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Time-dependent Multiple Gate Voltage Reliability of Hybrid Ferroelectric Charge Trap Gate Stack (FEG) GaN HEMT for Power Device Applications

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4 Scopus citations

Abstract

This experimental study examines the time-dependent dielectric breakdown (TDDB) on a hybrid charge trap gate stack for the normally OFF operation of the Ferroelectric charge trap GaN High Electron Mobility Transistor (FEG-HEMT) at room temperature. The abrupt change in drain current shows the hard break down (HBD) of the charge trap gate stack. A hybrid charge trap gate stack provides the percolation path at the gate recess edge. Step gate stress has been used to figure out the breakdown voltage and device failure current which are found to be 20V and 2.14 μA/mm respectively. The fitted parameter β (Weibull distribution slope) has been analyzed for the multiple-gate stress voltage 17V, 18V, and 19V. Based on the power law, the lifetime prediction has been investigated for 63.2%, 10%, and 0.1% failure rates on fitting the data to gate voltage 13.5V, 13.1V, and 12.5V, respectively, by extrapolation up to 10 years.

Original languageEnglish
Title of host publication2022 IEEE Latin America Electron Devices Conference, LAEDC 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665497671
DOIs
StatePublished - 2022
Event2022 IEEE Latin America Electron Devices Conference, LAEDC 2022 - Puebla, Mexico
Duration: 4 Jul 20226 Jul 2022

Publication series

Name2022 IEEE Latin America Electron Devices Conference, LAEDC 2022

Conference

Conference2022 IEEE Latin America Electron Devices Conference, LAEDC 2022
Country/TerritoryMexico
CityPuebla
Period4/07/226/07/22

Keywords

  • AlGaN/GaN
  • charge trap gate stack
  • E-mode
  • Ferroelectric HEMT
  • MIS-HEMT
  • Normally OFF
  • TDDB
  • Weibull

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