., Zhang, X., Qiao, Y., Liang, G., Shi, S. & Zhu, Z., 2024, 2024 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

The Impact of Thermal Noise in Multi-Domain Hf-based Antiferroelectric Material: Phase Transition and Endurance Performance

Luo, S., Zheng, Z., Zhou, Z., Gong, X. & Liang, G., 2024, 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

Trade-off Between Thermal Budget and Thickness Scaling: A Bottleneck on Quest for BEOL Compatible Ultra-Thin Ferroelectric Films Sub-5nm

Chiu, C. Y., De, S., Cho, C. Y. & Hou, T. H., 2024, IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024. Institute of Electrical and Electronics Engineers Inc., (IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

U-MRAM PUF: A Novel Unipolar-MRAM for Power and Area Efficient Hardware Root of Trust

Shih, C., Hong, M. C., Wang, C. Y., Chen, G. L., Lee, H. H., Chen, K. M., Chiou, B. C., Chang, Y. J., Yang, S. Y., Huang, S. Y., Lo, C. Y., Su, Y. H., Wang, I. J., Shih, C. Y., Chiu, S. C., Hsin, Y. C., Wei, J. H., Sheu, S. S., Lo, W. C. & Chang, S. C. 及其他1, Hou, T. H., 2024, 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

2023

A 60-GHz 27.8-dBm GaN-based Doherty Power Amplifier for V-band Applications

Tsai, J. H., Lin, Y. H., Tsao, Y. F., Wang, Y., Desai, A., Chiu, P. H. & Hsu, H. T., 2023, 2023 Asia-Pacific Microwave Conference, APMC 2023. Institute of Electrical and Electronics Engineers Inc., p. 171-173 3 p. (Asia-Pacific Microwave Conference Proceedings, APMC).

研究成果: Conference contribution › 同行評審

A 94.3 % Peak Power Efficiency Time-Based Buck Converter Using Pulse-Phase-Shift Modes with An Intrinsic Window for Transient Enhancement

Sun, T. W., Hsia, C. E., Tsai, T. H. & Chang, C. C., 2023, Proceedings - International SoC Design Conference 2023, ISOCC 2023. Institute of Electrical and Electronics Engineers Inc., p. 17-18 2 p. (Proceedings - International SoC Design Conference 2023, ISOCC 2023).

研究成果: Conference contribution › 同行評審

A CMOS-MEMS Pressure Sensor with Integrated Front-End for Chemical Vapor Deposition Systems

Tsai, T. H. & Hong, S. Y., 2023, 2023 IEEE SENSORS, SENSORS 2023 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors).

研究成果: Conference contribution › 同行評審

A High-Accuracy Hysteretic DC-DC Converter Using A Spread-Spectrum EMI Suppression Technique with Double Gold Codes

Sun, T. W., Li, M. Z., Tsai, T. H. & Chang, C. C., 2023, 21st IEEE Interregional NEWCAS Conference, NEWCAS 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (21st IEEE Interregional NEWCAS Conference, NEWCAS 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

A High-energy-difference Design for Boltzmann Machine-based Invertible Logic

He, Y., Fang, C., Luo, S. & Liang, G., 2023, 2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

A Novel Fast Recovery Method for HT Tamper in Embedded Processor

Zhou, W., Yuan, S., Li, L. & Yeh, K. H., 2023, Blockchain Technology and Emerging Technologies - 2nd EAI International Conference, BlockTEA 2022, Proceedings. Meng, W. & Li, W. (編輯). Springer Science and Business Media Deutschland GmbH, p. 131-139 9 p. (Lecture Notes of the Institute for Computer Sciences, Social-Informatics and Telecommunications Engineering, LNICST; 卷 498 LNICST).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Application of Wafer Defect Pattern Classification Model in the Semiconductor Industry

Lee, C. W., Hládek, D., Pleva, M., Liao, Y. F. & Su, M. H., 2023, 2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2023. Institute of Electrical and Electronics Engineers Inc., p. 2173-2177 5 p. (2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2023).

