The Correlations between ESD and TLP in Large Array Devices

Shao Chang Huang, Ching Ho Li, Li Fan Chen, Chun Chih Chen, Ting You Lin, Kai Chieh Hsu, Gong Kai Lin, Jian Hsing Lee, Yu Yung Kao, Ke-Horng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

Transmission Line Pulse (TLP) is often applied for Electrostatic Discharge (ESD) devices' characteristics researches. It indicates the devices' triggering-on behaviors, holding performances and thermal run-away results. In normal cases, the thermal run-away data should correlate to ESD [1]. However, the non-correlations between TLP and ESD can be observed in the gate driving circuits [2], silicide devices [3] and poly fuses [4]. In this paper, analyses for the relations between ESD and TLP are taken into discussions for large array devices (LAD).

Original languageEnglish
Title of host publication2020 IEEE International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages2
ISBN (Electronic)9781728173993
DOIs
StatePublished - 28 Sep 2020
Event7th IEEE International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2020 - Taoyuan, Taiwan
Duration: 28 Sep 202030 Sep 2020

Publication series

Name2020 IEEE International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2020

Conference

Conference7th IEEE International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2020
Country/TerritoryTaiwan
CityTaoyuan
Period28/09/2030/09/20

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