Vertical SCR structure for on-chip ESD protection in nanoscale CMOS technology

Chun Yu Lin, Pin Hsin Chang, Rong Kun Chang, Ming-Dou Ker, Wen Tai Wang

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    2 Scopus citations

    Abstract

    A vertical silicon-controlled rectifier (SCR) structure utilizing ESD implantation layer was proposed and implemented in nanoscale CMOS technology. Compared with the traditional SCR structure, the proposed structure has lower trigger voltage and high enough ESD protection capability. Therefore, the proposed structure was suitable for ESD protection in nanoscale CMOS process.

    Original languageEnglish
    Title of host publicationProceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages255-258
    Number of pages4
    ISBN (Electronic)9781479999286, 9781479999286
    DOIs
    StatePublished - 25 Aug 2015
    Event22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015 - Hsinchu, Taiwan
    Duration: 29 Jun 20152 Jul 2015

    Publication series

    NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
    Volume2015-August

    Conference

    Conference22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015
    Country/TerritoryTaiwan
    CityHsinchu
    Period29/06/152/07/15

    Fingerprint

    Dive into the research topics of 'Vertical SCR structure for on-chip ESD protection in nanoscale CMOS technology'. Together they form a unique fingerprint.

    Cite this