Abstract
Four power-rail electrostatic-discharge (ESD) clamp circuits with different ESD-transient detection circuits have been fabricated in a 0.18-μm CMOS process to investigate their susceptibility against electrical fast-transient (EFT) tests. Under EFT tests, where the integrated circuits in a microelectronic system have been powered up, the feedback loop used in the power-rail ESD clamp circuits may lock the ESD-clamping NMOS in a "latch-on" state. Such a latch-on ESD-clamping NMOS will conduct a huge current between the power lines to perform a latchuplike failure after EFT tests. A modified power-rail ESD clamp circuit has been proposed to solve this latchuplike failure and to provide a high-enough chip-level ESD robustness.
Original language | English |
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Pages (from-to) | 1204-1210 |
Number of pages | 7 |
Journal | IEEE Transactions on Electron Devices |
Volume | 56 |
Issue number | 6 |
DOIs | |
State | Published - 28 Apr 2009 |
Keywords
- ESD protection circuit
- Electrical fast-transient (EFT) test
- Electromagnetic compatibility
- Electrostatic discharge (ESD)
- Latchup
- System-level ESD stress