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國立陽明交通大學研發優勢分析平台 首頁
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工學院
國立陽明交通大學
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03-5725634
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[email protected]
網站
https://coe.nycu.edu.tw/home.jsp?lang=tw
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網路
人員
(93)
計畫
(2910)
研究成果
(11856)
獎項
(180)
活動
(73)
指紋
查看啟用 工學院 的研究主題。這些主題標籤來自此機構會員的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Engineering
Experimental Result
93%
Thin Films
85%
Piezoelectric
76%
Dielectrics
67%
Joints (Structural Components)
63%
Anisotropic
59%
Two Dimensional
56%
Finite Element Analysis
55%
Nanoparticle
51%
Actuator
49%
Nanomaterial
43%
Nanowire
41%
Gallium Arsenide
38%
Silicon Dioxide
38%
Porosity
37%
Boundary Condition
37%
Transients
36%
Electric Field
35%
Microchannel
35%
Electromigration
35%
Heat Transfer Coefficient
34%
Pressure Drop
33%
Nanocomposite
33%
Flow Velocity
32%
Heterojunctions
31%
Low-Temperature
31%
Green's Functions
31%
Flow Distribution
30%
Chemical Vapor Deposition
29%
Test Result
29%
Reynolds' Number
29%
Hydraulics
28%
Simulation Result
28%
Tubes (Components)
28%
Engineering
27%
Phase Composition
27%
Vapor Deposition
27%
Heat Flux
27%
Room Temperature
27%
Flow Rate
25%
Numerical Study
25%
Resonant Frequency
24%
Numerical Example
24%
Good Agreement
24%
High Resolution
23%
Carbon Nanotube
23%
Ray Diffraction
23%
Indium Gallium Arsenide
23%
Magnetic Field
23%
Nanoscale
23%
Wave Energy
22%
Tunnel
22%
Nitride
22%
Experimental Investigation
22%
Si Substrate
22%
Power Converter
21%
Numerical Model
21%
Exchanger
20%
Diamond
20%
Femtosecond Laser
20%
Heat Transfer Enhancement
20%
Vortex
20%
Singularities
19%
Thin-Film Transistor
19%
Metallizations
19%
Solar Cell
19%
Harmonics
19%
One Dimensional
18%
Thermal Performance
18%
Mechanical Property
18%
Atmospheric Pressure
18%
Computational Fluid Dynamics
18%
Time-Domain Reflectometry
18%
Quantum Dot
18%
Aspect Ratio
17%
Heat Resistance
17%
Light-Emitting Diode
17%
Graphene
17%
Temperature Distribution
17%
Least Square
16%
Fluid Viscosity
16%
Conductive
16%
Core-Shell
16%
Field-Effect Transistor
16%
Failure Mechanism
16%
Mode Shape
16%
Mass Transport
16%
Flow Pattern
16%
Air Flow
16%
Dynamic Response
16%
Actuation
16%
Interconnects
15%
Heterostructures
15%
Illustrates
15%
Power Density
15%
Polysilicon
15%
Structural Health Monitoring
15%
Laminated Composite Plate
15%
Direct Simulation
14%
Passivation
14%
Keyphrases
Taiwan
100%
Three-dimensional (3D)
62%
Microstructure
58%
Annealing
55%
Rutile
51%
GaN HEMT
51%
Electromigration
48%
Two Dimensional
48%
High Performance
45%
Mechanical Properties
43%
Aluminum Oxide
42%
Room Temperature
41%
Epitaxial
39%
Nanostructures
39%
Heat Transfer
39%
Transmission Electron Microscopy
39%
Numerical Simulation
38%
In Situ
38%
Silica
38%
Low Temperature
36%
Si Substrate
36%
Gallium Arsenide
35%
Nanoparticles
34%
Electrical Properties
34%
Oxides
33%
AlGaN-GaN
33%
BiFeO3
32%
Heterostructure
32%
High Electron Mobility Transistor
32%
High Temperature
30%
Transversely Isotropic
28%
Dislocation
27%
Metal-organic Chemical Vapor Deposition (MOCVD)
27%
Numerical Results
27%
Analytical Solution
26%
Heat Transfer Coefficient
25%
Nanotwinned Cu
25%
Carbon Nanotubes
25%
Soldering
25%
Electric Field (E-field)
25%
Nanowires
25%
Reynolds number
23%
X Ray Diffraction
22%
Finite Element Analysis
22%
Multiferroics
22%
Green's Function
21%
Flip Chip Solder Joints
21%
Heat Transfer Enhancement
21%
Material Properties
21%
Numerical Examples
21%
Electrolyte
21%
Heat Transfer Performance
21%
Fin-and-tube Heat Exchanger
21%
Solder Joint
20%
Graphene
20%
Pulsed Laser Deposition
20%
Optical Properties
20%
High Efficiency
20%
Current Density
20%
Landslide
20%
Quantum Dots
19%
Time Domain Reflectometry
19%
Pressure Drop
19%
Electrical Characteristics
19%
Hydrogen Peroxide
19%
Wave Energy Converter
19%
Magneto-electro-elastic
19%
Microbump
18%
Temperature Effect
18%
Power Conversion Efficiency
18%
Molybdenite
18%
Ionic Liquid
18%
Controller
18%
X-ray Photoelectron Spectroscopy
18%
Thin-film Transistors
18%
Earthquake
18%
Copolymer
18%
Nanoporous Copper
18%
Aquifer
18%
Thermal Stability
18%
(111)-oriented
18%
Scanning Electron Microscopy
18%
Atomic Force Microscopy
17%
Femtosecond Laser
17%
Failure Mechanism
17%
Wafer
17%
Ultrathin
17%
Numerical Model
17%
Heat Sink
16%
Semiconductors
16%
Device Performance
16%
Mechanical Behavior
16%
Actuator
16%
Buffer Layer
16%
InGaAs
16%
Intermetallic Compounds
16%
Surface Morphology
16%
Aqueous Solution
16%
Phase Transformation
15%
HfO2
15%