Wafer-level 3D integration technology

Steven J. Koester*, Albert M. Young, Roy R. Yu, Sampath Purushothaman, Kuan-Neng Chen, Douglas C. La Tulipe, Narender Rana, Leathen Shi, Matthew R. Wordeman, Edmund J. Sprogis

*Corresponding author for this work

    Research output: Contribution to journal › Review article › peer-review

    169 Scopus citations

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    Keyphrases

    Engineering

    Computer Science