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Thermal stability of Co-sputtered Ru-Ti alloy electrodes for dynamic random access memory applications
Ray-Hua Horng*, Dong Sing Wuu, Luh Huei Wu, Ming Kwei Lee, Shih Hsiung Chan, Ching Chich Leu, Tiao Yuan Huang, Simon Min Sze
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
3
Scopus
citations