智慧半導體奈米系統技術研究中心

2024

Surface Modification by Wet Treatment for Low-Temperature Cu/SiO₂ Hybrid Bonding

Chen, Y. A., Ong, J. J., Chiu, W. L., Chang, H. H. & Chen, C., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 115-116 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).

研究成果: Conference contribution › 同行評審

Synthetic Antiferromagnetic/Ferromagnetic Spin-Orbit Torque Devices with an Oxide Spacer

Huang, Y. H., Cheng, C. W., Hsu, J., Wu, Y. H., Lin, Y. L., Chang, W. Y. & Tseng, Y. C., 2024, 2024 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2024 - Proceedings).

研究成果: Conference contribution › 同行評審

The Effect of Electromigration and Stress Migration on NT-Cu RDLs Passivated with Titanium Dioxide

Lin, Y. Q., Tang, C. Y., Hung, Y. W., Lin, Y. Y. & Chen, C., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 155-156 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).

研究成果: Conference contribution › 同行評審

The Effects of Al₂O₃Interlayer on the Ferroelectric Behavior of Hf_0.5Zr_0.5O₂Thin Film for E-mode Ferroelectric Charge Trap Gate GaN HEMT

Wu, J. S., Yang, T. Y., Weng, Y. C., Yang, C. Y., Du, Y. T., Wei, Y. H. & Chang, E. Y., 2024, 2024 16th IEEE International Conference on Semiconductor Electronics, ICSE 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 68-71 4 p. (IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE).

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

The Enhancement in the Reliability of Nanotwinned Cu Redistribution Lines Passivated with Immersion Sn and Ag

Hung, Y. W., Lin, Y. Q. & Chen, C., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 103-104 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).

研究成果: Conference contribution › 同行評審

Threshold Voltage Instability of GaN HEMTs with Thin Barrier AlGaN Technology

Yang, T. Y., Wu, J. S., Weng, Y. C., Yang, C. Y. & Chang, E. Y., 2024, 2024 16th IEEE International Conference on Semiconductor Electronics, ICSE 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 75-77 3 p. (IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE).

研究成果: Conference contribution › 同行評審

Validation of Dynamically Depleted Symmetric BSIM-SOI Compact model for RF SOI T/R Switch Applications

Nandi, D., Dabhi, C. K., Rajasekaran, D., Karumuri, N., Turuvekere, S., Swaminathan, B., Srihari, S., Dutta, A., Hu, C. & Chauhan, Y. S., 2024, IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024. Institute of Electrical and Electronics Engineers Inc., (IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024).

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

Viability Analysis of Liquid Metals for Planar Antenna Design at mm-wave 5G Applications

Shreyanth, C. K., Karthikeya, G. S., Desai, A., Tsao, Y. F., Morab, F. & Hsu, H. T., 2024, Proceedings - ICNEWS 2024: 2nd International Conference on Networking, Embedded and Wireless Systems: Wireless Technology - Building a Digital World. Institute of Electrical and Electronics Engineers Inc., (Proceedings - ICNEWS 2024: 2nd International Conference on Networking, Embedded and Wireless Systems: Wireless Technology - Building a Digital World).

研究成果: Conference contribution › 同行評審

WKB model of ferroelectric tunnel junctions for memory applications: voltage-dependent screening and electrostriction effects

Jagga, D., De, S. & Useinov, A., 2024, IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024. Institute of Electrical and Electronics Engineers Inc., (IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024).

研究成果: Conference contribution › 同行評審

2023

A 60-GHz 27.8-dBm GaN-based Doherty Power Amplifier for V-band Applications

Tsai, J. H., Lin, Y. H., Tsao, Y. F., Wang, Y., Desai, A., Chiu, P. H. & Hsu, H. T., 2023, 2023 Asia-Pacific Microwave Conference, APMC 2023. Institute of Electrical and Electronics Engineers Inc., p. 171-173 3 p. (Asia-Pacific Microwave Conference Proceedings, APMC).

