Abstract
A feasible pathway to scale germanium (Ge) FETs in future technology nodes has been proposed using the tunable diamond-shaped Ge nanowire (NW). The Ge NW was obtained through a simple top-down dry etching and blanket Ge epitaxy techniques readily available in mass production. The different etching selectivity of surface orientations for Cl2 and HBr was employed for the three-step isotropic/anisotropic/isotropic dry etching. The ratio of Cl2 and HBr, mask width, and Ge recess depth were crucial for forming the nearly defect-free suspended Ge channel through effective removal of dislocations near the Si/Ge interface. This technique could also be applied for forming diamond-shaped Si NWs. The suspended diamond-shaped NW gate-all-around NWFETs feature excellent electrostatics, the favorable {111} surfaces along the {110} direction with high carrier mobility, and the nearly defect-free Ge channel. The pFET with a high ION/IOFF ratio of 6 × 107 and promising nFET performance have been demonstrated successfully.
Original language | English |
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Article number | 7542120 |
Pages (from-to) | 3837-3843 |
Number of pages | 7 |
Journal | IEEE Transactions on Electron Devices |
Volume | 63 |
Issue number | 10 |
DOIs | |
State | Published - 1 Oct 2016 |
Keywords
- gate-all-around (GAA)
- germanium (Ge)
- isotropic/anisotropic etching
- nanowire (NW)
- {111}