Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes

Yu Chieh Huang; Po-Tsang Huang; Shang Lin Wu; Yu Chen Hu; Yan Huei You; Jr Ming Chen; Yan Yu Huang; Hsiao Chun Chang; Yen Han Lin; Jeng-Ren Duann; Tzai-Wen Chiu; Wei Hwang; Kuan-Neng Chen; Ching-Te Chuang; Jin-Chern Chiou

doi:10.1109/TBCAS.2017.2669439

Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes

Yu Chieh Huang, Po-Tsang Huang, Shang Lin Wu, Yu Chen Hu, Yan Huei You, Jr Ming Chen, Yan Yu Huang, Hsiao Chun Chang, Yen Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel neural sensing microsystem with a sensing area of 5 × 5 mm² is presented based on 2.5-D through-silicon-via (TSV) integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient successive approximation register analog-to-digital converters, and serializers. This microsystem can detect 256 electrocorticography and local field potential signals within a small area of 5 mm × 5 mm. The neural amplifier realizes 57.8 dB gain with only 9.8 μW per channel. The overall power of this microsystem is only 3.79 mW for 256-channel neural sensing. A smaller microsystem with dimension of 6 mm × 4 mm has been also implanted into rat brain for somatosensory evoked potentials (SSEPs) recording by using contralateral and ipsilateral electrical stimuli with intensity from 0.2 to 1.0 mA, and successfully observed different SSEPs from left somatosensory cortex of a rat.

Original language	English
Article number	7890380
Pages (from-to)	1013-1025
Number of pages	13
Journal	IEEE Transactions on Biomedical Circuits and Systems
Volume	11
Issue number	5
DOIs	https://doi.org/10.1109/TBCAS.2017.2669439
State	Published - Oct 2017

Keywords

Electrocorticography (ECoG)
TSV-embedded μ-needles
local field potential (LFP)
microsystem
probe
somatosensory evoked potential (SSEP)

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Huang, Y. C., Huang, P.-T., Wu, S. L., Hu, Y. C., You, Y. H., Chen, J. M., Huang, Y. Y., Chang, H. C., Lin, Y. H., Duann, J.-R., Chiu, T.-W., Hwang, W., Chen, K.-N., Chuang, C.-T., & Chiou, J.-C. (2017). Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes. IEEE Transactions on Biomedical Circuits and Systems, 11(5), 1013-1025. Article 7890380. https://doi.org/10.1109/TBCAS.2017.2669439

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title = "Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes",

abstract = "Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel neural sensing microsystem with a sensing area of 5 × 5 mm2 is presented based on 2.5-D through-silicon-via (TSV) integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient successive approximation register analog-to-digital converters, and serializers. This microsystem can detect 256 electrocorticography and local field potential signals within a small area of 5 mm × 5 mm. The neural amplifier realizes 57.8 dB gain with only 9.8 μW per channel. The overall power of this microsystem is only 3.79 mW for 256-channel neural sensing. A smaller microsystem with dimension of 6 mm × 4 mm has been also implanted into rat brain for somatosensory evoked potentials (SSEPs) recording by using contralateral and ipsilateral electrical stimuli with intensity from 0.2 to 1.0 mA, and successfully observed different SSEPs from left somatosensory cortex of a rat.",

keywords = "Electrocorticography (ECoG), TSV-embedded μ-needles, local field potential (LFP), microsystem, probe, somatosensory evoked potential (SSEP)",

author = "Huang, {Yu Chieh} and Po-Tsang Huang and Wu, {Shang Lin} and Hu, {Yu Chen} and You, {Yan Huei} and Chen, {Jr Ming} and Huang, {Yan Yu} and Chang, {Hsiao Chun} and Lin, {Yen Han} and Jeng-Ren Duann and Tzai-Wen Chiu and Wei Hwang and Kuan-Neng Chen and Ching-Te Chuang and Jin-Chern Chiou",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.",

year = "2017",

month = oct,

doi = "10.1109/TBCAS.2017.2669439",

language = "English",

volume = "11",

pages = "1013--1025",

journal = "IEEE Transactions on Biomedical Circuits and Systems",

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Huang, YC, Huang, P-T, Wu, SL, Hu, YC, You, YH, Chen, JM, Huang, YY, Chang, HC, Lin, YH, Duann, J-R , Chiu, T-W, Hwang, W, Chen, K-N, Chuang, C-T & Chiou, J-C 2017, 'Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes', IEEE Transactions on Biomedical Circuits and Systems, vol. 11, no. 5, 7890380, pp. 1013-1025. https://doi.org/10.1109/TBCAS.2017.2669439

TY - JOUR

T1 - Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes

AU - Huang, Yu Chieh

AU - Huang, Po-Tsang

AU - Wu, Shang Lin

AU - Hu, Yu Chen

AU - You, Yan Huei

AU - Chen, Jr Ming

AU - Huang, Yan Yu

AU - Chang, Hsiao Chun

AU - Lin, Yen Han

AU - Duann, Jeng-Ren

AU - Chiu, Tzai-Wen

AU - Hwang, Wei

AU - Chen, Kuan-Neng

AU - Chuang, Ching-Te

AU - Chiou, Jin-Chern

PY - 2017/10

Y1 - 2017/10

N2 - Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel neural sensing microsystem with a sensing area of 5 × 5 mm2 is presented based on 2.5-D through-silicon-via (TSV) integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient successive approximation register analog-to-digital converters, and serializers. This microsystem can detect 256 electrocorticography and local field potential signals within a small area of 5 mm × 5 mm. The neural amplifier realizes 57.8 dB gain with only 9.8 μW per channel. The overall power of this microsystem is only 3.79 mW for 256-channel neural sensing. A smaller microsystem with dimension of 6 mm × 4 mm has been also implanted into rat brain for somatosensory evoked potentials (SSEPs) recording by using contralateral and ipsilateral electrical stimuli with intensity from 0.2 to 1.0 mA, and successfully observed different SSEPs from left somatosensory cortex of a rat.

AB - Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel neural sensing microsystem with a sensing area of 5 × 5 mm2 is presented based on 2.5-D through-silicon-via (TSV) integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient successive approximation register analog-to-digital converters, and serializers. This microsystem can detect 256 electrocorticography and local field potential signals within a small area of 5 mm × 5 mm. The neural amplifier realizes 57.8 dB gain with only 9.8 μW per channel. The overall power of this microsystem is only 3.79 mW for 256-channel neural sensing. A smaller microsystem with dimension of 6 mm × 4 mm has been also implanted into rat brain for somatosensory evoked potentials (SSEPs) recording by using contralateral and ipsilateral electrical stimuli with intensity from 0.2 to 1.0 mA, and successfully observed different SSEPs from left somatosensory cortex of a rat.

KW - Electrocorticography (ECoG)

KW - TSV-embedded μ-needles

KW - local field potential (LFP)

KW - microsystem

KW - probe

KW - somatosensory evoked potential (SSEP)

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U2 - 10.1109/TBCAS.2017.2669439

DO - 10.1109/TBCAS.2017.2669439

M3 - Article

C2 - 28371785

AN - SCOPUS:85017131649

SN - 1932-4545

VL - 11

SP - 1013

EP - 1025

JO - IEEE Transactions on Biomedical Circuits and Systems

JF - IEEE Transactions on Biomedical Circuits and Systems

IS - 5

M1 - 7890380

ER -

Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes

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Keywords

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