Super-hydrophobic polymer structure for fluidic selfassembly process

C. C. Chiang; Ray-Hua Horng; G. B. Lin; D. S. Wuu

Super-hydrophobic polymer structure for fluidic selfassembly process

C. C. Chiang, Ray-Hua Horng^*, G. B. Lin, D. S. Wuu

^*Corresponding author for this work

Institute of Electronics

Research output: Contribution to conference › Paper › peer-review

Abstract

This study provides a super-hydrophobic patterned polymer structure for fluidic self-assembly process taking insights from the mechanism of lotus effect. By controlling the hydrophobicity of the polymer structure, the solder dipped process can be easily performed on plastic substrate. Beside the binding sites, no solder was coated on the plastic substrate. The contact angle of water on flat SU-8 is just 69°. The contact angle can be increased to 144° by patterning the SU-8. This patterned SU-8 structure ensures that the solder remains on the binding sites throughout the self-assembly process submerged in acidic ethylene glycol. The advantage of super-hydrophobic SU-8 patterns used in fluidic self-assembly process is the combination of geometrical shape recognition and surface energy modification.

Original language	English
Pages	286-289
Number of pages	4
State	Published - Apr 2008
Event	5th Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2008 - Snowbird, UT, United States Duration: 22 Apr 2008 → 25 Apr 2008

Conference

Conference	5th Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2008
Country/Territory	United States
City	Snowbird, UT
Period	22/04/08 → 25/04/08

Cite this

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title = "Super-hydrophobic polymer structure for fluidic selfassembly process",

abstract = "This study provides a super-hydrophobic patterned polymer structure for fluidic self-assembly process taking insights from the mechanism of lotus effect. By controlling the hydrophobicity of the polymer structure, the solder dipped process can be easily performed on plastic substrate. Beside the binding sites, no solder was coated on the plastic substrate. The contact angle of water on flat SU-8 is just 69°. The contact angle can be increased to 144° by patterning the SU-8. This patterned SU-8 structure ensures that the solder remains on the binding sites throughout the self-assembly process submerged in acidic ethylene glycol. The advantage of super-hydrophobic SU-8 patterns used in fluidic self-assembly process is the combination of geometrical shape recognition and surface energy modification.",

author = "Chiang, {C. C.} and Ray-Hua Horng and Lin, {G. B.} and Wuu, {D. S.}",

year = "2008",

month = apr,

language = "English",

pages = "286--289",

note = "5th Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2008 ; Conference date: 22-04-2008 Through 25-04-2008",

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TY - CONF

T1 - Super-hydrophobic polymer structure for fluidic selfassembly process

AU - Chiang, C. C.

AU - Horng, Ray-Hua

AU - Lin, G. B.

AU - Wuu, D. S.

PY - 2008/4

Y1 - 2008/4

N2 - This study provides a super-hydrophobic patterned polymer structure for fluidic self-assembly process taking insights from the mechanism of lotus effect. By controlling the hydrophobicity of the polymer structure, the solder dipped process can be easily performed on plastic substrate. Beside the binding sites, no solder was coated on the plastic substrate. The contact angle of water on flat SU-8 is just 69°. The contact angle can be increased to 144° by patterning the SU-8. This patterned SU-8 structure ensures that the solder remains on the binding sites throughout the self-assembly process submerged in acidic ethylene glycol. The advantage of super-hydrophobic SU-8 patterns used in fluidic self-assembly process is the combination of geometrical shape recognition and surface energy modification.

AB - This study provides a super-hydrophobic patterned polymer structure for fluidic self-assembly process taking insights from the mechanism of lotus effect. By controlling the hydrophobicity of the polymer structure, the solder dipped process can be easily performed on plastic substrate. Beside the binding sites, no solder was coated on the plastic substrate. The contact angle of water on flat SU-8 is just 69°. The contact angle can be increased to 144° by patterning the SU-8. This patterned SU-8 structure ensures that the solder remains on the binding sites throughout the self-assembly process submerged in acidic ethylene glycol. The advantage of super-hydrophobic SU-8 patterns used in fluidic self-assembly process is the combination of geometrical shape recognition and surface energy modification.

UR - http://www.scopus.com/inward/record.url?scp=84874706257&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:84874706257

SP - 286

EP - 289

T2 - 5th Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2008

Y2 - 22 April 2008 through 25 April 2008

ER -

Super-hydrophobic polymer structure for fluidic selfassembly process

Abstract

Conference

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