Semiconductor innovation into the next decade

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    2 Scopus citations

    Abstract

    Semiconductor innovation through a new paradigm of 3D×3D System Scaling can carry the industry into the next decade. Besides the internet of things (IoT), cloud computing, and big data analytics, we can imagine a bionic age emerging with digitally-enhanced or semiconductor-augmented vision, hearing, limbs, and many other capabilities, such as cognitive computing, universal translators, and brain wave interfaces/communications. It is important to leverage the silicon platform and be part of a symbiotic ecosystem, such as TSMC's Grand Alliance and OIP platform, to enjoy the benefits of the economies of scale and collective innovation power.

    Original languageEnglish
    Title of host publication2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages117-120
    Number of pages4
    ISBN (Electronic)9781479940905
    DOIs
    StatePublished - 13 Jan 2015
    Event2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014 - Kaohsiung, Taiwan
    Duration: 10 Nov 201412 Nov 2014

    Publication series

    Name2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers

    Conference

    Conference2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014
    Country/TerritoryTaiwan
    CityKaohsiung
    Period10/11/1412/11/14

    Keywords

    • 3DIC
    • CMOS
    • CoWoS
    • ecosystem
    • foundry
    • InFO
    • IoT
    • Moore's Law
    • platform
    • sensor
    • system scaling

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