智慧半導體奈米系統技術研究中心

2024

Advancements in Flexible MIMO Antennas for 5G Smartphones

Kulkarni, J., Desai, A., Tung Hsu, H., Garner, B., Li, Y., Sim, C. Y. D. & Dhasarathan, V., 2024, EAI/Springer Innovations in Communication and Computing. Springer Science and Business Media Deutschland GmbH, p. 131-160 30 p. (EAI/Springer Innovations in Communication and Computing; 卷 Part F1590).

研究成果 › 同行評審

Direct copper interconnection for die/wafer bonding: Overview

Hung, T. H. & Chen, K. N., 28 6月 2024, Direct Copper Interconnection for Advanced Semiconductor Technology. CRC Press, p. 19-53 35 p.

研究成果: Chapter › 同行評審

Flexible, Transparent, and Wideband 4-Port MIMO Antenna

Kulkarni, J., Desai, A., Tung Hsu, H., Garner, B., Li, Y., Sim, C. Y. D. & Dhasarathan, V., 2024, EAI/Springer Innovations in Communication and Computing. Springer Science and Business Media Deutschland GmbH, p. 71-99 29 p. (EAI/Springer Innovations in Communication and Computing; 卷 Part F1590).

研究成果 › 同行評審

1 引文斯高帕斯（Scopus）

Flexible 4-Port CP MIMO Antenna

Kulkarni, J., Desai, A., Tung Hsu, H., Garner, B., Li, Y., Sim, C. Y. D. & Dhasarathan, V., 2024, EAI/Springer Innovations in Communication and Computing. Springer Science and Business Media Deutschland GmbH, p. 161-204 44 p. (EAI/Springer Innovations in Communication and Computing; 卷 Part F1590).

研究成果 › 同行評審

Introduction to the Flexible and Transparent Antennas

Kulkarni, J., Desai, A., Tung Hsu, H., Garner, B., Li, Y., Sim, C. Y. D. & Dhasarathan, V., 2024, EAI/Springer Innovations in Communication and Computing. Springer Science and Business Media Deutschland GmbH, p. 1-70 70 p. (EAI/Springer Innovations in Communication and Computing; 卷 Part F1590).

研究成果 › 同行評審

UWB Flexible Antenna

Kulkarni, J., Desai, A., Tung Hsu, H., Garner, B., Li, Y., Sim, C. Y. D. & Dhasarathan, V., 2024, EAI/Springer Innovations in Communication and Computing. Springer Science and Business Media Deutschland GmbH, p. 101-129 29 p. (EAI/Springer Innovations in Communication and Computing; 卷 Part F1590).

研究成果 › 同行評審

1 引文斯高帕斯（Scopus）

2023

FinFET: The 3D thin-body transistor

Hu, C., 3 5月 2023, 75th Anniversary of the Transistor. wiley, p. 135-144 10 p.

研究成果 › 同行評審

1 引文斯高帕斯（Scopus）

2021

Mechanical Behavior of High-Entropy Alloys Focusing on Tensors: An in situ Neutron Diffraction Investigation From Room to Elevated Temperature

Huang, E. W., Lee, S. Y., Wang, H., Jain, J., Liaw, P. K., Yang, W. C., Chin, H. H., Yi, Y. T. & Tu, S. Y., 1 9月 2021, Encyclopedia of Materials: Metals and Alloys. Elsevier, p. 454-462 9 p.

研究成果: Chapter › 同行評審

2019

Core model for independent multigate MOSFETs

Duarte, J. P., Khandelwal, S., Chang, H. L., Lin, Y. K., Kushwaha, P., Chauhan, Y. S. & Hu, C., 1 1月 2019, Industry Standard FDSOI Compact Model BSIM-IMG for IC Design. Elsevier, p. 15-34 20 p.

研究成果: Chapter › 同行評審

Fully-depleted silicon on oxide transistor and compact model

Hu, C., 1 1月 2019, Industry Standard FDSOI Compact Model BSIM-IMG for IC Design. Elsevier, p. 1-13 13 p.

研究成果: Chapter › 同行評審

1 引文斯高帕斯（Scopus）

2018

Silicene on Ag(111)

Takagi, N., Lin, C.-L. & Arafune, R., 1 1月 2018, Encyclopedia of Interfacial Chemistry: Surface Science and Electrochemistry. Elsevier, p. 312-317 6 p.

研究成果: Chapter › 同行評審

Spin and charge tunneling transport in magnetic tunnel junctions with embedded nanoparticles

Useinov, A., Lai, C. H., Useinov, N. K. & Tagirov, L. R., 1 1月 2018, Novel Magnetic Nanostructures: Unique Properties and Applications. Elsevier, p. 373-400 28 p.

研究成果: Chapter › 同行評審

2 引文斯高帕斯（Scopus）

智慧半導體奈米系統技術研究中心

研究成果

搜尋結果