工學院

Engineering

1. Experimental Result 93%
2. Thin Films 85%
3. Piezoelectric 73%
4. Energy Engineering 67%
5. Dielectrics 64%
6. Joints (Structural Components) 62%
7. Anisotropic 57%
8. Two Dimensional 55%
9. Finite Element Analysis 55%
10. Computer Simulation 51%
11. Nanoparticle 50%
12. Nanomaterial 42%
13. Nanowire 42%
14. Gallium Arsenide 38%
15. Boundary Condition 36%
16. Porosity 36%
17. Silicon Dioxide 36%
18. Transients 35%
19. Electromigration 35%
20. Heat Transfer Coefficient 33%
21. Nanocomposite 33%
22. Pressure Drop 32%
23. Flow Velocity 32%
24. Microchannel 32%
25. Electric Field 31%
26. Flow Distribution 31%
27. Green's Functions 30%
28. Low-Temperature 30%
29. Hydraulics 29%
30. Heterojunctions 29%
31. Chemical Vapor Deposition 29%
32. Phase Composition 28%
33. Test Result 28%
34. Tubes (Components) 28%
35. Simulation Result 28%
36. Room Temperature 27%
37. Reynolds' Number 27%
38. Engineering 27%
39. Vapor Deposition 27%
40. Heat Flux 26%
41. Flow Rate 25%
42. Resonant Frequency 24%
43. Good Agreement 24%
44. Numerical Study 24%
45. Numerical Example 24%
46. Indium Gallium Arsenide 23%
47. Carbon Nanotube 22%
48. Internals 22%
49. Wave Energy 22%
50. Magnetic Field 22%
51. Si Substrate 22%
52. High Resolution 21%
53. Experimental Investigation 21%
54. Ray Diffraction 21%
55. Power Converter 21%
56. Numerical Model 20%
57. Singularities 20%
58. Diamond 20%
59. Heat Transfer Enhancement 20%
60. Exchanger 20%
61. Nanoscale 20%
62. Vortex 20%
63. Nitride 20%
64. Metallizations 19%
65. Thin-Film Transistor 19%
66. Femtosecond Laser 18%
67. Mechanical Property 18%
68. Solar Cell 18%
69. One Dimensional 18%
70. Thermal Performance 18%
71. Computational Fluid Dynamics 18%
72. Time-Domain Reflectometry 18%
73. Quantum Dot 18%
74. Harmonics 17%
75. Light-Emitting Diode 17%
76. Actuation 17%
77. Atmospheric Pressure 17%
78. Conductive 17%
79. Temperature Distribution 17%
80. Heat Resistance 17%
81. Least Square 16%
82. Graphene 16%
83. Field-Effect Transistor 16%
84. Mode Shape 16%
85. Flow Pattern 16%
86. Core-Shell 16%
87. Mass Transfer 16%
88. Polysilicon 16%
89. Air Flow 16%
90. Aspect Ratio 16%
91. Fluid Viscosity 16%
92. Interconnects 15%
93. Laminated Composite Plate 15%
94. Illustrates 15%
95. Direct Simulation 15%
96. Failure Mechanism 15%
97. Heterostructures 14%
98. Atomic Layer Deposition 14%
99. Free Vibration 14%
100. Current Drain 14%

Keyphrases

1. Taiwan 100%
2. Three-dimensional (3D) 63%
3. Microstructure 59%
4. Annealing 54%
5. Rutile 50%
6. Electromigration 49%
7. GaN HEMT 49%
8. Two Dimensional 47%
9. High Performance 44%
10. Aluminum Oxide 43%
11. Mechanical Properties 42%
12. Room Temperature 40%
13. Heat Transfer 40%
14. Nanostructures 40%
15. Epitaxial 39%
16. Transmission Electron Microscopy 39%
17. In Situ 38%
18. Numerical Simulation 37%
19. Silica 37%
20. Low Temperature 36%
21. Si Substrate 36%
22. Gallium Arsenide 36%
23. Nanoparticles 35%
24. Electrical Properties 34%
25. Oxides 33%
26. BiFeO3 32%
27. AlGaN-GaN 32%
28. Heterostructure 31%
29. High Temperature 30%
30. High Electron Mobility Transistor 29%
31. Dislocation 27%
32. Metal-organic Chemical Vapor Deposition (MOCVD) 27%
33. Transversely Isotropic 27%
34. Numerical Results 26%
35. Analytical Solution 26%
36. Heat Transfer Coefficient 26%
37. Soldering 25%
38. Nanowires 25%
39. Nanotwinned Cu 25%
40. Carbon Nanotubes 25%
41. Electric Field (E-field) 24%
42. X Ray Diffraction 22%
43. Reynolds number 22%
44. Finite Element Analysis 22%
45. Multiferroics 22%
46. Flip Chip Solder Joints 22%
47. Green's Function 21%
48. Heat Transfer Enhancement 21%
49. Numerical Examples 21%
50. Material Properties 21%
51. Electrolyte 21%
52. Heat Transfer Performance 21%
53. Fin-and-tube Heat Exchanger 21%
54. Solder Joint 21%
55. Graphene 20%
56. High Efficiency 20%
57. Optical Properties 20%
58. Pulsed Laser Deposition 20%
59. Current Density 20%
60. Quantum Dots 20%
61. Time Domain Reflectometry 20%
62. Molybdenite 19%
63. Pressure Drop 19%
64. Landslide 19%
65. Electrical Characteristics 19%
66. Thin-film Transistors 19%
67. Hydrogen Peroxide 19%
68. Magneto-electro-elastic 19%
69. Microbump 19%
70. Wave Energy Converter 18%
71. Ionic Liquid 18%
72. Controller 18%
73. X-ray Photoelectron Spectroscopy 18%
74. Temperature Effect 18%
75. Power Conversion Efficiency 18%
76. Copolymer 18%
77. Thermal Stability 18%
78. Scanning Electron Microscopy 18%
79. Aquifer 18%
80. Earthquake 17%
81. Nanoporous Copper 17%
82. Atomic Force Microscopy 17%
83. Wafer 17%
84. (111)-oriented 17%
85. Heat Sink 16%
86. Semiconductors 16%
87. Actuator 16%
88. Numerical Model 16%
89. Device Performance 16%
90. Buffer Layer 16%
91. InGaAs 16%
92. Intermetallic Compounds 16%
93. HfO2 16%
94. Aqueous Solution 16%
95. Femtosecond Laser 16%
96. Failure Mechanism 16%
97. Bump 15%
98. Ultrathin 15%
99. Stiffness 15%
100. Airside Performance 15%