Scheme for Multi-Chiplet Integration with Low Thermal Budget by Asymmetric Cu-Cu Bonding with Au Passivation Bonding Structure

Zhong Jie Hong, Ming Wei Weng, Chih Han Chen, Mu Ping Hsu, Han Wen Hu, Tai Yu Lin, Ying Chan Hung, Kuan Neng Chen

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Engineering & Materials Science

Chemical Compounds