Surface Condition Optimization for Low Temperature Oxide Bonding in 3D Integration

Tzu Heng Hung, Kuan Neng Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

3D integration has become extremely significant while devices keep shrinking the size and minimizing power consumption. At the same time, heterogeneous integration based on 3D integration brings more and more opportunities in current electronic products and applications because of their flexibility and ability to integrate different substrates, functions, devices, and products together. Since 3D integration can be treated as a candidate to extend Moore's Law and a solution to fulfill the concept of "More than Moore". Key technologies of 3D integration are the key to the success. Among the key technologies, oxide bonding can effectively enhance the density of stacking and attract a lot of attention recently.In this invited talk, research results of low temperature oxide bonding of 3D integration will be reviewed and discussed. In order to achieve the best oxide bonding quality, surface condition optimization including the surface roughness and surface oxidation needs to be investigated. With development of oxide bonding technologies and demonstrations, 3D integration shows strong feasibility in next-generation electronic applications. This talk will also present the current oxide bonding advances, as well as current material development.

Original languageEnglish
Title of host publicationProceedings of 2022 IEEE 16th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2022
EditorsFan Ye, Ting-Ao Tang
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665469067
DOIs
StatePublished - 2022
Event16th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2022 - Nanjing, China
Duration: 25 Oct 202228 Oct 2022

Publication series

NameProceedings of 2022 IEEE 16th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2022

Conference

Conference16th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2022
Country/TerritoryChina
CityNanjing
Period25/10/2228/10/22

Fingerprint

Dive into the research topics of 'Surface Condition Optimization for Low Temperature Oxide Bonding in 3D Integration'. Together they form a unique fingerprint.

Cite this