System scaling for intelligent ubiquitous computing

Jack Y.C. Sun*

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    3 Scopus citations

    Abstract

    Wafer based 3Dx3D system scaling revolutionizes machine learning (ML) and artificial intelligence (AI) as well as mobile computing. It may trigger a big bang in intelligent ubiquitous computing. 3D CMOS scaling continues with many challenges and opportunities for relentless innovation in materials, processes, devices, circuits, design, EDA, computing architectures, algorithms, and software. 3D stacking and heterogeneous system integration, e.g., CoWoS® and InFO, not only augments but also amplifies the benefits of 3D CMOS logic, 3D memory, integrated specialty technologies and 3D sensors for intelligent ubiquitous computing. The virtuous cycles of 3Dx3D system scaling innovation may expand like a galaxy or universe. The aggregate transistor count in a 3Dx3D sub-system may reach the equivalent of human brain in the 2020s to provide brainlike augmented intelligence.

    Original languageEnglish
    Title of host publication2017 IEEE International Electron Devices Meeting, IEDM 2017
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages1.3.1-1.3.7
    ISBN (Electronic)9781538635599
    DOIs
    StatePublished - 23 Jan 2018
    Event63rd IEEE International Electron Devices Meeting, IEDM 2017 - San Francisco, United States
    Duration: 2 Dec 20176 Dec 2017

    Publication series

    NameTechnical Digest - International Electron Devices Meeting, IEDM
    ISSN (Print)0163-1918

    Conference

    Conference63rd IEEE International Electron Devices Meeting, IEDM 2017
    Country/TerritoryUnited States
    CitySan Francisco
    Period2/12/176/12/17

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