Versatile laser release material development for chip-first and chip-last fan-out wafer-level packaging
- Chia Hsin Lee
- , Baron Huang
- , Jennifer See
- , Xiao Liu
- , Yu Min Lin
- , Wei Lan Chiu
- , Chao Jung Chen
- , Ou Hsiang Lee
- , Hsiang En Ding
- , Ren Shin Cheng
- , Ang Ying Lin
- , Sheng Tsai Wu
- , Tao Chih Chang
- , Hsiang Hung Chang
- , Kuan Neng Chen*
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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