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

Aggressively Scaled Atomic Layer Deposited Amorphous InZnO_xThin Film Transistor Exhibiting Prominent Short Channel Characteristics (SS= 69 mV/dec.; DIBL = 27.8 mV/V) and High G_m(802 μS/μm at V_DS= 2V)

Liang, Y. K., Zheng, J. Y., Lin, Y. L., Li, W. L., Lu, Y. C., Hsieh, D. R., Peng, L. C., Chou, T. T., Kei, C. C., Lu, C. C., Huang, H. Y., Tseng, Y. C., Chao, T. S., Chang, E. Y. & Lin, C. H., 2023, 2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023. Institute of Electrical and Electronics Engineers Inc., (Digest of Technical Papers - Symposium on VLSI Technology; 卷 2023-June).

研究成果: Conference contribution › 同行評審

9 引文斯高帕斯（Scopus）

Analysis and Design of Stacked-Nanosheet FeFET Synapse Conductance Response under Identical Pulse Scheme for Neuromorphic Applications

Lin, H. L. & Su, P., 2023, 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023. Institute of Electrical and Electronics Engineers Inc., (7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

A New Methodology to Precisely Induce Wake-Up for Reliability Assessment of Ferroelectric Devices

Tan, T. T., Wang, Y. Y., Tan, J., Wu, T. L., Raghavan, N. & Pey, K. L., 2023, 2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE International Reliability Physics Symposium Proceedings; 卷 2023-March).

研究成果: Conference contribution › 同行評審

An Improved Robust Infinitely Differentiable Drift Resistance Model for BSIM High Voltage Compact Model

Singhal, A., Gill, G., Pahwa, G., Hu, C. & Agarwal, H., 2023, 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023. Institute of Electrical and Electronics Engineers Inc., (7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Cascode GaN HEMT Gate Driving Analysis

Heumesser, V., Lai, J. S., Hsieh, H. C., Hsu, J., Yang, C. Y., Chang, E. Y., Liu, C. Y., Chieng, W. H. & Hsieh, Y. T., 2023, WiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia. Institute of Electrical and Electronics Engineers Inc., (WiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia).

研究成果: Conference contribution › 同行評審

開啟存取

2 引文斯高帕斯（Scopus）

Comparisons of Performance and Reliability in 4H-SiC Tri-gate and Planar MOSFETs

Hu, J. W., Lu, T. Y., Kang, K. M., Huang, C. F., Chen, B. R. & Wu, T. L., 2023, WiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia. Institute of Electrical and Electronics Engineers Inc., (WiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia).

研究成果: Conference contribution › 同行評審

Cryogenic Characterization and Model Extraction of 5nm Technology Node FinFETs

Parihar, S. S., Pahwa, G., Huang, J. Z., Wang, W., Imura, K., Hu, C. & Chauhan, Y. S., 2023, 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023. Institute of Electrical and Electronics Engineers Inc., (7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023).

研究成果: Conference contribution › 同行評審

5 引文斯高帕斯（Scopus）

Cryogenic Endurance of Anti-ferroelectric and Ferroelectric Hf_1-xZr_XO_2 for Quantum Computing Applications

Hsiang, K. Y., Lee, J. Y., Lou, Z. F., Chang, F. S., Li, Z. X., Liu, C. W., Hou, T. H., Su, P. & Lee, M. H., 2023, 2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE International Reliability Physics Symposium Proceedings; 卷 2023-March).

研究成果: Conference contribution › 同行評審

3 引文斯高帕斯（Scopus）

DC/RF Performance and Reliability of 100-nm Gate Length AlGaN/GaN MIS-HEMTs with Different Thickness of in-situ SiN

Su, C. Y., Tsai, M. C. & Wu, T. L., 2023, 2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Demonstration of a Millimeter-wave High-Power Transceiver Module using AlN Interposer

Tsao, Y. F., Wang, Y., Chiu, P. H., Desai, A., Wolf, M., Chevtchenko, S., Würfl, J. & Hsu, H. T., 2023, 2023 Asia-Pacific Microwave Conference, APMC 2023. Institute of Electrical and Electronics Engineers Inc., p. 61-63 3 p. (Asia-Pacific Microwave Conference Proceedings, APMC).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Demonstration of Differential Mode FeFET-Array for multi-precision storage and IMC applications

Parmar, V., Muller, F., Hsuen, J. H., Kingra, S. K., Raffel, Y., Lederer, M., Ali, T., Dunkel, S., Seidel, K., Beyer, S., Wu, T. L., Kampfe, T., De, S. & Suri, M., 2023, 2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

