Wafer-to-wafer hybrid bonding technology for 3D IC

Cheng Ta Ko*, Zhi Cheng Hsiao, Huan Chun Fu, Kuan-Neng Chen, Wei Chung Lo, Yu Hua Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

11 Scopus citations

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Engineering & Materials Science