工學院

Engineering

1. Experimental Result 93%
2. Thin Films 85%
3. Piezoelectric 76%
4. Dielectrics 67%
5. Joints (Structural Components) 63%
6. Anisotropic 59%
7. Two Dimensional 56%
8. Finite Element Analysis 55%
9. Nanoparticle 51%
10. Actuator 49%
11. Nanomaterial 43%
12. Nanowire 41%
13. Gallium Arsenide 38%
14. Silicon Dioxide 38%
15. Porosity 37%
16. Boundary Condition 37%
17. Transients 36%
18. Electric Field 35%
19. Microchannel 35%
20. Electromigration 35%
21. Heat Transfer Coefficient 34%
22. Pressure Drop 33%
23. Nanocomposite 33%
24. Flow Velocity 32%
25. Heterojunctions 31%
26. Low-Temperature 31%
27. Green's Functions 31%
28. Flow Distribution 30%
29. Chemical Vapor Deposition 29%
30. Test Result 29%
31. Reynolds' Number 29%
32. Hydraulics 28%
33. Simulation Result 28%
34. Tubes (Components) 28%
35. Engineering 27%
36. Phase Composition 27%
37. Vapor Deposition 27%
38. Heat Flux 27%
39. Room Temperature 27%
40. Flow Rate 25%
41. Numerical Study 25%
42. Resonant Frequency 24%
43. Numerical Example 24%
44. Good Agreement 24%
45. High Resolution 23%
46. Carbon Nanotube 23%
47. Ray Diffraction 23%
48. Indium Gallium Arsenide 23%
49. Magnetic Field 23%
50. Nanoscale 23%
51. Wave Energy 22%
52. Tunnel 22%
53. Nitride 22%
54. Experimental Investigation 22%
55. Si Substrate 22%
56. Power Converter 21%
57. Numerical Model 21%
58. Exchanger 20%
59. Diamond 20%
60. Femtosecond Laser 20%
61. Heat Transfer Enhancement 20%
62. Vortex 20%
63. Singularities 19%
64. Thin-Film Transistor 19%
65. Metallizations 19%
66. Solar Cell 19%
67. Harmonics 19%
68. One Dimensional 18%
69. Thermal Performance 18%
70. Mechanical Property 18%
71. Atmospheric Pressure 18%
72. Computational Fluid Dynamics 18%
73. Time-Domain Reflectometry 18%
74. Quantum Dot 18%
75. Aspect Ratio 17%
76. Heat Resistance 17%
77. Light-Emitting Diode 17%
78. Graphene 17%
79. Temperature Distribution 17%
80. Least Square 16%
81. Fluid Viscosity 16%
82. Conductive 16%
83. Core-Shell 16%
84. Field-Effect Transistor 16%
85. Failure Mechanism 16%
86. Mode Shape 16%
87. Mass Transport 16%
88. Flow Pattern 16%
89. Air Flow 16%
90. Dynamic Response 16%
91. Actuation 16%
92. Interconnects 15%
93. Heterostructures 15%
94. Illustrates 15%
95. Power Density 15%
96. Polysilicon 15%
97. Structural Health Monitoring 15%
98. Laminated Composite Plate 15%
99. Direct Simulation 14%
100. Passivation 14%

Keyphrases

1. Taiwan 100%
2. Three-dimensional (3D) 62%
3. Microstructure 58%
4. Annealing 55%
5. Rutile 51%
6. GaN HEMT 51%
7. Electromigration 48%
8. Two Dimensional 48%
9. High Performance 45%
10. Mechanical Properties 43%
11. Aluminum Oxide 42%
12. Room Temperature 41%
13. Epitaxial 39%
14. Nanostructures 39%
15. Heat Transfer 39%
16. Transmission Electron Microscopy 39%
17. Numerical Simulation 38%
18. In Situ 38%
19. Silica 38%
20. Low Temperature 36%
21. Si Substrate 36%
22. Gallium Arsenide 35%
23. Nanoparticles 34%
24. Electrical Properties 34%
25. Oxides 33%
26. AlGaN-GaN 33%
27. BiFeO3 32%
28. Heterostructure 32%
29. High Electron Mobility Transistor 32%
30. High Temperature 30%
31. Transversely Isotropic 28%
32. Dislocation 27%
33. Metal-organic Chemical Vapor Deposition (MOCVD) 27%
34. Numerical Results 27%
35. Analytical Solution 26%
36. Heat Transfer Coefficient 25%
37. Nanotwinned Cu 25%
38. Carbon Nanotubes 25%
39. Soldering 25%
40. Electric Field (E-field) 25%
41. Nanowires 25%
42. Reynolds number 23%
43. X Ray Diffraction 22%
44. Finite Element Analysis 22%
45. Multiferroics 22%
46. Green's Function 21%
47. Flip Chip Solder Joints 21%
48. Heat Transfer Enhancement 21%
49. Material Properties 21%
50. Numerical Examples 21%
51. Electrolyte 21%
52. Heat Transfer Performance 21%
53. Fin-and-tube Heat Exchanger 21%
54. Solder Joint 20%
55. Graphene 20%
56. Pulsed Laser Deposition 20%
57. Optical Properties 20%
58. High Efficiency 20%
59. Current Density 20%
60. Landslide 20%
61. Quantum Dots 19%
62. Time Domain Reflectometry 19%
63. Pressure Drop 19%
64. Electrical Characteristics 19%
65. Hydrogen Peroxide 19%
66. Wave Energy Converter 19%
67. Magneto-electro-elastic 19%
68. Microbump 18%
69. Temperature Effect 18%
70. Power Conversion Efficiency 18%
71. Molybdenite 18%
72. Ionic Liquid 18%
73. Controller 18%
74. X-ray Photoelectron Spectroscopy 18%
75. Thin-film Transistors 18%
76. Earthquake 18%
77. Copolymer 18%
78. Nanoporous Copper 18%
79. Aquifer 18%
80. Thermal Stability 18%
81. (111)-oriented 18%
82. Scanning Electron Microscopy 18%
83. Atomic Force Microscopy 17%
84. Femtosecond Laser 17%
85. Failure Mechanism 17%
86. Wafer 17%
87. Ultrathin 17%
88. Numerical Model 17%
89. Heat Sink 16%
90. Semiconductors 16%
91. Device Performance 16%
92. Mechanical Behavior 16%
93. Actuator 16%
94. Buffer Layer 16%
95. InGaAs 16%
96. Intermetallic Compounds 16%
97. Surface Morphology 16%
98. Aqueous Solution 16%
99. Phase Transformation 15%
100. HfO2 15%