研究成果: Conference contribution › 同行評審

Computation Sourcing in Smart Surveillance Systems for Maximum Information Retrieval

Chen, S. H. & Guo, Z. Y., 2023, 2023 9th International Conference on Applied System Innovation, ICASI 2023. Chang, S.-J., Young, S.-J., Lam, A. D.K.-T., Ji, L.-W. & Prior, S. D. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 175-177 3 p. (2023 9th International Conference on Applied System Innovation, ICASI 2023).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Cryogenic Endurance of Anti-ferroelectric and Ferroelectric Hf_1-xZr_XO_2 for Quantum Computing Applications

Hsiang, K. Y., Lee, J. Y., Lou, Z. F., Chang, F. S., Li, Z. X., Liu, C. W., Hou, T. H., Su, P. & Lee, M. H., 2023, 2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE International Reliability Physics Symposium Proceedings; 卷 2023-March).

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

Demonstration of a Millimeter-wave High-Power Transceiver Module using AlN Interposer

Tsao, Y. F., Wang, Y., Chiu, P. H., Desai, A., Wolf, M., Chevtchenko, S., Würfl, J. & Hsu, H. T., 2023, 2023 Asia-Pacific Microwave Conference, APMC 2023. Institute of Electrical and Electronics Engineers Inc., p. 61-63 3 p. (Asia-Pacific Microwave Conference Proceedings, APMC).

研究成果: Conference contribution › 同行評審

Design of High-RA STT-MRAM for Future Energy-Efficient In-Memory Computing

Hong, M. C., Su, Y. H., Chen, G. L., Hsin, Y. C., Chang, Y. J., Chen, K. M., Yang, S. Y., Wang, I. J., Rahaman, S. Z., Lee, H. H., Wei, J. H., Sheu, S. S., Lo, W. C., Chang, S. C. & Hou, T. H., 2023, 2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Dual-Band Branch Line Coupler-Based Circularly Polarized Antenna for Millimeter-Wave Applications

Desai, A., Tsao, Y. F. & Hsu, H. T., 2023, 2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, AP-S/URSI 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 369-370 2 p. (IEEE Antennas and Propagation Society, AP-S International Symposium (Digest); 卷 2023-July).

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

Enabling Highly-Efficient DNA Sequence Mapping via ReRAM-based TCAM

Lai, Y. S., Chen, S. H. & Chang, Y. H., 2023, 2023 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2023. Institute of Electrical and Electronics Engineers Inc., (Proceedings of the International Symposium on Low Power Electronics and Design; 卷 2023-August).

研究成果: Conference contribution › 同行評審

Exploring Hot/Cold Data Separation for Garbage Collection Efficiency Enhancement on OCSSDs

Tsai, Y. S., Chen, S. H., Liaw, Y. C. & Wu, C. Y., 2023, Proceedings - International SoC Design Conference 2023, ISOCC 2023. Institute of Electrical and Electronics Engineers Inc., p. 241-242 2 p. (Proceedings - International SoC Design Conference 2023, ISOCC 2023).

研究成果: Conference contribution › 同行評審

FeRAM Recovery up to 200 Periods with Accumulated Endurance 1012 Cycles and an Applicable Array Circuit toward Unlimited eNVM Operations

Hsiang, K. Y., Lee, J. Y., Chang, F. S., Lou, Z. F., Li, Z. X., Li, Z. H., Chen, J. H., Liu, C. W., Hou, T. H. & Lee, M. H., 2023, 2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023. Institute of Electrical and Electronics Engineers Inc., (Digest of Technical Papers - Symposium on VLSI Technology; 卷 2023-June).

研究成果: Conference contribution › 同行評審

4 引文斯高帕斯（Scopus）

Ferroelectric Probabilistic Bits based on Thermal Noise induced Randomness for Stochastic Computing

Luo, S., He, Y., Cai, B., Gong, X. & Liang, G., 2023, 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023. Institute of Electrical and Electronics Engineers Inc., (7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023).