3 引文斯高帕斯（Scopus）

Demonstration of High Voltage (>2KV) GaN-on-QST power MIS-HEMTs with the Stable Dynamic On-resistance up to 1650 V

Liu, C. W., Liu, Y. W., Ho, H. J. & Wu, T. L., 2023, WiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia. Institute of Electrical and Electronics Engineers Inc., (WiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Demonstration of High Voltage GaN-on-Si p-GaN gate HEMTs (>1000V) with Enhancement of Forward Gate TDDB using Oxygen Plasma Treatment

Lin, T. H., Chou, Y. S., Chen, H. C. & Wu, T. L., 2023, WiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia. Institute of Electrical and Electronics Engineers Inc., (WiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia).

研究成果: Conference contribution › 同行評審

3 引文斯高帕斯（Scopus）

Demonstration of Large Polarization in Si-doped HfO₂Metal-Ferroelectric-Insulator-Semiconductor Capacitors with Good Endurance and Retention

Hsuen, J. H., Lederer, M., Kerkhofs, L., Raffel, Y., Pirro, L., Chohan, T., Seidel, K., Kampfe, T., De, S. & Wu, T. L., 2023, 2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

4 引文斯高帕斯（Scopus）

Demonstration of Mos2 Memtransistor with Poly-Si Source/Drain Featuring Tunable Conductance States and Boosted I_ON

Li, K. S., Huang, M. K., Wang, Y. H., Tseng, Y. C. & Su, C. J., 2023, 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023. Institute of Electrical and Electronics Engineers Inc., (7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

D-Mode GaN HEMT with Direct Drive

Heumesser, V., Lai, J. S., Hsieh, H. C., Hsu, J., Yang, C. Y., Chang, E. Y., Ko, H. K., Liu, W. H. & Lin, Y. M., 2023, WiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia. Institute of Electrical and Electronics Engineers Inc., (WiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia).

研究成果: Conference contribution › 同行評審

開啟存取

3 引文斯高帕斯（Scopus）

Double-sided <111>-oriented nanotwinned copper foils for thermal interface materials in high power electronics

Shen, G. Y. & Chen, C., 2023, 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., p. 183-184 2 p. (2023 International Conference on Electronics Packaging, ICEP 2023).

研究成果: Conference contribution › 同行評審

Dual-Band Branch Line Coupler-Based Circularly Polarized Antenna for Millimeter-Wave Applications

Desai, A., Tsao, Y. F. & Hsu, H. T., 2023, 2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, AP-S/URSI 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 369-370 2 p. (IEEE Antennas and Propagation Society, AP-S International Symposium (Digest); 卷 2023-July).

研究成果: Conference contribution › 同行評審

3 引文斯高帕斯（Scopus）

Effects of In/Zn composition on the Performance of Ultra-thin Atomic Layer Deposited InxZn_l-xO Channel Thin-Film Transistors

Liang, Y. K., Zheng, J. Y., Lin, J. W., Hua, Y. M., Chou, T. T., Lu, C. C., Huang, H. Y., Lin, Y. M., Kei, C. C., Chang, E. Y. & Lin, C. H., 2023, 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023. Institute of Electrical and Electronics Engineers Inc., (7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023).

研究成果: Conference contribution › 同行評審

3 引文斯高帕斯（Scopus）

Effects of N₂ Pretreatment on Performance and Stabilities of Power p-GaN HEMTs

Huang, Z. H., Chang, C. H., Lin, W. S., Lo, T. C., Ching, Y. C., Huang, Y. J., Hwang, R. C., Chou, C. W. & Wu, T. L., 2023, 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023. Institute of Electrical and Electronics Engineers Inc., (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; 卷 2023-July).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Electrical Determination of Magnetization Switching in In-plane Anisotropy Spin-orbit Systems

Huang, Y. H., Lin, Y. L., Wu, Y. H. & Tseng, Y. C., 2023, 2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

Enhanced Device Characteristics of InGaAs MOSFETs Using High Switching Speed Ferroelectric Material

Huang, P., Chen, M. Y. & Chang, E. Y., 2023, 2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

Enhancement of Color Purity for InGaN Red Micro-LEDs by Modified Distributed Bragg Reflector

Miao, W. C., Hsiao, F. H., Hong, Y. H., Chiang, H., Lin, C. L., Lin, C.-C., Chen, S. C. & Kuo, H. C., 2023, CLEO: Science and Innovations, CLEO:S and I 2023. Optical Society of America, (CLEO: Science and Innovations, CLEO:S and I 2023).

