Structural and electrical properties of Ta-Al thin films by magnetron sputtering

Keyphrases

• Electrical Properties 100%
• Structural Properties 100%
• Magnetron Sputtering 100%
• Tantalum 100%
• Aluminum Thin Films 100%
• Resistivity 66%
• Atomic Ratio 66%
• Thermal Cycling 66%
• Thermal Inkjet 66%
• High Stress 33%
• Thermal Stability 33%
• Compressive Stress 33%
• Temperature Behavior 33%
• Mechanical Properties 33%
• Good Stability 33%
• Stress Temperature 33%
• Stability Properties 33%
• Heater 33%
• Device Operation 33%
• Energy Transport 33%
• Al Content 33%
• Stress Increment 33%
• Celsius 33%
• Early Failure 33%
• Resistance Stability 33%
• Stress Behavior 33%
• Thin-film Resistor 33%
• Infinite Reservoir 33%
• Inkjet Devices 33%
• Liquid Pool 33%
• Momentum Transport 33%
• Inkjet Printhead 33%
• Thin-film Heaters 33%

Engineering

• Thin Films 100%
• Magnetron 100%
• Aluminum Composition 66%
• Thermal Cycle 66%
• Stress Level 33%
• Compressive Stress 33%
• Temperature Behavior 33%
• Energy Transport 33%
• Al Content 33%
• Early Failure 33%
• Significant Change 33%
• Film Resistor 33%
• Microsecond 33%
• Degree Celsius 33%
• Liquid Pool 33%
• Printhead 33%
• Momentum Transport 33%

Chemical Engineering

• Magnetron Sputtering 100%
• Film 100%