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

Fine-Tuning and Evaluation of Question Generation for Slovak Language

Megela, O., Hládek, D., Pleva, M., Staš, J., Su, M. H. & Liao, Y. F., 2023, ROCLING 2023 - Proceedings of the 35th Conference on Computational Linguistics and Speech Processing. Wu, J.-L., Su, M.-H., Huang, H.-H., Tsao, Y., Tseng, H.-C., Chang, C.-H., Lee, L.-H., Liao, Y.-F. & Ma, W.-Y. (編輯). The Association for Computational Linguistics and Chinese Language Processing (ACLCLP), p. 171-178 8 p. (ROCLING 2023 - Proceedings of the 35th Conference on Computational Linguistics and Speech Processing).

研究成果: Conference contribution › 同行評審

First BEOL-compatible, 10 ns-fast, and Durable 55 nm Top-pSOT-MRAM with High TMR (>130%)

Li, K. S., Shieh, J. M., Chen, Y. J., Hsu, C. L., Shen, C. H., Hou, T. H., Lin, C. P., Lai, C. H., Tang, D. D. & Yuan-Chen Sun, J., 2023, 2023 International Electron Devices Meeting, IEDM 2023. Institute of Electrical and Electronics Engineers Inc., (Technical Digest - International Electron Devices Meeting, IEDM).

研究成果: Conference contribution › 同行評審

3 引文斯高帕斯（Scopus）

First BEOL-compatible IGZO Ferroelectic-Modulated Diode with Drastically Enhanced Memory Window: Experiment, Modeling, and Deep Understanding

Jiao, L., Zhou, Z., Zheng, Z., Han, K., Kong, Q., Wang, X., Xu, H., Zhang, J., Sun, C., Kang, Y., Liang, G. & Gong, X., 2023, 2023 International Electron Devices Meeting, IEDM 2023. Institute of Electrical and Electronics Engineers Inc., (Technical Digest - International Electron Devices Meeting, IEDM).

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

FPCIM: A Fully-Parallel Robust ReRAM CIM Processor for Edge AI Devices

Guo, Y. C., Lin, W. T., Hou, T. H. & Chang, T. S., 2023, ISCAS 2023 - 56th IEEE International Symposium on Circuits and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Circuits and Systems; 卷 2023-May).

研究成果: Conference contribution › 同行評審

Guideline of Device Optimization for Ferroelectric InGaZnO Transistor

Chen, Y. H., Wang, I. T., Zheng, Y. M. & Hou, T. H., 2023, 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023. Institute of Electrical and Electronics Engineers Inc., (7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Late Breaking Results: PVT-Sensitive Delay Fitting for High-Performance Computing

Wang, D. H., Hsu, S. H., Yang, S. H., Lin, P. J., Yang, H. T. & Lin, M. P. H., 2023, 2023 60th ACM/IEEE Design Automation Conference, DAC 2023. Institute of Electrical and Electronics Engineers Inc., (Proceedings - Design Automation Conference; 卷 2023-July).

研究成果: Conference contribution › 同行評審

Layout Synthesis of Analog Primitive Cells with Variational Autoencoder

Wang, P. C., Lin, M. P. H., Liu, C. N. J. & Chen, H. M., 2023, Proceedings - 2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design, SMACD 2023. Institute of Electrical and Electronics Engineers Inc., (Proceedings - 2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design, SMACD 2023).

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

Logically Synthesized Invertible Logic Based on Many-body Effects with Probabilistic-bit Implementation

He, Y., Fang, C., Luo, S. & Liang, G., 2023, 2023 Silicon Nanoelectronics Workshop, SNW 2023. Institute of Electrical and Electronics Engineers Inc., p. 39-40 2 p. (2023 Silicon Nanoelectronics Workshop, SNW 2023).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Lowering the Number of Live-Page Copies on Solid State Drives through Trim-Assisted Space Allocation

Liaw, Y. C., Chen, S. H. & Su, H. Y., 2023, Proceedings - International SoC Design Conference 2023, ISOCC 2023. Institute of Electrical and Electronics Engineers Inc., p. 239-240 2 p. (Proceedings - International SoC Design Conference 2023, ISOCC 2023).