研究成果: Conference contribution › 同行評審

Enhancement of Color Purity for InGaN Red Micro-LEDs by Modified Distributed Bragg Reflector

Miao, W. C., Hsiao, F. H., Hong, Y. H., Chiang, H., Lin, C. L., Lin, C. C., Chen, S. C. & Kuo, H. C., 2023, 2023 Conference on Lasers and Electro-Optics, CLEO 2023. Institute of Electrical and Electronics Engineers Inc., JW2A.52. (2023 Conference on Lasers and Electro-Optics, CLEO 2023).

研究成果: Conference contribution › 同行評審

Enhancement of Color Purity for InGaN Red Micro-LEDs by Modified Distributed Bragg Reflector

Miao, W. C., Hsiao, F. H., Hong, Y. H., Chiang, H., Lin, C. L., Lin, C.-C., Chen, S. C. & Kuo, H. C., 2023, CLEO: Fundamental Science, CLEO:FS 2023. Optical Society of America, (CLEO: Fundamental Science, CLEO:FS 2023).

研究成果: Conference contribution › 同行評審

Exploring Next-Generation GaN Power Devices with Ferroelectric Charge Trap Gate Stack Technology for Normally-OFF Operations

Chang, E. Y., Wu, J. S., Yang, T. Y. & Tsai, C. H., 2023, 2023 21st International Workshop on Junction Technology, IWJT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 21st International Workshop on Junction Technology, IWJT 2023).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO₂Hybrid Bonding

Yang, S. C., Ong, J. J., Tran, D. P., Chiu, W. L., Lee, O. H., Chiang, C. W., Chang, H. H., Wang, C. H. & Chen, C., 2023, 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., p. 13-14 2 p. (2023 International Conference on Electronics Packaging, ICEP 2023).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Fine-pitch <111>-oriented NT-Cu/SiO₂hybrid joints with high thermal fatigue resistance and low contact resistivity

Ong, J. J., Chiu, W. L., Chang, H. H., Tran, D. P. & Chen, C., 2023, 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., p. 15-16 2 p. (2023 International Conference on Electronics Packaging, ICEP 2023).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

First Demonstration of Highly Scaled Atomic Layer Deposited Ultrathin InSnZnO Channel Thin Film Transistor Exhibiting Superior Electrical Characteristics

Liang, Y. K., Zheng, J. Y., Lin, Y. L., Chen, Y., Chen, K. L., Hsieh, D. R., Peng, L. C., Chiu, C. H., Lu, Y. C., Chou, T. T., Kei, C. C., Lu, C. C., Huang, H. Y., Lin, Y. M., Tseng, Y. C., Chao, T. S., Chang, E. Y. & Lin, C. H., 2023, 2023 International Electron Devices Meeting, IEDM 2023. Institute of Electrical and Electronics Engineers Inc., (Technical Digest - International Electron Devices Meeting, IEDM).

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

High Temperature Storage of Cu-Cu Joints Fabricated by Highly (111)-oriented Nanotwinned Cu

Yang, S. C. & Chen, C., 2023, Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers Inc., p. 2075-2078 4 p. (Proceedings - Electronic Components and Technology Conference; 卷 2023-May).

研究成果: Conference contribution › 同行評審

6 引文斯高帕斯（Scopus）

Improved Electrical Characteristics of Ge p-MOSFET with Ti-GeOx Interfacial Layer by in-situ Plasma-enhanced Atomic Layer Deposition

Li, H. H., Lin, Y. H., Tu, T. Y. & Chien, C. H., 2023, 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023. Institute of Electrical and Electronics Engineers Inc., (7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023).

