Standard 0.18um 1P6M CMOS IC foundry flow for accelerometer, analog readout circuit and wafer level capping package integration

C. J. Huang; C. S. Chen; K. A. Wen; Y. T. Cheng; J. Y. Chen; C. S. Chang; W. C. Chou

doi:10.1109/ICSENS.2011.6127313

Standard 0.18um 1P6M CMOS IC foundry flow for accelerometer, analog readout circuit and wafer level capping package integration

C. J. Huang^*, C. S. Chen, K. A. Wen, Y. T. Cheng, J. Y. Chen, C. S. Chang, W. C. Chou

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

The first standard CMOS IC foundry flow is presented for the monolithic integration of MEMS sensor, analog readout circuit and wafer level capping on standard 0.18um 1P6M technology. The sensor and circuit parts are fabricated at first on the same 8'' substrate using a standard 0.18um 1P6M CMOS process. The sensor part is then micromachined and released by a foundry-based post-CMOS DRIE process followed by wafer level capping. The test vehicle for the proposed integration flow contains a single-axial accelerometer, analog readout circuit with input common-mode feedback and QFN64 package. The measurement results show that the whole system can have 206mV/g of sensitivity and output noise is less than 250μg/√Hz. The proposed methodology has led a promising way for integrating MEMS, IC and package in a conventional IC foundry manufacturing flow.

Original language	English
Title of host publication	IEEE Sensors 2011 Conference, SENSORS 2011
Pages	750-753
Number of pages	4
DOIs	https://doi.org/10.1109/ICSENS.2011.6127313
State	Published - 2011
Event	10th IEEE SENSORS Conference 2011, SENSORS 2011 - Limerick, Ireland Duration: 28 Oct 2011 → 31 Oct 2011

Publication series

Name	Proceedings of IEEE Sensors

Conference

Conference	10th IEEE SENSORS Conference 2011, SENSORS 2011
Country/Territory	Ireland
City	Limerick
Period	28/10/11 → 31/10/11

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10.1109/ICSENS.2011.6127313

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Huang, C. J., Chen, C. S., Wen, K. A., Cheng, Y. T., Chen, J. Y., Chang, C. S., & Chou, W. C. (2011). Standard 0.18um 1P6M CMOS IC foundry flow for accelerometer, analog readout circuit and wafer level capping package integration. In IEEE Sensors 2011 Conference, SENSORS 2011 (pp. 750-753). Article 6127313 (Proceedings of IEEE Sensors). https://doi.org/10.1109/ICSENS.2011.6127313

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title = "Standard 0.18um 1P6M CMOS IC foundry flow for accelerometer, analog readout circuit and wafer level capping package integration",

abstract = "The first standard CMOS IC foundry flow is presented for the monolithic integration of MEMS sensor, analog readout circuit and wafer level capping on standard 0.18um 1P6M technology. The sensor and circuit parts are fabricated at first on the same 8'' substrate using a standard 0.18um 1P6M CMOS process. The sensor part is then micromachined and released by a foundry-based post-CMOS DRIE process followed by wafer level capping. The test vehicle for the proposed integration flow contains a single-axial accelerometer, analog readout circuit with input common-mode feedback and QFN64 package. The measurement results show that the whole system can have 206mV/g of sensitivity and output noise is less than 250μg/√Hz. The proposed methodology has led a promising way for integrating MEMS, IC and package in a conventional IC foundry manufacturing flow.",

author = "Huang, {C. J.} and Chen, {C. S.} and Wen, {K. A.} and Cheng, {Y. T.} and Chen, {J. Y.} and Chang, {C. S.} and Chou, {W. C.}",

year = "2011",

doi = "10.1109/ICSENS.2011.6127313",

language = "English",

isbn = "9781424492886",

series = "Proceedings of IEEE Sensors",

pages = "750--753",

booktitle = "IEEE Sensors 2011 Conference, SENSORS 2011",

note = "10th IEEE SENSORS Conference 2011, SENSORS 2011 ; Conference date: 28-10-2011 Through 31-10-2011",

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Huang, CJ, Chen, CS, Wen, KA , Cheng, YT, Chen, JY, Chang, CS & Chou, WC 2011, Standard 0.18um 1P6M CMOS IC foundry flow for accelerometer, analog readout circuit and wafer level capping package integration. in IEEE Sensors 2011 Conference, SENSORS 2011., 6127313, Proceedings of IEEE Sensors, pp. 750-753, 10th IEEE SENSORS Conference 2011, SENSORS 2011, Limerick, Ireland, 28/10/11. https://doi.org/10.1109/ICSENS.2011.6127313

Standard 0.18um 1P6M CMOS IC foundry flow for accelerometer, analog readout circuit and wafer level capping package integration. / Huang, C. J.; Chen, C. S.; Wen, K. A. et al.
IEEE Sensors 2011 Conference, SENSORS 2011. 2011. p. 750-753 6127313 (Proceedings of IEEE Sensors).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - The first standard CMOS IC foundry flow is presented for the monolithic integration of MEMS sensor, analog readout circuit and wafer level capping on standard 0.18um 1P6M technology. The sensor and circuit parts are fabricated at first on the same 8'' substrate using a standard 0.18um 1P6M CMOS process. The sensor part is then micromachined and released by a foundry-based post-CMOS DRIE process followed by wafer level capping. The test vehicle for the proposed integration flow contains a single-axial accelerometer, analog readout circuit with input common-mode feedback and QFN64 package. The measurement results show that the whole system can have 206mV/g of sensitivity and output noise is less than 250μg/√Hz. The proposed methodology has led a promising way for integrating MEMS, IC and package in a conventional IC foundry manufacturing flow.

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Standard 0.18um 1P6M CMOS IC foundry flow for accelerometer, analog readout circuit and wafer level capping package integration

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