@inproceedings{4fc8f163661c4bb3bcd1f3eb05676514,
title = "The Collodial Quantum Dots Light-Emitting Diodes Device Integrated with a Solder-Ball",
abstract = "The Sn-ball integrated with the QDLED package are designed to achieve more effective heat dissipation. The thermal, luminescence and aging tests of this structure were evaluated and was proved that have good CCE and reliability.",
keywords = "LED, Package, Quantum dot",
author = "Huang, {Chung Ping} and Huang, {Yu Ming} and Yang, {Jhen Jia} and Kuo, {Hao Chung} and Lee, {Ting Yu} and Chien-Chung Lin",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 2021 IEEE Photonics Conference, IPC 2021 ; Conference date: 18-10-2021 Through 21-10-2021",
year = "2021",
doi = "10.1109/IPC48725.2021.9593020",
language = "English",
series = "2021 IEEE Photonics Conference, IPC 2021 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2021 IEEE Photonics Conference, IPC 2021 - Proceedings",
address = "美國",
}