Abstract
Drain leakage current degradation at zero Vgs in a hot carrier stressed n-MOSFET is measured and modeled. The dependences of drain leakage current on supply voltage and temperature are characterized. In modeling, various drain leakage current mechanisms including drain-to-source subthreshold leakage current, band-to-band tunneling current and interface trap assisted leakage current are taken into account. Our result shows that interface trap induced leakage current appears to be a dominant drain leakage mechanism as the supply voltage is scaled below 3.0 V. Drain leakage current degradation by orders of magnitude has been observed due to hot carrier stress.
Original language | English |
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Pages (from-to) | 209-213 |
Number of pages | 5 |
Journal | Annual Proceedings - Reliability Physics (Symposium) |
DOIs | |
State | Published - 1998 |
Event | Proceedings of the 1998 36th IEEE International Reliability Physics Symposium - Reno, NV, USA Duration: 31 Mar 1998 → 2 Apr 1998 |