研究成果: Conference contribution › 同行評審

Inversion-Mode InGaAs FinFETs for Logic and RF Applications

Wu, J. Y., Chen, M. Y. & Chang, E. Y., 2023, Proceedings of 2023 IEEE 15th International Conference on ASIC, ASICON 2023. Ye, F. & Tang, T.-A. (編輯). IEEE Computer Society, (Proceedings of International Conference on ASIC).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Investigation on ESD Robustness of 1200-V D- Mode GaN MIS-HEMTs with HBM ESD Test and TLP Measurement

Ke, C. Y., Wang, W. C., Ker, M. D., Yang, C. Y. & Chang, E. Y., 2023, 2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

5 引文斯高帕斯（Scopus）

I-V Global Parameter Extraction for Industry Standard FinFET Compact Model using Deep Learning

Chavez, F., Chen, J. H., Tung, C. T., Hu, C. & Khandelwal, S., 2023, 2023 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2023. Institute of Electrical and Electronics Engineers Inc., p. 20-22 3 p. (2023 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2023).

研究成果: Conference contribution › 同行評審

3 引文斯高帕斯（Scopus）

Low Contact Resistance and Low Temperature Hybrid Bonding with Polyimide and Highly <111>-oriented Nanotwinned Cu

He, P. S., Shie, K. C. & Chen, C., 2023, IMPACT 2023 - International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, p. 321-323 3 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

研究成果: Conference contribution › 同行評審

Low N-Type Contact Resistance to Carbon Nanotubes in Highly Scaled Contacts through Dielectric Doping

Safion, N., Chiu, H. Y., Chao, T. A., Su, S. K., Passlack, M., Chiu, K. H., Chen, C. W., Kei, C. C., Chou, C. H., Lee, T. E., Wang, J. F., Chang, C. S., Liew, S. L., Hou, V. D. H., Wang, H., Chang, W. H., Wong, H. S. P., Pitner, G., Chien, C. H. & Radu, I. P., 2023, 2023 International Electron Devices Meeting, IEDM 2023. Institute of Electrical and Electronics Engineers Inc., (Technical Digest - International Electron Devices Meeting, IEDM).

研究成果: Conference contribution › 同行評審

4 引文斯高帕斯（Scopus）

Monolayer-MoS₂ Stacked Nanosheet Channel with C-type Metal Contact

Chung, Y. Y., Yun, W. S., Chou, B. J., Hsu, C. F., Yu, S. M., Arutchelvan, G., Li, M. Y., Lee, T. E., Lin, B. J., Li, C. Y., Wei, A., Sathaiya, D. M., Chung, C. T., Liew, S. L., Hou, V. D. H., Chang, W. H., Liu, B. H., Chen, C. W., Su, C. Y. & Kei, C. C. 及其他7, Cai, J., Wu, C. C., Wu, J., Lee, T. Y., Chien, C. H., Cheng, C. C. & Radu, I. P., 2023, 2023 International Electron Devices Meeting, IEDM 2023. Institute of Electrical and Electronics Engineers Inc., (Technical Digest - International Electron Devices Meeting, IEDM).

研究成果: Conference contribution › 同行評審

12 引文斯高帕斯（Scopus）

NLS based Modeling of Temperature-dependent Phase Transition Characteristics for Antiferroelectric/Ferroelectric Hafnium Zirconium Oxides

Chen, Y. C., Hsiang, K. Y., Lee, M. H. & Su, P., 2023, 2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

Noncontact Remote Doping for High-performance Two-dimensional Electronics

Pao, P. H., Cheng, R. H., Huang, Y. H., Yang, Y. Y., Sang, T. H., Tsai, C. M. & Chien, C. H., 2023, Proceedings of 2023 IEEE 15th International Conference on ASIC, ASICON 2023. Ye, F. & Tang, T.-A. (編輯). IEEE Computer Society, (Proceedings of International Conference on ASIC).

研究成果: Conference contribution › 同行評審

Novel Complementary FeFET- based Lookup Table and Routing Switch Design and their Applications in Energy/Area-Efficient FPGA

Huang, Y. Y., Huang, P. T., Lee, P. Y. & Su, P., 2023, 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023. Institute of Electrical and Electronics Engineers Inc., (7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023).

研究成果: Conference contribution › 同行評審

1 引文斯高帕斯（Scopus）

智慧半導體奈米系統技術研究中心

研究成果

搜尋結果