TY - GEN
T1 - TiN-C Based CMOS MEMS Pirani Gauge for on-Chip Pressure Measurement
AU - Garg, Manu
AU - Tsai, Fang Wei
AU - Joshi, Khanjan
AU - Chiu, Yi
AU - Singh, Pushpapraj
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - The paper presents a monolithically integrable CMOS back-end-of-line (BEOL) integrated MEMS Pirani gauge. The proposed idea is implemented using a TiN-C platform based on a 0.35 μm 2P4M commercial CMOS process. In the given implementation, TiN in the interconnect layer is explored as a heating element. Owing to the lower thermal conductivity (4 W/m.K) of TiN, excellent thermal isolation of intermetal dielectric layers, and a narrow vertical conduction gap, the gauge exhibits a wide dynamic range from 26 Pa to 106 Pa. Experimental results of the fabricated devices are in excellent agreement with the simulated curve with a maximum error of 0.04%. Additionally, the fabricated gauge demonstrates excellent reproducibility while maintaining an acceptable error margin of ≤ 0.01 % over the entire range.
AB - The paper presents a monolithically integrable CMOS back-end-of-line (BEOL) integrated MEMS Pirani gauge. The proposed idea is implemented using a TiN-C platform based on a 0.35 μm 2P4M commercial CMOS process. In the given implementation, TiN in the interconnect layer is explored as a heating element. Owing to the lower thermal conductivity (4 W/m.K) of TiN, excellent thermal isolation of intermetal dielectric layers, and a narrow vertical conduction gap, the gauge exhibits a wide dynamic range from 26 Pa to 106 Pa. Experimental results of the fabricated devices are in excellent agreement with the simulated curve with a maximum error of 0.04%. Additionally, the fabricated gauge demonstrates excellent reproducibility while maintaining an acceptable error margin of ≤ 0.01 % over the entire range.
KW - BEOL
KW - CMOS-MEMS
KW - MEMS
KW - Monolithic Integration
KW - Pirani gauge
UR - http://www.scopus.com/inward/record.url?scp=85179753727&partnerID=8YFLogxK
U2 - 10.1109/SENSORS56945.2023.10325154
DO - 10.1109/SENSORS56945.2023.10325154
M3 - Conference contribution
AN - SCOPUS:85179753727
T3 - Proceedings of IEEE Sensors
BT - 2023 IEEE SENSORS, SENSORS 2023 - Conference Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 IEEE SENSORS, SENSORS 2023
Y2 - 29 October 2023 through 1 November 2023
ER -