Wafer-level 3D integration technology
- Steven J. Koester*
- , Albert M. Young
- , Roy R. Yu
- , Sampath Purushothaman
- , Kuan-Neng Chen
- , Douglas C. La Tulipe
- , Narender Rana
- , Leathen Shi
- , Matthew R. Wordeman
- , Edmund J. Sprogis
*Corresponding author for this work
Research output: Contribution to journal › Review article › peer-review
177
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