TY - GEN
T1 - Study of self-assembly technology for 3D integration applications
AU - Chang, Hsiao Chun
AU - Fan, Cheng Han
AU - Chou, Yi-Chia
AU - Chen, Kuan-Neng
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/12/23
Y1 - 2015/12/23
N2 - In this paper, the self-assembly technology is investigated in order to apply on the alignment method to achieve rapid and accurate multichip-to-wafer stacking. By virtue of distinct liquid surface tensions between hydrophilic and hydrophobic materials, the hydrophilic chips can be self-aligned to the hydrophilic substrate which is defined by the surrounding hydrophobic substrate. The surface quality of hydrophobic film with self-assembled monolayers (SAMs) based on self-assembled mechanism strongly affects the performance of alignment. The surface quality of SAMs film which depends on experimental parameters such as dip-coating time and heating time is critical to determine the accuracy of alignment. Moreover, the chip shape and size also have an impact on the alignment accuracy. By improving the misalignment, a good design by the self-assembled mechanism for the self-alignment method can be applied in the bonding technology.
AB - In this paper, the self-assembly technology is investigated in order to apply on the alignment method to achieve rapid and accurate multichip-to-wafer stacking. By virtue of distinct liquid surface tensions between hydrophilic and hydrophobic materials, the hydrophilic chips can be self-aligned to the hydrophilic substrate which is defined by the surrounding hydrophobic substrate. The surface quality of hydrophobic film with self-assembled monolayers (SAMs) based on self-assembled mechanism strongly affects the performance of alignment. The surface quality of SAMs film which depends on experimental parameters such as dip-coating time and heating time is critical to determine the accuracy of alignment. Moreover, the chip shape and size also have an impact on the alignment accuracy. By improving the misalignment, a good design by the self-assembled mechanism for the self-alignment method can be applied in the bonding technology.
UR - http://www.scopus.com/inward/record.url?scp=84964292905&partnerID=8YFLogxK
U2 - 10.1109/IMPACT.2015.7365201
DO - 10.1109/IMPACT.2015.7365201
M3 - Conference contribution
AN - SCOPUS:84964292905
T3 - 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
SP - 237
EP - 240
BT - 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015
Y2 - 21 October 2015 through 23 October 2015
ER -