Temperature-Insensitive Soft-Error-Tolerant Flip-Flop Design For Automotive Electronics

Ralf E.H. Yee*, Nicholas Y.J. Su, Lowry P.T. Wang, Charles H.P. Wen, Her-Ming Chiueh

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Many existing soft-error-tolerant flip-flop designs (e.g., MDAD-FF, SETU-TOFF, SEDR-FF) apply delayed latching to mitigate strikes of radiation particles. However, according to AEC-Q100 (Grade 1), automotive electronics are permitted to operate at temperatures between -40°C to 125°C, resulting in two reliability issues: (1) protection failure and (2) timing degradation. At -40°C, these rad-hard FF designs are capable of providing a worst-case delay of only 113 ps, ineffective in protecting against 77-LET particles (which require 200 ps in 45 nm process). At 125°C, however, the performance of these FF designs may degrade to 386 ps, resulting in more timing violations. Therefore, RAV-FF is proposed to address these two issues by incorporating a MOSFET capacitance (MCAP) to generate sufficient delay to delay clock and a current-control transistor (CC) to stabilize delay at different temperature corners. Experimental results indicate that RAV-FF provides effective soft-error protection in the temperature range of -40°C to 125°C by ensuring a delay of at least 200 ps with only 3% variation.

Original languageEnglish
Title of host publicationProceedings - 2024 IEEE 42nd VLSI Test Symposium, VTS 2024
PublisherIEEE Computer Society
ISBN (Electronic)9798350363784
DOIs
StatePublished - 2024
Event42nd IEEE VLSI Test Symposium, VTS 2024 - Tempe, United States
Duration: 22 Apr 202424 Apr 2024

Publication series

NameProceedings of the IEEE VLSI Test Symposium
ISSN (Electronic)2375-1053

Conference

Conference42nd IEEE VLSI Test Symposium, VTS 2024
Country/TerritoryUnited States
CityTempe
Period22/04/2424/04/24

Keywords

  • flip-flop
  • single event transient
  • single event upset
  • soft error

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