每年研究成果
每年研究成果
- 5結果
搜尋結果
-
2025
Future novel memory device fabrication, heterogenous integration and packaging innovations
Gan, C. L., Huang, C. Y., Chen, K. N., Badwe, N. U. & Zhang, S., 1月 2025, 於: Materials Science in Semiconductor Processing. 185, 108998.研究成果: Editorial
-
2024
Preface
Kulkarni, J., Desai, A., Hsu, H. T., Garner, B., Li, Y., Sim, C. Y. D. & Dhasarathan, V., 2024, 於: EAI/Springer Innovations in Communication and Computing. Part F1590, p. v-viii研究成果
-
2022
Editorial: Advances in the fundamental understanding and prospects for practical applications of high-entropy materials
Santodonato, L. J., Huang, E. W., Kulovits, A. & Liaw, P. K., 7 9月 2022, 於: Frontiers in Materials. 9, 986097.研究成果
開啟存取 -
2020
A Density Metric for Semiconductor Technology
Wong, H. S. P., Akarvardar, K., Antoniadis, D., Bokor, J., Hu, C., King-Liu, T. J., Mitra, S., Plummer, J. D. & Salahuddin, S., 4月 2020, 於: Proceedings of the IEEE. 108, 4, p. 478-482 5 p., 9063714.研究成果: Editorial
38 引文 斯高帕斯（Scopus） -
2018
Preface
Chang, E. Y., 8 3月 2018, 於: IOP Conference Series: Materials Science and Engineering. 311, 1, 011001.研究成果
開啟存取