Keyphrases
Electron Beam
100%
Glass Material
100%
Organosilicate Glass
100%
Electron Beam Curing
100%
Methanol
25%
Fourier Transform Infrared Spectroscopy (FT-IR)
25%
Dielectric
25%
Low Dielectric Constant Materials
25%
Low-k Materials
25%
Process Integration
25%
Low-k Dielectric
25%
O2 Plasma
25%
Electrical Analysis
25%
Cross-linked
25%
Ammonium Hydroxide
25%
Semiconductor Fabrication
25%
Wet Chemical Method
25%
Integration Challenges
25%
Plasma Chemical
25%
Curing Process
25%
Glass Film
25%
Dielectric Degradation
25%
Photoresist Stripping
25%
Stripper
25%
Dissolvable
25%
Electron Beam Resist
25%
IC Integration
25%
Methylammonium
25%
Ultralow Dielectric Constant
25%
Terra
25%
Scanning Electron Microscope (SEM) Images
25%
Engineering
Dielectrics
100%
Porosity
100%
Experimental Result
25%
Photoresist
25%
Material Constant
25%
Semiconductor Fabrication
25%
Irradiated Region
25%
Scanning Electron Microscope
25%
FTIR Spectroscopy
25%
Material Science
Glass
100%
Dielectric Material
100%
Film
33%
Permittivity
33%
Scanning Electron Microscopy
33%
Fourier Transform Infrared Spectroscopy
33%
Cure Process
33%