Ultra-Thin Glass-based Wafer-level Integration for Miniaturized Hermetic MEMS Application

Yu Ting Huang, Yi Chieh Tsai, Yi Cheng Huang, Han Wen Hu, Kuan Neng Chen

Research output: Contribution to journalArticlepeer-review

2 Scopus citations


In this article, a glass-based hermetic structure has been packaged at wafer-level with a thickness thinner than 200 μm and a size smaller than 1 mm2, showing the prospective way to realize the miniaturization of microelectromechanical systems (MEMS) with high throughput. For the development of this novel wafer-level packaging platform, material selection of metal wire was studied. Next, the technique of metal patterning on the cavity structure was demonstrated for the fabrication of seal ring and electrical connection simultaneously. At last, the ultrathin hermetic structure was sealed by metal-to-metal bonding at wafer-level. These technologies can be widely used in advanced miniaturized packaging applications for next-generation electronic components.

Original languageEnglish
Pages (from-to)1
Number of pages1
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
StateAccepted/In press - 2022


  • Advanced packaging
  • Bonding
  • Coatings
  • Micromechanical devices
  • Packaging
  • packaging miniaturization
  • Resists
  • spray coating
  • Substrates
  • Surface morphology
  • wafer-level bonding


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