Wafer-level 3D integration technology

  • Steven J. Koester*
  • , Albert M. Young
  • , Roy R. Yu
  • , Sampath Purushothaman
  • , Kuan-Neng Chen
  • , Douglas C. La Tulipe
  • , Narender Rana
  • , Leathen Shi
  • , Matthew R. Wordeman
  • , Edmund J. Sprogis
    • *Corresponding author for this work

    Research output: Contribution to journal › Review article › peer-review

    170 Scopus citations

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    Keyphrases

    Engineering

    Computer Science