Abstract
Method for forming ultra-shallow p+/n is demonstrated for 0.15 μm p-type metal-oxide-semiconductor field-effect transistor (pMOSFET). The approach includes a capping ultra-thin nitride on the source/drain extension regions followed by a low energy source/drain (S/D) extension implantation. Ultra shallow p+/n junctions can be obtained with depth of 27 nm and sheet resistivity of 1007 Ω/□.
Original language | English |
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Pages (from-to) | 4519-4520 |
Number of pages | 2 |
Journal | Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers |
Volume | 41 |
Issue number | 7 A |
DOIs | |
State | Published - Jul 2002 |
Keywords
- CMOS
- Nitride
- Shallow junction