@inproceedings{46493256103d4399b6de617c8f895f51,
title = "Temperature-to-Power Mapping for Smartphones",
abstract = "When power consumption in smartphones becomes much higher, several significant impacts occur due to its small form factor, such as performance degradation and worse user experience. Thus, power estimation/mapping is essential and useful for dynamic power management and power model validation for smartphones. In this work, first, we build the power-to-temperature (P-to-T) equations for thermal sensors from the existing system-level thermal model and calibrate them using the least squares fitting. Furthermore, we develop an efficient method for the temperature-to-power (T-to-P) mapping, which obtains the power consumption of components by utilizing temperatures of thermal sensors. Experiments show that this work can estimate power profile efficiently for both steady-state and transient results.",
keywords = "power mapping, smartphone, temperature calibration",
author = "Chiou, {Hong Wen} and Lee, {Yu Min} and Hsu, {Shen Chung} and Chen, {Guan Jia} and Pan, {Chi Wen} and Chen, {Tai Yu}",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020 ; Conference date: 21-07-2020 Through 23-07-2020",
year = "2020",
month = jul,
doi = "10.1109/ITherm45881.2020.9190487",
language = "English",
series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",
publisher = "IEEE Computer Society",
pages = "783--789",
booktitle = "Proceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020",
address = "美國",
}