Simulation of three-dimensional copper-low-□ interconnections with different shapes

Yi-Ming Li*, Jam Wem Lee, Hong Mu Chou

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

The geometry dependent RC time constant was studied for optimizing Cu-low-κ interconnects. Three simulated structures with cylindrical (CL), square (SQ) and rectangular (RE) shaped wires were fabricated for the study. Metal lines with different length and spacing in realistic IC manufacturing were also examined. It was found that the extracted C decreases with respect to the line space and RE structure has the lowest RC delay for the line width<110 nm. The results show that the Cu-low-κ process can be subjected to further adjustment for minimizing unwanted time delay.

Original languageEnglish
Title of host publication2004 10th International Workshop on Computational Electronics, IEEE IWCE-10 2004, Abstracts
Pages165-166
Number of pages2
DOIs
StatePublished - 24 Oct 2004
Event2004 10th International Workshop on Computational Electronics: The Field of Computational Electronics - Looking Back and Looking Ahead, IEEE IWCE-10 2004, Abstracts - West Lafayette, IN, United States
Duration: 24 Oct 200427 Oct 2004

Publication series

Name2004 10th International Workshop on Computational Electronics, IEEE IWCE-10 2004, Abstracts

Conference

Conference2004 10th International Workshop on Computational Electronics: The Field of Computational Electronics - Looking Back and Looking Ahead, IEEE IWCE-10 2004, Abstracts
Country/TerritoryUnited States
CityWest Lafayette, IN
Period24/10/0427/10/04

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