Thermal switch and variable capacitance designed for micro electrostatic converter by using CMOS MEMS process

Jin-Chern Chiou; Lei Chun Chou; You Liang Lai; Sheng-Chieh Huang

doi:10.1109/NEMS.2012.6196879

Thermal switch and variable capacitance designed for micro electrostatic converter by using CMOS MEMS process

Jin-Chern Chiou^*, Lei Chun Chou, You Liang Lai, Sheng-Chieh Huang

^*Corresponding author for this work

Department of Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This paper focuses on implementing a novel thermal switch and variable capacitance design by using commercially available CMOS MEMS process which can approach in a micro electrostatic converter system. In this system, there are two major parts. First is the variable capacitance, and the second is the thermal switch. In the variable capacitance, it implement by UMC 0.18μm one-poly seven-metal (1P7M) CMOS MEMS process. In the post-process, the silicon-oxidation have been released and the gap between two metal layers filled with PDMS (Polydimethylsiloxane). Filling with PDMS is to significantly increase C _max.

Original language	English
Title of host publication	2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
Pages	733-737
Number of pages	5
DOIs	https://doi.org/10.1109/NEMS.2012.6196879
State	Published - 1 Jun 2012
Event	7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 - Kyoto, Japan Duration: 5 Mar 2012 → 8 Mar 2012

Publication series

Name	2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012

Conference

Conference	7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
Country/Territory	Japan
City	Kyoto
Period	5/03/12 → 8/03/12

Access to Document

10.1109/NEMS.2012.6196879

Cite this

Chiou, J-C., Chou, L. C., Lai, Y. L., & Huang, S-C. (2012). Thermal switch and variable capacitance designed for micro electrostatic converter by using CMOS MEMS process. In 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 (pp. 733-737). [6196879] (2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012). https://doi.org/10.1109/NEMS.2012.6196879

Chiou, Jin-Chern ; Chou, Lei Chun ; Lai, You Liang et al. / Thermal switch and variable capacitance designed for micro electrostatic converter by using CMOS MEMS process. 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012. 2012. pp. 733-737 (2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012).

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title = "Thermal switch and variable capacitance designed for micro electrostatic converter by using CMOS MEMS process",

abstract = "This paper focuses on implementing a novel thermal switch and variable capacitance design by using commercially available CMOS MEMS process which can approach in a micro electrostatic converter system. In this system, there are two major parts. First is the variable capacitance, and the second is the thermal switch. In the variable capacitance, it implement by UMC 0.18μm one-poly seven-metal (1P7M) CMOS MEMS process. In the post-process, the silicon-oxidation have been released and the gap between two metal layers filled with PDMS (Polydimethylsiloxane). Filling with PDMS is to significantly increase C max.",

author = "Jin-Chern Chiou and Chou, {Lei Chun} and Lai, {You Liang} and Sheng-Chieh Huang",

year = "2012",

month = jun,

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doi = "10.1109/NEMS.2012.6196879",

language = "English",

isbn = "9781467311243",

series = "2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012",

pages = "733--737",

booktitle = "2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012",

note = "7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 ; Conference date: 05-03-2012 Through 08-03-2012",

}

Chiou, J-C, Chou, LC, Lai, YL & Huang, S-C 2012, Thermal switch and variable capacitance designed for micro electrostatic converter by using CMOS MEMS process. in 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012., 6196879, 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, pp. 733-737, 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, Kyoto, Japan, 5/03/12. https://doi.org/10.1109/NEMS.2012.6196879

Thermal switch and variable capacitance designed for micro electrostatic converter by using CMOS MEMS process. / Chiou, Jin-Chern; Chou, Lei Chun; Lai, You Liang et al.
2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012. 2012. p. 733-737 6196879 (2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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PY - 2012/6/1

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N2 - This paper focuses on implementing a novel thermal switch and variable capacitance design by using commercially available CMOS MEMS process which can approach in a micro electrostatic converter system. In this system, there are two major parts. First is the variable capacitance, and the second is the thermal switch. In the variable capacitance, it implement by UMC 0.18μm one-poly seven-metal (1P7M) CMOS MEMS process. In the post-process, the silicon-oxidation have been released and the gap between two metal layers filled with PDMS (Polydimethylsiloxane). Filling with PDMS is to significantly increase C max.

AB - This paper focuses on implementing a novel thermal switch and variable capacitance design by using commercially available CMOS MEMS process which can approach in a micro electrostatic converter system. In this system, there are two major parts. First is the variable capacitance, and the second is the thermal switch. In the variable capacitance, it implement by UMC 0.18μm one-poly seven-metal (1P7M) CMOS MEMS process. In the post-process, the silicon-oxidation have been released and the gap between two metal layers filled with PDMS (Polydimethylsiloxane). Filling with PDMS is to significantly increase C max.

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Chiou J-C, Chou LC, Lai YL, Huang S-C. Thermal switch and variable capacitance designed for micro electrostatic converter by using CMOS MEMS process. In 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012. 2012. p. 733-737. 6196879. (2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012). doi: 10.1109/NEMS.2012.6196879

Thermal switch and variable capacitance designed for micro electrostatic converter by using CMOS MEMS process

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