研究成果: Conference contribution › 同行評審

Mobile Educational Application for Keystroke Dynamics Identification Systems

Haluska, R., Molcanyi, D., Pleva, M., Hladek, D., Stas, J., Su, M. H. & Liao, Y. F., 2023, ICETA 2023 - 21st Year of International Conference on Emerging eLearning Technologies and Applications, Proceedings. Fejedelem, S. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 165-170 6 p. (ICETA 2023 - 21st Year of International Conference on Emerging eLearning Technologies and Applications, Proceedings).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Named Entity Recognition for Chinese Healthcare Applications

Lee, C. Y., Su, M. H., Pleva, M., Hládek, D. & Liao, Y. F., 2023, 2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 749-750 2 p. (2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

NCUEE-NLP at BioLaySumm Task 2: Readability-Controlled Summarization of Biomedical Articles Using the PRIMERA Models

Chen, C. Y., Yang, J. H. & Lee, L. H., 2023, BioNLP 2023 - BioNLP and BioNLP-ST, Proceedings of the Workshop. Demner-fushman, D., Ananiadou, S. & Cohen, K. (編輯). Association for Computational Linguistics (ACL), p. 586-591 6 p. (Proceedings of the Annual Meeting of the Association for Computational Linguistics).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

NCUEE-NLP at SemEval-2023 Task 7: Ensemble Biomedical LinkBERT Transformers in Multi-evidence Natural Language Inference for Clinical Trial Data

Chen, C. Y., Tien, K. Y., Cheng, Y. H. & Lee, L. H., 2023, 17th International Workshop on Semantic Evaluation, SemEval 2023 - Proceedings of the Workshop. Ojha, A. K., Dogruoz, A. S., Da San Martino, G., Madabushi, H. T., Kumar, R. & Sartori, E. (編輯). Association for Computational Linguistics, p. 776-781 6 p. (17th International Workshop on Semantic Evaluation, SemEval 2023 - Proceedings of the Workshop).

研究成果: Conference contribution › 同行評審

3 引文斯高帕斯（Scopus）

NCUEE-NLP at SemEval-2023 Task 8: Identifying Medical Causal Claims and Extracting PIO Frames Using the Transformer Models

Lee, L. H., Cheng, Y. H., Yang, J. H. & Tien, K. Y., 2023, 17th International Workshop on Semantic Evaluation, SemEval 2023 - Proceedings of the Workshop. Ojha, A. K., Dogruoz, A. S., Da San Martino, G., Madabushi, H. T., Kumar, R. & Sartori, E. (編輯). Association for Computational Linguistics, p. 312-317 6 p. (17th International Workshop on Semantic Evaluation, SemEval 2023 - Proceedings of the Workshop).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

NCUEE-NLP at WASSA 2023 Empathy, Emotion, and Personality Shared Task: Perceived Intensity Prediction Using Sentiment-Enhanced RoBERTa Transformers

Lin, T. M., Chang, J. Y. & Lee, L. H., 2023, WASSA 2023 - 13th Workshop on Computational Approaches to Subjectivity, Sentiment and Social Media Analysis, Proceedings of the Workshop. Barnes, J., De Clercq, O. & Klinger, R. (編輯). Association for Computational Linguistics (ACL), p. 548-552 5 p. (Proceedings of the Annual Meeting of the Association for Computational Linguistics).

研究成果: Conference contribution › 同行評審

3 引文斯高帕斯（Scopus）

Oriental COCOSDA -Country Report 2023 Language Resources Developed in Taiwan

Liao, Y. F. & Wang, H. M., 2023, Proceedings of 2023 26th Conference of the Oriental COCOSDA International Committee for the Co-Ordination and Standardization of Speech Databases and Assessment Techniques, O-COCOSDA 2023. Institute of Electrical and Electronics Engineers Inc., (Proceedings of 2023 26th Conference of the Oriental COCOSDA International Committee for the Co-Ordination and Standardization of Speech Databases and Assessment Techniques, O-COCOSDA 2023).

研究成果: Conference contribution › 同行評審

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