Thermocompression Cu-Cu Bonding of Blanket and Patterned Wafers

Kuan-Neng Chen*, Chuan Seng Tan

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

    8 Scopus citations
    Original languageEnglish
    Title of host publicationHandbook of Wafer Bonding
    PublisherWiley-VCH
    Pages161-180
    Number of pages20
    ISBN (Print)9783527326464
    DOIs
    StatePublished - 8 Feb 2012

    Keywords

    • Copper
    • Cu
    • Thermocompression
    • Wafer bonding

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