| Original language | English |
|---|---|
| Patent number | US 8,951,837 B2 |
| State | Published - 10 Feb 2015 |
SUBMICRON CONNECTION LAYER AND METHOD FOR USING THE SAME TO CONNECT WAFERS
Kuan-Neng Chen (Inventor)
Research output: Patent
Kuan-Neng Chen (Inventor)
Research output: Patent
| Original language | English |
|---|---|
| Patent number | US 8,951,837 B2 |
| State | Published - 10 Feb 2015 |