Ultrahigh responsivity and tunable photogain BEOL compatible MoS}_{2} phototransistor array for monolithic 3D image sensor with block-level sensing circuits

Chih Chao Yang, Ping Yi Hsieh, Po Han Chen, Tung Ying Hsieh, Po-Tsang Huang, Yu Ting Lin, Chang Hong Shen, Jia Min Shieh, Da Chiang Chang, Wen Kuan Yeh, Meng Chyi Wu, Yi Hsien Lee

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

A large-area and scalable monolayer TMD is feasible to employ in monolithic 3D image sensor scheme. For the first time, we represents a prototype MoS2 phototransistor array with ultrahigh responsivity (> 102 AW}) and tunable photogain (102 105) which can be directly implemented on a CMOS circuit connected with BEOL fine-pitch vertical interconnects. Electric gate pulse modulation mitigates photo gating (PG) and persistent photoconductance (PPC) effects from layered semiconductor interface. Both three-order-of-magnitude improvements of response speed and fine-pitch vertical interconnects empower block-level compressive sensing circuits and global image-signal processing for gain control and data compression.

Original languageEnglish
Title of host publication2020 IEEE Symposium on VLSI Technology, VLSI Technology 2020 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-2
Number of pages2
ISBN (Electronic)9781728164601
DOIs
StatePublished - Jun 2020
Event2020 IEEE Symposium on VLSI Technology, VLSI Technology 2020 - Honolulu, United States
Duration: 16 Jun 202019 Jun 2020

Publication series

NameDigest of Technical Papers - Symposium on VLSI Technology
Volume2020-June
ISSN (Print)0743-1562

Conference

Conference2020 IEEE Symposium on VLSI Technology, VLSI Technology 2020
Country/TerritoryUnited States
CityHonolulu
Period16/06/2019/06/20

Keywords

  • image sensor
  • monolithic 3D
  • phototransistor
  • TMD
  • ultrahigh resposivity

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